Patents-Review.com
ClassID:

234906 ⎘

H05K2203/143 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Related to the order of processing steps Treating holes before another process, e.g. coating holes before coating the substrate

Recent Application in this class:
#1
20250338398
2025-10-30

SYSTEMS, METHODS, AND DEVICES FOR PRODUCING DEFORMABLE ELECTRONIC DEVICES HAVING DEFORMABLE INTERCONNECTS

 #2
20250220823
2025-07-03

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH AN EMBEDDED SHIELD

 #3
20250212337
2025-06-26

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTERING FUNCTION, AND MANUFACTURING METHOD OF SAME

 #4
20250089167
2025-03-13

WIRING SUBSTRATE

 #5
20250048562
2025-02-06

WIRING SUBSTRATE

 #6
20240334613
2024-10-03

Component Carrier and Method Manufacturing the Same

 #7
20230309240
2023-09-28

Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of same

 #8
20230121285
2023-04-20

PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONIC DEVICE INCLUDING THE SAME

 #9
20230081618
2023-03-16

Connection method for chip and circuit board, and circuit board assembly and electronic device

 #10
20230069980
2023-03-09

METHOD FOR MANUFACTURING WIRING SUBSTRATE

 #11
20230030601
2023-02-02

Method for manufacturing printed wiring board

 #12
20220400557
2022-12-15

Compliant pin surface mount technology pad for rework

 #13
20210407896
2021-12-30

Hermetic metallized via with improved reliability

 #14
20200165160
2020-05-28

Hermetic metallized via with improved reliability

 #15
20190327840
2019-10-24

3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESION BETWEEN COPPER AND GLASS SURFACES AND ARTICLES THEREFROM

 #16
20190313524
2019-10-10

Hermetic metallized via with improved reliability

 #17
20190172782
2019-06-06

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND METHOD

 #18
20180098438
2018-04-05

Implementing backdrilling elimination utilizing anti-electroplate coating

 #19
20180027666
2018-01-25

Implementing backdrilling elimination utilizing anti-electroplate coating

 #20
20180027665
2018-01-25

Implementing backdrilling elimination utilizing anti-electroplate coating

 #21
20160174360
2016-06-16

Signal transmission board and method for manufacturing the same

 #22
20160141237
2016-05-19

Three dimensional organic or glass interposer

 #23
20160128201
2016-05-05

Method for forming vias on printed circuit boards

 #24
20160120040
2016-04-28

Fabrication of intra-structure conductive traces and interconnects for three-dimensional manufactured structures

 #25
20150282333
2015-10-01

Method of manufacturing a multilayer substrate structure for fine line

 #26
20150096173
2015-04-09

Method for constructing an external circuit structure