Semiconductor memory arrangement

SMALL-SIZED COMMUNICATION MODULE PACKAGE

Semiconductor device and a method of manufacturing the same

Composite substrate and method for manufacturing composite substrate

Composite ceramic substrate

Process of embedded circuit structure

Die module system

Memory module system and method

Flexible printed circuit

PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS

LIGHT SOURCE MODULE

Electronic device having power connection interface

Printed wiring board and a method of production thereof

Stacked package module and board having exposed ends

Printed circuit board, circuit component and electronic apparatus

Chip package module

Touch panel

TAB WRAP FOLDABLE ELECTRONIC ASSEMBLY MODULE AND METHOD OF MANUFACTURE

IC card and method of manufacturing the same

Method of forming flexible electronic circuits

Flexible wiring cable

Working panel for multilayer printed circuit board

High-frequency module

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MEMORY MODULE USING THE SAME

Method for producing a printed circuit board with a heat radiating structure and a printed circuit board with a heat radiating structure

Circuit module and circuit device including circuit module

Electronic device with flip module having low height

SEMICONDUCTOR MODULES WITH ENHANCED JOINT RELIABILITY

MODULE

Double-sided touch sensitive panel and flex circuit bonding

Memory module for improving impact resistance

High capacity memory module using flexible substrate

METHODS AND APPARATUS FOR MULTICHIP MODULE PACKAGING

Electrical connector

Printed circuit board and semiconductor memory module using the same

Backlighting apparatus and manufacturing process

Interconnect assemblies, and methods of forming interconnects

Interconnect assemblies, and methods of forming interconnects, between conductive contact bumps and conductive contact pads

Sensor node and circuit board arrangement

Electronic apparatus, flexible board and board fixing member

Multi-layer electronic part built-in board

SWITCH CHASSIS

Method of making circuitized substrate with solder paste connections

Multi-configuration processor-memory substrate device

Combined heat sink multi-configuration processor memory substrate device

High capacity thin module system

Electronic circuit arrangement for control purposes

Method of making wired circuit board holding sheet

Wiring board and semiconductor device

Printed wiring board reliably achieving electric connection with electronic component

Memory card and method of manufacturing the same

Circuit board arrangement and method for producing a circuit board arrangement

DEVICE DESIGN SUPPORTING METHOD, PROGRAM, AND SYSTEM

Electronic controller

Memory module decoder

Resin wiring substrate, and semiconductor device and laminated semiconductor device using the same

Interchangeable connection arrays for double-sided DIMM placement

Electronic device

Sensor substrate and method of fabricating same

Sub-mezzanine structure for printed circuit card assemblies

Components, methods and assemblies for stacked packages

Metal plating process

Electronic Module And Method For The Production Thereof

High capacity thin module system and method

High capacity thin module system and method

Memory module having improved arrangement of discrete devices

Flip-chip package substrate and a method for fabricating the same

Differential electrical connector assembly

Anchoring member to facilitate fastening daughter boards to a mother board and a method for use

Buried pattern substrate and manufacturing method thereof

Memory supermodule utilizing point to point serial data links

Substrate-imprinting methods

Method and apparatus for electrically coupling a component to an information handling system

Printed circuit board for package of electronic components and manufacturing method thereof

Printed wiring board, its bending method, and electronic apparatus

Circuit board arrangement

Apparatus for making circuitized substrates in a continuous manner

Memory module and methods for making and using the same

Split core circuit module

Electronic module interconnection apparatus

Reversible universal serial bus connection interface for USB connectors and universal serial bus ports

Multilayer printed wiring board and component mounting method thereof

Cable assembly with light emitting diode

Bridge modules for connecting plural groups of electronic modules

HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Memory module, method of manufacturing a memory module and computer system

Apparatus and method for distributing a liquid onto a surface of an item

Electric power steering apparatus

Connection configuration for rigid substrates

Method for making a multilayered circuitized substrate

Remote ID resistor assembly for wiring harness

High density flexible wiring board

Electronic circuit module and method for fabrication thereof

Doubled-sided pluggable backplane

Composite core circuit module system and method

Multilayer printed circuit board and manufacturing method thereof

Components, methods and assemblies for multi-chip packages

Flexible substrate having interlaminar junctions, and process for producing the same

Midplane especially applicable to an orthogonal architecture electronic system

Process and an apparatus for coating printed circuit boards with laser-structurable, thermally curable solder stop lacquers and electroresists

METHODS AND APPARATUSES FOR IMPRINTING SUBSTRATES

Package module with alignment structure and electronic device with the same

Flexible printed circuit connector, flexible printed circuit inserted into the same, and display device having the same, and method thereof

High performance edge connector

Thin electronic circuit device

Memory Module System and Method

Memory Module System and Method

Method for fabricating core substrate using paste bumps

Multilayer circuit board and method for manufacturing the same

Resin application method on panel, manufacturing method of panel for display and resin applying apparatus thereof

Thin module system and method

Buffered Thin Module System and Method

Handling of flexible planar material

Stacking method and stacked structure for attaching memory components to associated device

Soldering method

Methods and apparatus for assembling a printed circuit board

Edge connector including internal layer contact, printed circuit board and electronic module incorporating same

Control unit of oven

Semiconductor module including a plurality of IC chips therein

Contact member, connector, substrate and contact system

Circuit substrate

Key sheet module

Semiconductor memory device and USB memory device using the same

Multilayered wiring substrate and manufacturing method thereof

Module, method of manufacturing module, and electronic apparatus using module

Circuit board and circuit apparatus using the same

Fractional turns transformers with ferrite polymer core

Method of forming metal plate pattern and circuit board

Memory module, memory extension memory module, memory module system, and method for manufacturing a memory module

Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces

Board assembly apparatus having electronic components disposed in a space between circuit boards and a manufacturing method thereof

Circuit board and arrangement for minimizing thermal and electromagnetic effects

Printed circuit board with integrated inductor

Ultra-thin flexible inductor

SACRIFICIAL COMPONENT

Method for manufacturing a midplane

Differential electrical connector assembly

System for connecting a camera module, or like device, using flat flex cables

Electronic package structures and methods

Heating apparatus

Non-uniform decoupling capacitor distribution for uniform noise reduction across chip

Memory-module board layout for use with memory chips of different data widths

Memory module with a circuit providing load isolation and memory domain translation

Computer memory cards using flash EEprom integrated circuit chips and memory-controller systems

Memory module system and method

Method of making electrical connector on a flexible carrier

Modular integrated circuit chip carrier

Microreplicated article

System component interposer

Miniaturized multi-chip module and method for manufacturing the same

Apparatus and method for making circuitized substrates in a continuous manner

Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner

Reflow soldering method using Pb-free solder alloy and hybrid packaging method and structure

Methods for making laminated member for circuit board, making circuit board and laminating flexible film

Printed wiring board and information processing apparatus

Flexible circuit board

IC card and method of manufacturing the same

Apparatus and method for producing two-sided patterned web in registration

Memory module system and method

Digital wireless narrow band radio

Modified core for circuit module system and method

Thermal management apparatus and method for a circuit substrate

Edge connector including internal layer contact, printed circuit board and electronic module incorporating same

Surface-mounting type electronic circuit unit without detachment of solder

Semiconductor memory module for improvement of signal integrity

Circuit board for reducing crosstalk of signals

Electronic control unit and method thereof

Semiconductor device and method of manufacturing the same

Exposing machine for a printed circuit board

Single pass, dual thickness electroplating system for head suspension components

Double-sided flexible printed circuits

Method for making a semiconductor multipackage module including a processor and memory package assemblies

Method of electroplating a workpiece having high-aspect ratio holes

Double-sided component-mounted circuit board and method for manufacturing the same

Electronic module for system board with pass-thru holes

Processor module for system board

Multi-chip module with power system and pass-thru holes

Method of mounting memory device on PCB for memory module

Flex circuit constructions for high capacity circuit module systems and methods

Solder reflow system and method thereof

Parallel multilayer printed circuit board having interlayer conductivity due to via ports and method of fabricating same

Methods for assembling a stack package for high density integrated circuits

Stack package for high density integrated circuits

Electrical connector on a flexible carrier

Method of making a printed circuit board

Land grid array module

High capacity thin module system

Circuit module with thermal casing systems

Integrated structure with CPU and north bridge chip

Wiring board and wiring board manufacturing method

Memory module decoder

Electronic control unit and electric pump

IC card and method of manufacturing the same

Thin module system and method

Method for fabricating conductive bump of circuit board

Die module system

Buffered thin module system and method

Thin module system and method

Thin module system and method

Optimized mounting area circuit module system and method

High capacity thin module system and method

Thin module system and method with thermal management

Thin module system and method with skew reduction

Module thermal management system and method

Thin module system and method

Minimized profile circuit module systems and methods

Compact optical transceiver module

Dual-stacked 10 Gigabit X2 uplinks in a single rack unit switch

Method of mounting terminal on printed board, terminal mounted printed board and electric connection box accommodating the terminal mounted printed board, which are formed by the method

Substrate for producing semiconductor packages

Circuit board with SMD-components and at least one wired component, and a method for populating, securing and electrical contacting of the components

Methods and apparatuses for imprinting substrates

Midplane especially applicable to an orthogonal architecture electronic system

Differential electrical connector assembly

Wiring board and method of manufacturing wiring board

Process of fabricating conductive column

Make-before-break ADSL/VDSL splitter card

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

System and method for dissipating heat from a semiconductor module

System and method for providing a flash memory assembly

Method for fastening microtool components to objects

Method for production of semiconductor package

Thermally improved placement of power-dissipating components onto a circuit board

Circuit assembly for battery pack or the like, and method of making the same

SDIO memory and interface card

Board mounting method and mounting structure

Flexible printed circuits with many tiny holes

Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems

Semiconductor device package having buffered memory module and method thereof

High-density connection between multiple circuit boards

Sacrificial component

Flexible printed circuits with many tiny holes

Machine for exposing printed circuit panels with gas balloons and mechanical spacers

Circuit module

Flexible substrate having interlaminar junctions, and process for producing the same

Sensor node and circuit board arrangement

Printing apparatus and method for bonding material

Interchangeable connection arrays for double-sided memory module placement

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

Circuit board component ambient moisture exposure monitoring

Process and apparatus for manufacturing printed circuit boards

Stereoscopic electronic circuit device, and relay board and relay frame used therein

Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate

Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method

Substrate treating apparatus and method

Circuit board device for information apparatus, multilayered module board and navigation system

Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel

Flexible circuit with cover layer

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

Electronic circuit unit and method of fabricating the same

Wired circuit board holding sheet and production method thereof

Bus bar substrate for vehicle interior light

Optical data link

Manufacture having double sided features in a metal-containing web and manufacture and method for forming same in a liquid-based etch process

Electronic device having adapter and connection method thereof

Manufacturing methods for printed circuit boards

Electronic circuit unit with semiconductor components disposed on both surfaces of board

Method for manufacturing a sequential backplane

Stacked memory, memory module and memory system

Method and system for non-vascular sensor implantation

Circuit and system for accessing memory modules

Soldering method and solder joint member

Hybrid integrated circuit device and method of manufacturing the same

Electrical connector

Interposer

Printed wiring board, electronic component mounting method, and electronic apparatus