PRESSURE-SENSITIVE ADHESIVE SHEET AND LAMINATE

CIRCUIT ARRANGEMENT AND ASSOCIATED CONTROLLER FOR A MOTOR VEHICLE

Electronic control unit and method of manufacturing the same

Hybrid solid state emitter printed circuit board for use in a solid state directional lamp

Method of producing an enhanced base plate

CIRCUIT BOARD AND RADIATING HEAT SYSTEM FOR CIRCUIT BOARD

PACKAGE CARRIER AND PACKAGE STRUCTURE

Fluid-cooled module for integrated circuit devices

Systems for circuit board heat transfer and method of assembling same

CIRCUIT BOARD AND RADIATING HEAT SYSTEM FOR CIRCUIT BOARD

Mounting arrangement and method for light emitting diodes

Package carrier and manufacturing method thereof

Heat radiating printed circuit board and chassis assembly having the same

Electronic power module, and method for manufacturing said module

Heat radiating printed circuit board and chassis assembly having the same

Light-source circuit unit, illumination device, and display device

Illumination device and display device

Mounting structure for solid state light sources

THREE DIMENSIONAL LIGHT EMITTING DIODE SYSTEMS, AND COMPOSITIONS AND METHODS RELATING THERETO

Power module for an automobile

Three dimensional light emitting diode systems, and compositions and methods relating thereto

LED mounting substrate

Illumination device with semiconductor light-emitting elements

Circuit assemblies including thermoelectric modules

Systems and methods providing thermal spreading for an LED module

Printed circuit board

Packaging photon building blocks having only top side connections in an interconnect structure

LIGHT SOURCE MODULE

Layered structure for use with high power light emitting diode systems

System and method for integrated waveguide packaging

Light emitting module

Heat sink retaining structure for light emitting device board assemblies, and methods

SEMICONDUCTOR DEVICE

Bendable luminous modules and method for producing bendable luminous modules

ELECTRONIC APPARATUS, METHOD FOR MOUNTING A DEVICE, AND OPTICAL COMMUNICATION APPARATUS

Double-Sided Pressure-Sensitive Adhesive Tape or Sheet For Use In Wiring Circuit Board And Wiring Circuit Board Having The Double-Sided Pressure-Sensitive Ahesive Tape

LED PACKAGE WITH STEPPED APERTURE

Method for producing lamps

Lighting device, display device and television receiver

LED heat-conducting substrate and its thermal module

Electrically conductive plug arranged in a gap between two adjacent circuit boards to connect the circuit boards to an electromagnetic shield

Illumination system, electro-optic device, and electronic apparatus

LED luminaire

Electronic part and connection structure of the electronic part

Electronic package structure

Method of producing wiring substrate

Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding

Light source device and display device provided with same

Thermal interface material application for integrated circuit cooling

LIGHT-EMITTING DIODE PACKAGE

Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material

LED unit

ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT

ELECTRONICS SUBSTRATE WITH ENHANCED DIRECT BONDED METAL

Thermal pad and method of forming the same

Motor and optical disc drive using the same

Control device

Suspension substrate, suspension, head suspension, hard disk drive having a conductive connection section covered by a metallic support layer, method for manufacturing suspension substrate and method for testing continuity of suspension

Inverter type motor drive

ELECTRONIC CONTROL DEVICE

Suspension substrate, suspension, head suspension, hard disk drive, and method for manufacturing the suspension

LIGHT-EMITTING MODULE AND ILLUMINATION DEVICE

Fixing structure and fixing method of circuit board with embedded electronic parts to cooler

HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

LED module and LED lighting device

Solid state lighting device and method employing heat exchanger thermally coupled circuit board

Heat dissipating assembly

TELEVISION APPARATUS AND ELECTRONIC DEVICE

LED LAMP AND METHODS OF MANUFACTURING THE SAME

Semiconductor module and semiconductor device

HIGH POWER AMPLIFIER, WIRELESS TRANSMITTER, WIRELESS TRANSCEIVER, AND METHOD FOR MOUNTING HIGH POWER AMPLIFIER

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

MULTILAYER CIRCUIT SUBSTRATE

Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader

Semiconductor device, semiconductor unit, and power semiconductor device

Backlight module and display device with two-sided light emitting structure

Heat Dissipating Assembly

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/DIELECTRIC/POST HEAT SPREADER

Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via

Light source structure

Silicon nitride substrate manufacturing method, silicon nitride substrate, silicon nitride circuit substrate, and semiconductor module

Circuit board with built-in semiconductor chip and method of manufacturing the same

LCD ASSEMBLY AND PORTABLE ELECTRONIC DEVICE UTILIZING SAME

Stiffening plate for circuit board and switch assembly

Light emitting diode module with improved heat-dissipation efficiency

LED lamp circuit

Image pickup apparatus, endoscope and manufacturing method for image pickup apparatus

Printed circuit board

CIRCUIT MODULE

Semiconductor chip assembly with post/base heat spreader with thermal via

Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace

Electronic system with a composite substrate

Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace

Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole

Illumination device with semiconductor light-emitting elements

LIGHT SOURCE MODULE

LIGHTING APPARATUS

LIGHT EMITTING DIODE AND LIGHT SOURCE MODULE HAVING SAME

Semiconductor chip assembly with post/base heat spreader and plated through-hole

Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump

SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE HEAT SPREADER AND INVERTED CAVITY IN BUMP

Flat panel display module having anti-shock screw-tightening structure

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS

Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts

LED package and RFID system including the same

Light-emitting diode backlight module

Circuit board including mask for controlling flow of solder

Thin multi-chip flex module

Thin multi-chip flex module

ELECTRONIC MODULE

IMAGE SENSOR MODULE FOR CAMERA DEVICE

Flexible printed circuit board, backlight unit using the same, and liquid crystal display device comprising the same

Metal base circuit board

Slim type backlight unit with through-hole adhesive heat dissipating means

ELECTRONIC PACKAGE, DISPLAY DEVICE AND ELECTRONIC APPARATUS

Thin multi-chip flex module

Electric circuit structure including a flexible substrate with a connecting terminal

Grounding system and apparatus

METHOD FOR CLUING FLEXIBLE CIRCUIT BOARDS TO POLYMER MATERIALS FOR PARTIAL OR COMPLETE STIFFENING

HYBRID CHIP-ON-HEATSINK DEVICE AND METHODS

Wireless IC device and manufacturing method thereof

LED Assembly

Optimized power package for electrical device

DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE AND WIRING CIRCUIT BOARD

Low temperature co-fired ceramics assembling system and method thereof

Heat-dissipating substrate and fabricating method thereof

Module connection structure

Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bond

Flexible harness and electrical connector cable using same

ELECTRONIC APPARATUS AND FLEXIBLE SUBSTRATE WIRING METHOD

Semiconductor device

FLEXIBLE WIRING UNIT AND ELECTRONIC APPARATUS

Thermal management of LED-based lighting systems

HEAT DISSIPATING MODULE OF LIGHT EMITTING DIODE

Electronic apparatus

Solid state light fixture with enhanced thermal cooling and color mixing

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/FLANGE HEAT SPREADER AND A CAVITY IN THE FLANGE

Camera module and assembling method thereof

Method for manufacturing a ceramic elements module

High-speed transmission circuit board connection structure

LED light source, its manufacturing method, and LED-based photolithography apparatus and method

Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange

Power amplifier and signal transceiving system

Electronic circuit composed of sub-circuits and method for producing

LED Light Source Module and Method for Producing the Same

Method for positioning and mounting an LED assembly as well as a positioning body for this purpose

Semiconductor power module

Heat sink package

METHOD OF DEPTH ROUTING AN ELECTRONIC LAYUP AND APPARATUS FOR EFFECTING SUCH A METHOD

Method for manufacturing power module substrate, power module substrate, and power module

Electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board

Heat sinking and flexible circuit board, for solid state light fixture utilizing an optical cavity

Heat sinking and flexible circuit board, for solid state light fixture utilizing an optical cavity

Printed circuit board and magnetic head driving device including the same

Lighting device, backlighting device, and display device

Module for integrated control electronics having simplified design

Device for reducing thermal stress on connection points

FLEXIBLE DISPLAY SCREEN

Light emitting diode lamp

ELECTRONIC CONTROL UNIT AND METHOD OF MANUFACTURING THE SAME

Process for manufacturing LED lighting with integrated heat sink

Printed circuit board, manufacturing method thereof and radio-frequency device

Electronic circuit device

PRINTED CIRCUIT BOARD UNIT

Use of an electronic module for an integrated mechatronic transmission control of simplified design

Methods for making millichannel substrate, and cooling device and apparatus using the substrate

Illumination device

Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives

Substrate bonding apparatus

Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post

Backlight unit

Adjustable threaded cores for LED thermal management

Semiconductor chip assembly with post/base heat spreader and dual adhesives

Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post

Illumination device with semiconductor light-emitting elements

ELECTRO-THERMAL SEPARATION LIGHT EMITTING DIODE LIGHT ENGINE MODULE

Package Structure for Solid-State Lighting with Low Thermal Resistance

Lighting device and method for making the same

LED lamp assembly

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY OVER POST

FLEXIBLE WIRING UNIT AND ELECTRONIC DEVICE

Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace

Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post

Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace

Light emitting device

Semiconductor chip assembly with post/base heat spreader and cavity in post

Mounting structure of component of lighting device and method thereof

Chassis base and plasma display apparatus having the same

Controller, in particular for motor vehicle transmissions

Stiffening plate for circuit board and switch assembly

Electronic component mounting module and electrical apparatus

Parallel optical transceiver module that utilizes a folded flex circuit that reduces the module footprint and improves heat dissipation

Power semiconductor module with segmented base plate

Backlight unit equipped with light emitting diodes

Switching circuit layout with heatsink

Three-dimensional LED light-emitting plate

ELECTRONIC CONTROL DEVICE

Method of connecting printed circuit boards and corresponding arrangement

LIGHT EMITTING DEVICE, DISPLAY DEVICE AND SOLID-STATE LIGHT EMITTING ELEMENT SUBSTRATE

Semiconductor chip assembly with post/base heat spreader and signal post

Light emitting diode apparatus and optical engine using the same

Electronic Component Module and Method for the Production Thereof

Mounting arrangement and method for light emitting diodes

Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader

Method of making a semiconductor chip assembly with a post/base/cap heat spreader

Light source module and display apparatus having the same

LIGHT EMITTING DEVICE AND DISPLAY DEVICE

SEMICONDUCTOR CHIP ASSEMBLY WITH COPPER/ALUMINUM POST/BASE HEAT SPREADER

Semiconductor chip assembly with post/base/cap heat spreader

MODULE INCLUDING A STABLE SOLDER JOINT

Electronics housing with standard interface

Multilayer circuit substrate

Semiconductor module and an electronic system including the same

Semiconductor chip assembly with post/base heat spreader and substrate

Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace

Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate

Method for mounting an LED module on a support

LED assembly preventing electrostatic accumulation thereon

Light emitting module

HEAT DISSIPATION STRUCTURE AND VEHICULAR INVERTER

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CONDUCTIVE TRACE

Light emitting module, lighting device and display device

LED COOLING SYSTEM

Electronic Assembly and Backlight Module

Light emitting diode module

LED module and light modulator with the same

Bonded metal and ceramic plates for thermal management of optical and electronic devices

HEAT DISSIPATION MODULE FOR LIGHT EMITTING DIODE

Microheat exchanger for laser diode cooling

LED LIGHT SOURCE UNIT

Printed Circuit Board Assembly Having Multiple Land Grid Arrays for Providing Power Distribution

Electronic chip module

High frequency amplifying device

Method for producing a flexible conductor carrier and arrangement comprising the flexible conductor carrier

Tubular memory module

CARRIAGE ASSEMBLY AND RECORDING MEDIUM DRIVE

Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing

Electronics housing with open conductor track regions and a contact partner formed as a clip

Semiconductor chip assembly with post/base heat spreader and horizontal signal routing

Printed circuit board assembly

Wireless IC device and manufacturing method thereof

Plasma display device

Image-sensing module for digital optical device

Light emission structure

COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME

Thermal management of LED-based lighting systems

Semiconductor device

Liquid crystal display device

COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME

LED LIGHT SOURCE UNIT

Electronic component

LED illumination assembly with compliant foil construction

Illumination system, electro-optic device, and electronic apparatus

STORAGE APPARATUS AND PRINTED WIRING BOARD UNIT

Power module substrate, method for manufacturing power module substrate, and power module

MULTI-LAYER CIRCUIT SUBSTRATE AND MOTOR DRIVE CIRCUIT SUBSTRATE

LED assembly for LED lamp consisting of multiple LED units each having a heat sink

Module including a rough solder joint

Electronic device including circuit board with radiating member, hydraulic unit including the electronic device, and method of fixing the radiating member to the circuit board

INSULATING CIRCUIT BOARD AND INSULATING CIRCUIT BOARD HAVING COOLING SINK

Layered structure for use with high power light emitting diode systems

Enamel substrate for mounting light emitting elements, light emitting element module, illumination apparatus, display apparatus, and traffic signal

Electronic unit

Circuit board with cooling function

Flexible printed circuit board and manufacturing method for the same

Planar illumination device

System and method for integrated waveguide packaging

Planar Illumination Device and Manufacturing Method of Same

Heat radiator and power module

Heat sink package

Printed circuit board, backlight unit having the printed circuit board, and liquid crystal display device having the printed circuit board

Inorganic powder, resin composition filled with the powder and use thereof

High performance power device

PCB mounting method

Soldering Method, Semiconductor Module Manufacturing Method, and Soldering Apparatus

Radiation-emitting device comprising a plurality of radiation-emitting components and illumination device

Lateral light-emitting diode backlight module

Thin multi-chip flex module

Thin multi-chip flex module

Thin multi-chip flex module

Thin multi-chip flex module

Thin multi-chip flex module

Electronic circuit arrangement and method for producing an electronic circuit arrangement

Circuit board and image display apparatus

Plasma display device

MULTILAYER, THERMALLY-STABILIZED SUBSTRATE STRUCTURES

HEAT SINK DEVICE

Soldering Method, Method for Manufacturing Semiconductor Module, and Soldering Apparatus

Soldering Method and Semiconductor Module Manufacturing Method

Manufacturing method of semiconductor device

Illumination device comprising a heat sink

Illumination device comprising a substrate plate and a heat sink

Device mounting structure and device mounting method

Semiconductor package module

Light unit and display device having the same

THERMAL SURFACE MOUNTING OF MULTIPLE LEDS ONTO A HEATSINK

Circuitized substrate with internal cooling structure and electrical assembly utilizing same

Circuit board assembly and backlight module comprising the same

Driver module structure

WIRE BOND LED LIGHTING UNIT