H05K2203/1536 - CPC Classification Index

#1

20240147634

2024-05-02

Printed circuit board

#2

20220157773

2022-05-19

Pressure sintering device and method for manufacturing an electronic component

#3

20210257207

2021-08-19

SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND METHOD FOR MANUFACTURING A PACKAGE SUBSTRATE FOR MOUNTING A SEMICONDUCTOR DEVICE

#4

20200113066

2020-04-09

Wiring board manufacturing method

#5

20190181000

2019-06-13

Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor device

#6

20180255650

2018-09-06

Component carriers sandwiching a sacrificial structure and having pure dielectric layers next to the sacrificial structure

#7

20180255649

2018-09-06

Sacrificial structure with dummy core and two sections of separate material thereon for manufacturing component carriers

#8

20170079145

2017-03-16

Semi-finished product for the production of connection systems for electronic components and method

#9

20160316568

2016-10-27

Metal substrate and method of manufacturing the same

#10

20160120060

2016-04-28

Printed circuit board, electronic module and method of manufacturing the same

#11

20160113120

2016-04-21

Method for manufacturing printed wiring board

#12

20160113114

2016-04-21

Carrier substrate

#13

20160105967

2016-04-14

Embedded board and method of manufacturing the same

#14

20150289374

2015-10-08

Connector

#15

20150282314

2015-10-01

Method for manufacturing printed wiring board with conductive post and printed wiring board with conductive post

#16

20150257253

2015-09-10

Peelable metal substrate having modified surface and method of manufacturing the same

#17

20150221608

2015-08-06

Pad-less interconnect for electrical coreless substrate

#18

20150195917

2015-07-09

Core substrate and method for fabricating circuit board

#19

20150163908

2015-06-11

Circuit board and manufacturing method thereof

#20

20150129293

2015-05-14

Printed circuit board and method of manufacturing the same

#21

20150124423

2015-05-07

Method of manufacturing circuit board, method of manufacturing electronic device, and electronic device

#22

20150090476

2015-04-02

Package carrier and manufacturing method thereof

#23

20150041428

2015-02-12

Methods of manufacturing printed circuit boards with stacked micro vias

#24

20150034374

2015-02-05

Printed wiring board and method for manufacturing printed wiring board

#25

20150024552

2015-01-22

Substrate, chip package and method for manufacturing substrate

#26

20150021084

2015-01-22

Copper clad laminate, printed circuit board, and method of manufacturing the same

#27

20150016079

2015-01-15

Printed wiring board

#28

20150014849

2015-01-15

Coreless package structure and method for manufacturing same

#29

20150003000

2015-01-01

Method of forming molded panel embedded die structure

#30

20140345125

2014-11-27

Method of fabricating packaging substrate having a passive element embedded therein

#31

20140332253

2014-11-13

Carrier substrate and manufacturing method thereof

#32

20140175672

2014-06-26

Hybrid substrate with high density and low density substrate areas, and method of manufacturing the same

#33

20140174810

2014-06-26

Printed circuit board and method of manufacturing the same

#34

20140174644

2014-06-26

Fabrication method of packaging substrate

#35

20140090879

2014-04-03

Embedded architecture using resin coated copper

#36

20140083858

2014-03-27

Heterogeneous integration of microfluidic devices in package structures

#37

20140027156

2014-01-30

MULTILAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#38

20130235543

2013-09-12

Wiring board and semiconductor device

#39

20130219712

2013-08-29

Method of manufacturing multilayer wiring board

#40

20130180766

2013-07-18

Printed circuit board and method for manufacturing the same

#41

20130160290

2013-06-27

Method of manufacturing multi-layer wiring board

#42

20130146336

2013-06-13

Packaging substrate and fabrication method thereof

#43

20130111746

2013-05-09

METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE

#44

20130062112

2013-03-14

FABRICATION METHOD FOR CARRIER SUBSTRATE, PRINTED CIRCUIT BOARD USING THE SAME, AND FABRICATION METHOD THEREOF

#45

20120328857

2012-12-27

Printed wiring board and method for manufacturing printed wiring board

#46

20120293973

2012-11-22

Multilayered wiring board and method for fabricating the same

#47

20120280022

2012-11-08

Manufacturing method of circuit substrate

#48

20120279630

2012-11-08

Manufacturing method of circuit substrate

#49

20120241206

2012-09-27

Method of manufacturing circuit board, method of manufacturing electronic device, and electronic device

#50

20120227258

2012-09-13

INSULATING LAYER FOR RIGID PRINTED CIRCUIT BOARDS

#51

20120211464

2012-08-23

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING METAL BUMP

#52

20120205039

2012-08-16

Method for manufacturing multilayer wiring substrate

#53

20120199388

2012-08-09

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

#54

20120181072

2012-07-19

Printed wiring board and method for manufacturing same

#55

20120174394

2012-07-12

METHOD FOR MANUFACTURING MULTILAYER CIRCUIT BOARD

#56

20120097429

2012-04-26

Package substrate and fabrication method thereof

#57

20120079716

2012-04-05

Method of manufacturing printed circuit board

#58

20120073871

2012-03-29

MULTI-LAYERED SUBSTRATE

#59

20120073865

2012-03-29

CARRIER MEMBER FOR TRANSMITTING CIRCUITS, CORELESS PRINTED CIRCUIT BOARD USING THE CARRIER MEMBER, AND METHOD OF MANUFACTURING THE SAME

#60

20120037404

2012-02-16

Packaging substrate having a passive element embedded therein and method of fabricating the same

#61

20120033394

2012-02-09

Embedded component package structure

#62

20120006478

2012-01-12

Fabricating method of circuit board

#63

20110318480

2011-12-29

Method of manufacturing substrate using a carrier

#64

20110317383

2011-12-29

Mold compounds in improved embedded-die coreless substrates, and processes of forming same

#65

20110315745

2011-12-29

CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME

#66

20110308845

2011-12-22

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#67

20110302779

2011-12-15

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

#68

20110296681

2011-12-08

Printed wiring board and method for manufacturing same

#69

20110296679

2011-12-08

Method of manufacturing wiring board

#70

20110286189

2011-11-24

Method of fabricating wiring board and method of fabricating semiconductor device

#71

20110277322

2011-11-17

Method of manufacturing wiring board

#72

20110274866

2011-11-10

INNER SUBSTRATE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS

#73

20110274829

2011-11-10

Method for producing a flexible circuit configuration

#74

20110253439

2011-10-20

CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

#75

20110252640

2011-10-20

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

#76

20110247212

2011-10-13

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

#77

20110209344

2011-09-01

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

#78

20110159282

2011-06-30

Carrier for manufacturing substrate and method of manufacturing substrate using the same

#79

20110155429

2011-06-30

Carrier substrate, fabrication method thereof, printed circuit board using the same, and fabrication method thereof

#80

20110154658

2011-06-30

CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

#81

20110154657

2011-06-30

Manufacturing method of package carrier

#82

20110139858

2011-06-16

CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME

#83

20110138622

2011-06-16

DRILL AND METHOD OF PRODUCING PRINTED WIRING BOARD

#84

20110108310

2011-05-12

Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring board

#85

20110079349

2011-04-07

Method of manufacturing printed circuit board

#86

20110061912

2011-03-17

Printed circuit board and manufacturing method thereof

#87

20110061231

2011-03-17

Method of manufacturing printed circuit board

#88

20110057324

2011-03-10

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

#89

20110041330

2011-02-24

Methods of manufacturing printed circuit boards with stacked micro vias

#90

20110034022

2011-02-10

Semiconductor package and fabrication method

#91

20110030209

2011-02-10

Method for fabricating thin touch sensor panels

#92

20110024180

2011-02-03

Method of fabricating a printed circuit board

#93

20110000706

2011-01-06

Multilayer wiring substrate

#94

20110000704

2011-01-06

Method of manufacturing printed circuit board

#95

20100319966

2010-12-23

Packaging substrate and fabrication method thereof

#96

20100289132

2010-11-18

SUBSTRATE HAVING EMBEDDED SINGLE PATTERNED METAL LAYER, AND PACKAGE APPLIED WITH THE SAME, AND METHODS OF MANUFACTURING OF THE SUBSTRATE AND PACKAGE

#97

20100288549

2010-11-18

Method for manufacturing a coreless packaging substrate

#98

20100232127

2010-09-16

WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE WIRING BOARD COMPOSITE BODY AND THE SEMICONDUCTOR DEVICE

#99

20100175249

2010-07-15

Method for fabricating thin touch sensor panels

#100

20100147795

2010-06-17

METHOD FOR THE SELECTIVE SURFACE TREATMENT OF NON-FLAT WORKPIECES

#101

20100147559

2010-06-17

Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier

#102

20100140100

2010-06-10

MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

#103

20100139969

2010-06-10

Printed circuit board comprising metal bump and method of manufacturing the same

#104

20100139966

2010-06-10

INNER SUBSTRATE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS

#105

20100139965

2010-06-10

Manufacturing method of embedded circuit substrate

#106

20100132997

2010-06-03

MULTILAYER WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

#107

20100096078

2010-04-22

Method of manufacturing wiring substrate

#108

20100055392

2010-03-04

Method of fabricating multi-layered substrate

#109

20100051322

2010-03-04

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD

#110

20100025093

2010-02-04

Multilayered circuit board and semiconductor device

#111

20100018638

2010-01-28

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

#112

20090314519

2009-12-24

Processes of making pad-less interconnect for electrical coreless substrate

#113

20090260866

2009-10-22

Method of manufacturing a wiring board

#114

20090250259

2009-10-08

Multilayered printed circuit board and method of manufacturing the same

#115

20090242261

2009-10-01

Printed wiring board

#116

20090236135

2009-09-24

Multilayer wiring substrate with a reinforcing layer for preventing a warp

#117

20090236125

2009-09-24

Method of manufacturing a multi-layer board

#118

20090224399

2009-09-10

Silicon nitride substrate, method of manufacturing the same, and silicon nitride circuit board and semiconductor module using the same

#119

20090183909

2009-07-23

Coreless substrate

#120

20090178274

2009-07-16

Methods of manufacturing printed circuit boards with stacked micro vias

#121

20090173531

2009-07-09

Method of manufacturing a printed circuit board

#122

20090169837

2009-07-02

Method of manufacturing a package substrate

#123

20090162974

2009-06-25

Semiconductor package board using a metal base

#124

20090151989

2009-06-18

Insulating layer for rigid printed circuit boards

#125

20090078451

2009-03-26

Printed wiring board and method for manufacturing same

#126

20090053487

2009-02-26

CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

#127

20090038836

2009-02-12

Wiring board and method of manufacturing wiring board

#128

20090032289

2009-02-05

Circuit board having two or more planar sections

#129

20090020326

2009-01-22

Stacked wiring board and method of manufacturing stacked wiring board

#130

20090020317

2009-01-22

Wiring board and method of manufacturing wiring board

#131

20090013526

2009-01-15

Method for manufacturing multilayer printed circuit boards using inner substrate

#132

20090011220

2009-01-08

Carrier and method for manufacturing printed circuit board

#133

20090008141

2009-01-08

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

#134

20080289868

2008-11-27

CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING CONNECTION BOARD, AND MANUFACTURING METHOD THEREOF

#135

20080283287

2008-11-20

Wiring board and method of manufacturing wiring board

#136

20080283276

2008-11-20

Wiring board and method of manufacturing wiring board

#137

20080280032

2008-11-13

Process of embedded circuit structure

#138

20080264684

2008-10-30

Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same

#139

20080257472

2008-10-23

METHOD FOR MANUFACTURING CERAMIC PLATES

#140

20080244885

2008-10-09

Method for forming a capacitor having a copper electrode and a high surface area aluminum inner layer

#141

20080241361

2008-10-02

Printed circuit board manufacturing method

#142

20080202661

2008-08-28

Method of manufacturing wiring substrate and method of manufacturing electronic component device

#143

20080169568

2008-07-17

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

#144

20080142256

2008-06-19

Wiring board manufacturing method

#145

20080136041

2008-06-12

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

#146

20080115963

2008-05-22

Flexible printed wiring board

#147

20080073025

2008-03-27

Method of manufacturing copper-clad laminate for VOP application

#148

20080034581

2008-02-14

Method for manufacturing printed circuit board

#149

20080032155

2008-02-07

DRILL STACK FORMATION

#150

20080010819

2008-01-17

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

#151

20070289704

2007-12-20

Process for producing circuit board

#152

20070289128

2007-12-20

Process for producing circuit board

#153

20070274060

2007-11-29

Wiring board, semiconductor device, and method for manufacturing wiring board

#154

20070246254

2007-10-25

Methods of manufacturing printed circuit boards with stacked micro vias

#155

20070245551

2007-10-25

Method of manufacturing coreless substrate

#156

20070227766

2007-10-04

Drill and method of producing printed circuit board

#157

20070227329

2007-10-04

METHOD OF MANUFACTURING INDUSTRIAL COMPONENT HAVING THROUGH HOLES WITH HIGH ASPECT RATIO

#158

20070193679

2007-08-23

Printed wiring board manufacturing method

#159

20070190237

2007-08-16

Method of manufacturing a wiring substrate

#160

20070169600

2007-07-26

METHOD AND STRUCTURE TO ENABLE FINE GRID MLC TECHNOLOGY

#161

20070143992

2007-06-28

METHOD FOR MANUFACTURING WIRING BOARD

#162

20070130762

2007-06-14

Circuit substrate manufacturing method

#163

20070124925

2007-06-07

Method of manufacturing wiring substrate

#164

20070124924

2007-06-07

Method of manufacturing wiring substrate and method of manufacturing electronic component mounting structure

#165

20070119619

2007-05-31

Multilayered wiring board and method for fabricating the same

#166

20070111559

2007-05-17

Multiple flexible wiring board, method for producing same, method for producing flexible wiring board, and flexible wiring board

#167

20070084630

2007-04-19

Coreless substrate and manufacturing method thereof

#168

20060270211

2006-11-30

Method of fabricating wiring board and method of fabricating semiconductor device

#169

20060244137

2006-11-02

Semiconductor package board using a metal base

#170

20060162956

2006-07-27

Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them

#171

20060148126

2006-07-06

Method for manufacturing printed wiring board

#172

20060131730

2006-06-22

Semiconductor package having connecting bumps

#173

20060121256

2006-06-08

Method of fabricating printed circuit board having thin core layer

#174

20060112544

2006-06-01

Wiring board manufacturing method

#175

20060102383

2006-05-18

Method of fabricating high density printed circuit board

#176

20060099728

2006-05-11

Method of manufacturing a substrate structure for increasing cutting precision and strength thereof

#177

20060068613

2006-03-30

Flexible printed wiring board

#178

20060035407

2006-02-16

Semiconductor substrate structure and processing method thereof

#179

20060035406

2006-02-16

METHOD OF FORMING A COMPOSITE POLYMER MATERIAL INSIDE TRENCHES OF A SEMICONDUCTOR SUBSTRATE TO FORM A COMPOSITE POLYMER STRUCTURE

#180

20060000718

2006-01-05

Substrate plating methods and apparatus

#181

20050155222

2005-07-21

Circuit substrate manufacturing method

#182

20050098875

2005-05-12

Semiconductor package board using a metal base

#183

20050098347

2005-05-12

Multi-layer printed circuit board and fabricating method thereof

#184

20050095748

2005-05-05

Method for the selective surface treatment of planar workpieces

#185

20050087860

2005-04-28

Multilayered substrate for semiconductor device

#186

20050023030

2005-02-03

Printed circuit board with a heat dissipation element and package comprising the printed circuit board