ClassID:

233798

H05K3/07 - CPC Classification

Classification description:

Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically

Recent Application in this class:
#1
20250311115
2025-10-02

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

#2
20250261302
2025-08-14

WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE

#3
20250126709
2025-04-17

PRINTED WIRING BOARD

#4
20250071893
2025-02-27

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF

#5
20250063671
2025-02-20

METHOD FOR MANUFACTURING CIRCUIT BOARD

#6
20210136921
2021-05-06

Method for manufacturing printed circuit board

#7
20190246503
2019-08-08

Electronic circuit production

#8
20170061273
2017-03-02

Method for manufacturing an electrical circuit board, electrical circuit board obtained by this method and smart card comprising such an electrical circuit board

#9
20160329301
2016-11-10

Low cost substrates

#10
20160242297
2016-08-18

Electronic Circuit Production

#11
20160095215
2016-03-31

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

#12
20150183081
2015-07-02

Chemical mechanical planarization apparatus and methods

#13
20150034369
2015-02-05

RESIN COMPOSITION FOR PRINTED WIRING BOARDS

#14
20150027977
2015-01-29

METHOD OF MANUFACTURING WIRING BOARD

#15
20140110265
2014-04-24

Electrode and method of forming the master electrode

#16
20120305390
2012-12-06

Electrode and method of forming the master electrode

#17
20120279866
2012-11-08

METHOD OF FORMING A MULTILAYER STRUCTURE

#18
20120267241
2012-10-25

MASTER ELECTRODE AND METHOD OF FORMING IT

#19
20120228128
2012-09-13

Method and electrode for defining and replicating structures in conducting materials

#20
20110000784
2011-01-06

Method and electrode for defining and replicating structures in conducting materials

#21
20100044080
2010-02-25

Metal Deposition

#22
20100044079
2010-02-25

Metal Deposition

#23
20090288954
2009-11-26

Device suitable for electrochemically processing an object as well as a method for manufacturing such a device, a method for electrochemically processing an object, using such a device, as well as an object formed by using such a method

#24
20090280243
2009-11-12

Photoresist-free metal deposition

#25
20090277801
2009-11-12

Photoresist-free metal deposition

#26
20090229857
2009-09-17

ELECTRODE AND METHOD OF FORMING THE ELECTRODE

#27
20090229856
2009-09-17

Master Electrode and Method of Forming the Master Electrode

#28
20090229855
2009-09-17

ELECTRODE AND METHOD OF FORMING THE MASTER ELECTRODE

#29
20090229854
2009-09-17

Electrode and method of forming the electrode

#30
20090218233
2009-09-03

Method of Forming a Multilayer Structure

#31
20090205967
2009-08-20

METHOD OF FORMING A MULTILAYER STRUCTURE

#32
20090184090
2009-07-23

THIN-FILM ASSEMBLY AND METHOD FOR PRODUCING SAID ASSEMBLY

#33
20090183992
2009-07-23

METHOD OF FORMING A MULTILAYER STRUCTURE

#34
20090084684
2009-04-02

Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method

#35
20090071837
2009-03-19

MASTER ELECTRODE AND METHOD OF FORMING IT

#36
20090050487
2009-02-26

Direct nanoscale patterning of metals using polymer electrolytes

#37
20080156663
2008-07-03

Method of monitoring a substrate patterning process

#38
20080029400
2008-02-07

Selective electroplating onto recessed surfaces

#39
20070151858
2007-07-05

Method and electrode for defining and replicating structures in conducting materials

#40
20070045120
2007-03-01

Methods and apparatus for filling features in microfeature workpieces

#41
20060231837
2006-10-19

Thin-film assembly and method for producing said assembly

#42
20060207888
2006-09-21

Electrochemical etching of circuitry for high density interconnect electronic modules

#43
20050145506
2005-07-07

Electrochemical etching of circuitry for high density interconnect electronic modules

#44
20050115670
2005-06-02

Method and device for etching a thin conductive layer which is disposed on an insulating plate such as to form an electrode network thereon

#45
20050082257
2005-04-21

Method of etching copper on cards