TEMPORARY PANEL RAILS

SYSTEM AND METHOD FOR MONITORING CONDITIONS OF A SUBJECT BASED ON WIRELESS SENSOR DATA

BENDING APPARATUS AND BENDING METHOD USING THE SAME

SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORMABLE SUBSTRATES OF ELECTRONIC DEVICES

LATCHING SYSTEM FOR ESTABLISHING A LATCHING CONNECTION BETWEEN A PRINTED CIRCUIT BOARD AND AN EDGE-CONTACT PLUG, PRINTED CIRCUIT BOARD, EDGE-CONTACT PLUG AND ADD-ON PART

Flexible membrane adapted to carry high-frequency (RF) power signals and corresponding probe card for the high-frequency (RF) power test of electronic devices

System and method for monitoring conditions of a subject based on wireless sensor data

Multi head flexible printed circuit ultraviolet laser drilling device and method

ELECTRONIC DEVICE

Method And Apparatus For Singulation Detachment

Interconnect, an electronic assembly and a method for manufacturing an electronic assembly

CIRCUIT BOARD STRUCTURE AND METHOD OF MANUFACTURING THE SAME

STRUCTURES WITH DEFORMABLE CONDUCTORS

Method for manufacturing non-planar arrays with a single flex-hybrid circuit card

Deformable sensor

Method for manufacturing wiring board with a meandering shape section

Interconnecting circuit board to stretchable wires

Hyperelastic binder for printed, stretchable electronics

INTERCONNECTING CIRCUIT BOARD TO STRETCHABLE WIRES

Circuit arrangement, in particular for an electrically driven motor vehicle

Process for manufacturing a roll of flexible carrier for electronic components

Flexible device including conductive traces with enhanced stretchability

Battery pack

BATTERY PACK

LED assembly with omnidirectional light field

Loading assembly

Flexible circuits for use with gaskets in electronic equipment and related systems and meters

METHOD OF ENHANCING ELECTRICAL CONNECTIONS IN 3D-PRINTED OBJECTS

Flexible printed circuit electrical connector

Method and apparatus for producing flexible OLED device

Substrate

Accumulator battery pack, comprising devices for passive magnetic between accumulators and busbars, and, where appropriate, passive shunt of one or more accumulators in case of failure of these ones

Flexible touch substrate, method for manufacturing the same, and display device

Transmission control apparatus and method for fastening a signal input element to a circuit board element of a transmission control apparatus

Printed circuit board and method for producing the printed circuit board

DISPLAY DEVICE PRODUCTION METHOD, DISPLAY DEVICE PRODUCTION DEVICE, AND INSPECTION DEVICE

Method and apparatus for producing flexible OLED device

Substrate

Foldable array substrate, preparation method thereof and display device

Hyperelastic binder for printed, stretchable electronics

Connector and circuit board assembly

Pocket connector

Extremely stretchable electronics

System and method for assembling hook type heatsink

Hyperelastic binder for printed, stretchable electronics

Method for fabricating circuit board with resilient seal as vapor barrier

System and method for monitoring conditions of a subject based on wireless sensor data

Inter-chip alignment

Electrical Connector and Method of Making It

Flexible printed circuit board, supporting holder and controller

Flexible substrate retention on a reusable carrier

Making interconnections by curving conducting elements under a microelectronic device such as a chip

Extremely stretchable electronics

Integrated circuit and method that utilize a shape memory material

Electronic control module and method for producing an electronic control module

Circuit board with resilient seal as vapor barrier

Selectively conductive toy building elements

Electronic device embedded substrate and manufacturing method thereof

Arrangement and method for connecting an electrical component to a leadframe

STRAP BAND INCLUDING ELECTRODES FOR WEARABLE DEVICES AND FORMATION THEREOF

Flexible connector and methods of manufacture

Axiocentric scrubbing land grid array contacts and methods for fabrication

Molding method for COB-EUSB devices and metal housing package

Extremely stretchable electronics

LED assembly with omnidirectional light field

Electrical connector

Method of bonding flexible printed circuit board to a display panel

Connector for multi-layered board

Flexible direct or USB plug-in platform for foldable or flexible electronics

Assembly having a substrate, an SMD component, and a lead frame part

Terminal with terminal bender having stable bend, wiring member, and head suspension

SEMICONDUCTOR PACKAGE MODULE

High performance surface mount electrical interconnect

Molding method for COB-EUSB devices and metal housing package

Metallurgical clamshell methods for micro land grid array fabrication

Arrangement comprising an electric and/or electronic module and a circuit carrier

SUBSTRATE WITH SPRING TERMINAL AND METHOD OF MANUFACTURING THE SAME

LED LIGHT BAR STRUCTURE

Electrical assembly having an orbicular upper contact held movably in an upwardly coverging opening of a lower contact

Axiocentric scrubbing land grid array contacts and methods for fabrication

Interposer connectors

Electrical heating device with a plate element comprising conductive paths

METHOD AND SYSTEM FOR PREPARING WIRELESS COMMUNICATION CHIPS FOR LATER PROCESSING

Method of manufacturing a conductive adhesive bond assembly

Plug-in connector

APPARATUS FOR FORMING A WIRELESS COMMUNICATION DEVICE

LED module

Mobile terminal

Multiple stem design for high density interconnects

Illumination system

Method of manufacturing FPCB substrate

METHOD OF MANUFACTURING CERAMIC SUBSTRATE FOR PROBE CARD AND CERAMIC SUBSTRATE FOR PROBE CARD

Single shot molding method for COB USB/EUSB devices with contact pad ribs

Semiconductor package module and electric circuit assembly with the same

STRUCTURE FOR CONNECTING FLEXIBLE CIRCUIT TO TARGET MEMBER

Patch panel assembly for use with data networks

Patch panel assembly for use with data networks

Modular interconnection system

Structure of light emitting diode and method to assemble thereof

Electronic sensor or sensor device, in particular an acceleration sensor, having a chip module mounted in a sensor housing

Termination cap for use in wired network management system

SPIRAL CONTACT AND PROCESS FOR PRODUCING THE SAME

Connection structure of electronic component and wired circuit board, wired circuit board assembly, and method for testing electronic component

Separable electrical connectors using isotropic conductive elastomer interconnect medium

ELECTRONIC PACKAGE, DISPLAY DEVICE AND ELECTRONIC APPARATUS

CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND JOINT BOX USING CIRCUIT BOARD

Circuit board, its manufacturing method, and joint box using circuit board

Metallurgical clamshell methods for micro land grid array fabrication

Connector

Axiocentric scrubbing land grid array contacts and methods for fabrication

Out of plane integral conductive arms and methods for manufacturing the same

Microstructure and Process for its Assembly

Solderless carbon nanotube and nanowire electrical contacts and methods of use thereof

Female connector, male connector assembled to the same, and electric/electronic apparatus using them

CIRCUIT SUBSTRATE FOR ELECTRONIC DEVICE

Semiconductor device

Terminal joining structure and terminal joining method

Conductor track carrier and method for the production of a conductor track carrier

LEAD FRAME WITH STITCHING-ASSISTING STRUCTURES, ELECTRONIC DEVICE HAVING SUCH LEAD FRAME AND APPARATUS HAVING SUCH ELECTRONIC DEVICE

Method of producing a land grid array interposer structure

Vehicle lamp with polymer conductors and mounting structures

Electrical contacting device, in particular for electronic circuits, and electrical/electronic circuit

Connecting terminals with conductive terminal-forming members having terminal portions extending in different directions

Apparatus for forming a wireless communication device

Separable electrical connectors using isotropic conductive elastomer interconnect medium

Plug-type connector

FLEXIBLE PRINTED CIRCUIT BOARD HAVING EMBOSSED CONTACT ENGAGING PORTION

Micro pin grid array with pin motion isolation

Voice output unit

Structure and process for a contact grid array formed in a circuitized substrate

Pressure conductive sheet

ELECTRONIC, IN PARTICULAR MICROELECTRONIC, FUNCTIONAL GROUP AND METHOD FOR ITS PRODUCTION

Extremely stretchable electronics

Electrical interconnection devices incorporating Fedundant contact points for reducing capacitive stubs and improved signal integrity

APPARATUS AND METHOD FOR MAKING AND USING A TOOLING DIE

ELECTRIC CONTACT AND METHOD FOR PRODUCING THE SAME AND CONNECTOR USING THE ELECTRIC CONTACTS

Apparatus for manufacturing a wireless communication device

Apparatus for preparing an antenna for use with a wireless communication device

LITHOGRAPHIC CONTACT ELEMENTS

Double-sided connector with protrusions

Method of making electrical connector on a flexible carrier

Horizontal dual in-line memory modules

System and method for connecting flat flex cable with an integrated circuit, such as a camera module

LED PACKAGE AND ATTACHMENT STRUCTURE OF MOLDED CIRCUIT COMPONENT

Process for fabricating a connector

Conductive elastomeric and mechanical pin and contact system

Method of making a conductive elastomeric coplanar connector with mechanical pin

Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Method and system for preparing wireless communication chips for later processing

Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Skived electrical contact for connecting an IC device to a circuit board and method of making a contact by skiving

ANTENNA ARRANGEMENT FOR A PORTABLE RADIO COUMMUNICATION DEVICE, AND A PORTABLE RADIO COMMUNICATION DEVICE COMPRISING SUCH AN ANTENNA ARRANGEMENT

Contact pads for silicon chip packages

Method of forming metallized elastomeric electrical contacts

Probe card assembly and kit, and methods of making same

Mounting structure and method for mounting electronic component onto circuit board

ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME

Spring interconnect structures

ILLUMINATOR

Icemaker

Method for bonding metallic terminals by using elastic contact

Electronic component mounting board, method for manufacturing the same and electronic circuit unit

Bump bonding method

Conductor Track Carrier

Motor drive apparatus

Electrical connection structure

Nickel structures and methods for manufacturing the same by removal of an underlying material

LED LIGHTING DEVICE

LED and the promptly fabricating material structure and the connect method thereof

Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport

Socket, method for manufacturing socket, and semiconductor device

HEAD ASSEMBLY

Connecting device and method for electronic machinery

ESD Protection For USB Memory Devices

Wiring board and method of manufacturing the same

Icemaker control module

Stacked Integrated Circuit Module

Separable electrical connectors using isotropic conductive elastomer interconnect medium

Flexible column die interconnects and structures including same

Printed circuit board interconnecting structure with compliant cantilever interposers

FPCB SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Land grid array interposer producing method

TERMINAL CONNECTING STRUCTURE

Anisotropic conductive sheet, its production method, connection method and inspection method

Method of producing a land grid array (LGA) interposer structure

Single shot molding method for COB USB/EUSB devices with contact pad ribs

Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposers

Providing variable sized contacts for coupling with a semiconductor device

Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier plane

Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket

Board-to-board connector

Printed board with component mounting pin

Printed board with component mounting pin

Metalized elastomeric electrical contacts

Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Spiral Contactor

INTENNA CONNECTING APPARATUS

Interposer with Electrical Contact Button and Method

Method for connecting an electric actuator to a printed circuit board

Printed circuit board, method of fabricating the same, and electronic apparatus employing the same

Electronic component and method of forming the same

Electrical power distribution unit and electrical punched grid therefor

Method of producing a land grid array (LGA) interposer structure

Three-Dimensional Wiring Body for Mounting Electronic Component and Electronic Component Mounting Structure

Method of producing a land grid array interposer

Skived electrical contact for connecting an IC device to a circuit board and method of making a contact by skiving

WIRING BOARD AND BUS BAR SEGMENTS TO BE USED THEREFOR

Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material

Method of producing a land grid array interposer

POWER SUPPLY PLATFORM AND ELECTRONIC COMPONENT

Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity

Fabric type semiconductor device package and methods of installing and manufacturing same

Spring interconnect structures

Method of forming a land grid array (LGA) interposer

Contact carriers (tiles) for populating larger substrates with spring contacts

ADAPTER FOR A MEMORY CARD AND A MEMORY CARD

Method for manufacturing semiconductor device

Extended COB-USB with dual-personality contacts

Structure of light emitting diode and method to assemble thereof

Probe card assembly and kit

Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier plane

Method of producing antenna elements for a wireless communication device

Method of producing a land grid array interposer utilizing metal-on-elastomer

Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer

Protovoltaic module utilizing a flex circuit for reconfiguration

Method of forming a land grid array interposer

Resin molded component fitted with a metal plate and molding method therefor

SENSOR ASSEMBLY AND METHOD OF FORMING THE SAME

Interconnect For Microelectronic Structures With Enhanced Spring Characteristics

Method of making lithographic contact elements

Mounting structure, electro-optical device, electronic apparatus, and method of producing the mounting structure

THREE-DIMENSIONAL PRINTED CIRCUIT BOARD FOR USE WITH ELECTRONIC CIRCUITRY

INTEGRATED CIRCUIT DIE/PACKAGE INTERCONNECT

Interposer, electrical package, and contact structure and fabricating method thereof

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

Conductive elastomeric and mechanical pin and contact system

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

LGA utilizing metal-on-elastomer hemi-torus having a slitted wall surface for venting gases

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

IC socket and manufacturing method for the same

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Electronic part and circuit substrate

Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component

Spring connector for making electrical contact at semiconductor scales

Flexible circuit connectors

Metal carrier for LEDs in composite lamps

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out

Structure and process for a contact grid array formed in a circuitized substrate

Circuit board, its manufacturing method, and joint box using circuit board

Circuit board with holding mechanism for holding wired electronic components method for manufacture of such a circuit board and their use in a soldering oven

TEST CONTACT SYSTEM FOR TESTING INTEGRATED CIRCUITS WITH PACKAGES HAVING AN ARRAY OF SIGNAL AND POWER CONTACTS

Printed board with a pin for mounting a component

Printed wiring board with component mounting pin and electronic device using the same

Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity

Probe For Semiconductor Devices

Socketless planar semiconductor module

Stacked integrated circuit module

Managed memory component

Managed memory component

Managed memory component

Method of connecting signal lines, a printed circuit board assembly and electronic apparatus having the same

Engaging device of circuit board

Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit

Contact grid array system

Interconnect structure of an integrated circuit and manufacturing method thereof

Electrical device carrier contact assembly

Magnetic head assembly bonding electrode pad of slider and electrode pad of flexible wiring substrate together by solder

Power board and plug-in lighting module

Interposer with electrical contact button and method

Electronic device with conductive connection structure

Contact carriers (tiles) for populating larger substrates with spring contacts

Method and system for manufacturing a wireless communication device

Electric contact and method for producing the same and connector using the electric contacts

Connecting component

Manufacturing method for a wireless communication device and manufacturing apparatus

Digital camera module for detachably mounting with flex printed circuit board

Method for fabricating a contact grid array

METHODS OF FABRICATING AND USING SHAPED SPRINGS

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology

Method for electrically contacting a component to a flat cable

Mounting light emitting diodes

CONTACT GRID ARRAY SYSTEM

Methods for forming flexible column die interconnects and resulting structures

Method of making an interposer with contact structures

Control circuit device for motor, method for manufacturing the device, and motor having the device