Patents-Review.com
ClassID:

233846 ⎘

H05K3/247 - CPC Classification

Classification description:

Apparatus or processes for manufacturing printed circuits; Secondary treatment of printed circuits; Reinforcing the conductive pattern; Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques Finish coating of conductors by using conductive pastes, inks or powders

Sub-classes:
Recent Application in this class:
#1
20250040044
2025-01-30

ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN

 #2
20210282268
2021-09-09

Advanced Manufacturing Method for the Manufacturing of High-Precision Electronic Flexible Circuit Boards enabling the Democratization of design, development, and production of electronic and electrical devices

 #3
20200106202
2020-04-02

Electrical connector and connector system having plated ground shields

 #4
20190357360
2019-11-21

Methods for Preparing Electrically Conductive Patterns and Articles Containing Electrically Conductive Patterns

 #5
20190029119
2019-01-24

Dry method of metallizing polymer thick film surfaces

 #6
20170250513
2017-08-31

Method for manufacturing at least one functional area on an electric contact element such as a switching contact or a plug contact

 #7
20170151916
2017-06-01

Vehicular panel and wiring structure for vehicle

 #8
20160095228
2016-03-31

Method for manufacturing wiring structure, copper displacement plating solution, and wiring structure

 #9
20150316242
2015-11-05

Light-emitting device

 #10
20150313008
2015-10-29

Multi-layer micro-wire structure

 #11
20150195908
2015-07-09

Wiring board

 #12
20150116971
2015-04-30

Electronic device and method of manufacturing electronic device

 #13
20140367154
2014-12-18

Capacitor arrangement structure and method of mounting capacitor

 #14
20140017393
2014-01-16

Method for manufacturing at least one functional area on an electric contact element such as a switching contact or a plug contact

 #15
20130029458
2013-01-31

SUBSTRATE FOR SEMICONDUCTOR PACKAGE HAVING COATING FILM AND METHOD FOR MANUFACTURING THE SAME

 #16
20120186865
2012-07-26

Paste composition and printed circuit board

 #17
20120037406
2012-02-16

Method and apparatus for using flex circuit technology to create an electrode

 #18
20110235348
2011-09-29

Connector having a terminal with a tin plated contact pressed against a hot-dip tinned face of a board

 #19
20110168958
2011-07-14

Electrical contact enhancing coating

 #20
20110108876
2011-05-12

Pad structure with a nano-structured coating film

 #21
20100258341
2010-10-14

Mounting board and method of producing the same

 #22
20100098937
2010-04-22

Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof

 #23
20100043223
2010-02-25

Stripline flex circuit

 #24
20100012359
2010-01-21

Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof

 #25
20090219212
2009-09-03

Planar antenna and manufacturing method thereof

 #26
20090174073
2009-07-09

SUBSTRATE FOR SEMICONDUCTOR PACKAGE HAVING COATING FILM AND METHOD FOR MANUFACTURING THE SAME

 #27
20090139748
2009-06-04

Wiring substrate

 #28
20090067145
2009-03-12

CIRCUIT PATTERN DESIGNING METHOD, WHEREIN AN ELECTROCONDUCTIVE COATING MATERIAL IS USED, AND A PRINTED CIRCUIT BOARD

 #29
20090008784
2009-01-08

Power semiconductor substrates with metal contact layer and method of manufacture thereof

 #30
20080152791
2008-06-26

Electrical contact enhancing coating

 #31
20080110020
2008-05-15

Stripline flex circuit

 #32
20070281099
2007-12-06

Solderable pads utilizing nickel and silver nanoparticle ink jet inks

 #33
20070200254
2007-08-30

Method and apparatus for using flex circuit technology to create an electrode

 #34
20070194449
2007-08-23

Pattern and fabricating method therefor, device and fabricating method therefor, electro-optical apparatus, electronic apparatus, and method for fabricating active matrix substrate

 #35
20070080775
2007-04-12

Trimming resistor and method of manufacture thereof

 #36
20050079707
2005-04-14

Interconnection substrate and fabrication method thereof

 #37
20050016765
2005-01-27

Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof

 #38
20050003171
2005-01-06

Plated via interposer

 #39
20050003166
2005-01-06

Pattern and fabricating method therefor, device and fabricating method therefor, electro-optical apparatus, electronic apparatus, and method for fabricating active matrix substrate