THREE-WIRE FLAT CABLE HIGH-VOLTAGE PLUG-IN LIGHT STRING AND METHOD OF MAKING THEREOF

WATERPROOF LIGHT-EMITTING DIODE PLUG-IN LIGHT AND METHOD OF MAKING THEREOF

METHOD FOR FORMING AN ELECTRONIC DEVICE WITH REDUCED WARPAGES

ELECTRONIC DEVICES AND METHODS OF MANUFACTUING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE WITH A CAVITY SUBSTRATE

ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT

WAFER LEVEL BUMP STACK FOR CHIP SCALE PACKAGE

PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME

ELECTRONIC DEVICES AND METHODS OF MANUFACTUING ELECTRONIC DEVICES

Printed Circuit Board And Method For Soldering A Chip Housing In A Process-Reliable Manner

PACKAGES WITH A SHORTEST DISTANCE BETWEEN PACKAGE CONNECTORS AND A SEATING PLANE OF AT LEAST 6 MILS

SOLDER CONNECTION BETWEEN A COAXIAL CABLE AND A PRINTED CIRCUIT BOARD ARRANGEMENT AND A MOBILE COMMUNICATION ANTENNA COMPRISING SUCH A SOLDER CONNECTION

EXPOSED PAD INTEGRATED CIRCUIT PACKAGE

PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE COMPRISING SAME

Sensor Module

Mechanically bridged SMD interconnects for electronic devices

ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT

PRINTED WIRING BOARD

Exposed pad integrated circuit package

IC die, probe and ultrasound system

Chip package positioning and fixing structure

Wafer level bump stack for chip scale package

Printed circuit board assembly process using multiple solders and assembled boards made using the same

Surface mount electrical connector

Electrical apparatus having tin whisker sensing and prevention

Intraluminal ultrasound imaging device and method of fabricating the same

Wafer level bump stack for chip scale package

Semiconductor device

Method and Apparatus for Stacking Printed Circuit Board Assemblies with Single Reflow

Reflow grid array to support late attach of components

Conductive terminal with clamping portion and connector assembly using the same

Method of manufacturing electronic board and mounting sheet

Solder-pinning metal pads for electronic components

Printed circuit board, air conditioner, and method for manufacturing printed circuit board

Electronic device and method for manufacturing the same

Process of assembling semiconductor device

Packaged electronic devices with top terminations

System and method for minimizing connector pad open-circuit stubs

Solderless inter-component joints

Dye and pry process for removing quad flat no-lead packages and bottom termination components

Method to form a stacked electronic structure

Electrical component package with reinforced molded pins

Package for housing an electric or electronic component

Apparatus for holding a printed circuit board

Connecting arrangement and corresponding method for mounting an electronic component on a printed circuit board

Reverse mounted gull wing electronic package

Method for mounting a power amplifier (AP) assembly

Stacked electronic structure

Methods of manufacturing packaged electronic devices with top terminations

IC die, probe and ultrasound system

Printed circuit board and electronic device

Printed circuit board and a method of bonding electrode lead of battery to printed circuit board

Accurate positioning and alignment of a component during processes such as reflow soldering

Fixing apparatus

Solder contacts for socket assemblies

Multi-stacked electronic device with defect-free solder connection

Multi-stacked electronic device with defect-free solder connection

Manufacturing a product using a soldering process

Electrical component package with reinforced molded pins

Circuit boards and circuit board assemblies

Molded intelligent power module

Electrical interface for package and die

Single element wire to board connector

Circuit assembly and method for manufacturing same

Circuit board and on-board structure of semiconductor integrated circuit

Substrate structure for packaging chip

Electrolytic capacitor retention device

Vapor chamber amplifier module

Electronic component, mounted electronic component, and method for mounting electronic component

Wiring board soldered with lead wire and electronic device comprising wiring board

Relieved component pad for 0201 use between vias

SET TOP BOX HAVING PASTE-IN-HOLE TUNER SHIELD

High current switch

Single element wire to board connector

Multi-stacked electronic device with defect-free solder connection

Electronic control module and method for producing an electronic control module

Laser soldering system

Solder contacts for socket assemblies

Exposed pad integrated circuit package

Multi-stacked electronic device with defect-free solder connection

Affixing structure for electronic component

Manufacturing a product using a soldering process

Component mounting method

Component mounting method

Circuit assembly

Window assembly with electrically conductive compressible member

Window assembly with casing for solder joint

Surface mount battery and portable electronic device with integrated battery cell

Packaged electronic devices with top terminations, and methods of manufacture thereof

OPTOELECTRONIC MODULES AND ASSEMBLIES COMPRISING OPTOELECTRONIC MODULES

Surface mountable, toroid magnetic device

Package assembly and method for manufacturing the same

Apparatus for manufacturing semiconductor device and the semiconductor device

Accurate Positioning and Alignment of a Component During Processes Such as Reflow Soldering

Multi-stacked electronic device with defect-free solder connection

Multi-stacked electronic device with defect-free solder connection

Miniaturized multi-part component and method for producing same

Single element wire to board connector

Method for soldering a connecting element

Two-high light-emitting diode holder structure

Optical transceiver having plug board independent of circuit board and a holder that holds the circuit board on a level with the plug board

Electronic device including soldered surface-mount component

Printed wiring board

Electronic component mounting system, electronic component mounting method, and electronic component mounting machine

Electronic package structure

Electronic package structure

Method of manufacturing laser diode unit utilizing submount bar

Light source module

Electric and/or electronic circuit including a printed circuit board, a separate circuit board and a power connector

Control unit for a motor vehicle

Manufacturing a product using a soldering process

Attenuation reduction grounding pattern structure for connection pads of flexible circuit board

Single element wire to board connector

Carrier for mounting a piezoelectric device on a circuit board and method for mounting a piezoelectric device on a circuit board

Printed wiring board, printed circuit board, and method for manufacturing printed circuit board

Surface mount package for a semiconductor integrated device, related assembly and manufacturing process

Coupling assembly of power semiconductor device and PCB and method for manufacturing the same

Method for eliminating electrical short circuits

Printed circuit board

Twinaxial cable and twinaxial cable ribbon

Electronic module produced by sequential fixation of the components

Apparatus and method of manufacturing laser diode unit utilizing submount bar

PRINTED CIRCUIT BOARD WITH STRENGTHENED PAD

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

Printed circuit board

Mounting structure and mounting method

Circuit board

Adhesive dam

Electronic package structure

ELECTRICAL SOLDERING IRON HEAD

Dual-function integrated circuit

PRINTED CIRCUIT BOARD HAVING HEAT GATHERING STRUCTURES AND MANUFACTURING PROCESS THEREOF

Printed board assembly interface structures

PRINTED CIRCUIT BOARD ASSEMBLY

INTERCONNECT FORMATION UNDER LOAD

Method for soldering surface-mount component and surface-mount component

AT LEAST PARTIALLY REDUNDANT INTERCONNECTS BETWEEN COMPONENT AND PRINTED BOARD

Power supply module

Electronic package structure

Semiconductor device manufacturing method

Printed wiring board and electronic device

Printed wiring board, method of soldering quad flat package IC, and air conditioner

ELECTRONIC DEVICE AND DAMAGE DETECTING METHOD

SYSTEM AND METHOD OF FORMING A MECHANICAL SUPPORT FOR AN ELECTRONIC COMPONENT ATTACHED TO A CIRCUIT BOARD

Mounting structure of chip type electric element and electric apparatus having chip type electric element on flexible board

Low profile coil-wound bobbin

CONDUCTIVE CONTACT TERMINAL FOR SURFACE MOUNTING ON SUBSTRATE

ELECTRONIC APPARATUS, METHOD FOR MOUNTING A DEVICE, AND OPTICAL COMMUNICATION APPARATUS

SOCKET FOR ELECTROLYTIC CAPACITORS

PCI-E module

Interposer lead

Electronic package structure

Cut-edge positioning type soldering structure and method for preventing pin deviation

Electrical microfilament to circuit interface

Notch positioning type soldering structure and method for preventing pin deviation

Printed circuit board module

Television apparatus, electronic device, and circuit board structure

FLEXIBLE PRINTED CIRCUIT BOARD

INTEGRATED-CIRCUIT ATTACHMENT STRUCTURE WITH SOLDER BALLS AND PINS

Integrated circuit packaging system with package-on-package and method of manufacture thereof

SUBSTRATE

ELECTRICAL CIRCUIT ASSEMBLY, CONTROL DEVICE AND METHOD FOR PRODUCING AN ELECTRICAL CIRCUIT ASSEMBLY

Cable guide and method of cable termination

THIN WAFER DETECTORS WITH IMPROVED RADIATION DAMAGE AND CROSSTALK CHARACTERISTICS

INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS CONNECTED TO A SURFACE OF A PRINTED WIRING BOARD, AND METHODS FOR CONNECTING THE SAME

Surface mount LED and holder

Arrangement comprising an electrical conductor track carrier and an optoelectronic component, and a method for producing such an arrangement

Heat conduction board and mounting method of electronic components

Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards

ELECTRONIC PACKAGE STRUCTURE

Method for low temperature bonding of electronic components

SPACE SAVING CIRCUIT BOARD

COMPONENT SECURING SYSTEM AND ASSOCIATED METHOD

Fastener-less edge launch connector for MR-compatible medical monitoring

Wireless IC tag and method for manufacturing wireless IC tag

Regulated output current and slope control

Solder connection element

PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Low pressure molding encapsulation of high voltage circuitry

HIGH VOLTAGE RECESSED CONNECTOR CONTACT

Substrate having leads

Light emitting diode arrangement for high safety requirements

Electronic component for an electronic carrier substrate

Implementing enhanced solder joint robustness for SMT pad structure

Solderless surface mount fuse

PRINTED CIRCUIT BOARD AND BACK LIGHT MODULE USING THE SAME

Electronic device

Optical sensing module and optical mouse with the same

CIRCUIT BOARD ASSEMBLY

Surface mounting lug terminal and method for mounting the same

Non-reciprocal device having grounding arrangement and method of installation thereof

Method for applying a connection material

Electrical connector and heat sink

Alignment device for fine pitch connector leads

POP PACKAGE AND METHOD OF FABRICATING THE SAME

Choke module having improved terminal arrangement

Interconnect System without Through-Holes

Electrical microfilament to circuit interface

Semiconductor device and method for manufacturing same

Bond strength and interconnection in a via

Electronic component mounting method

LED chip module

Stacked multilayer capacitor

FLEX-RIGID WIRING BOARD AND ELECTRONIC DEVICE

Printed circuit board

Electromagnetic relay

INTER-BOARD COUPLING CONNECTOR AND CIRCUIT BOARD DEVICE USING INTER-BOARD COUPLING CONNECTOR

Package substrate with a conductive connecting pin

Terminal having bus bar

Optical semiconductor device with flexible substrate

SMT/DIP TYPE CONNECTOR STRUCTURE HAVING AT LEAST THREE ROWS OF TERMINALS

Method and apparatus of changing PCB pad structure to increase solder volume and strength

Light emission device

Conductive pin attached to package substrate

Low profile coil-wound bobbin

Cable assembly having connector with interior printed circuit board facilitating termination

Probe card assembly and kit, and methods of making same

Signal connecting component

SOLDERING PAD AND CIRCUIT BOARD UTILIZING THE SAME

Zero-reflow TSOP stacking

Circuit board and electronic device using the same

CIRCUIT MODIFICATION DEVICE FOR PRINTED CIRCUIT BOARDS

Printed wiring board solder pad arrangement

Protection circuit assembly and battery pack having the same

Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards

Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments

WIRING WORK SUPPORT DEVICE

Printed circuit board assembly

SURFACE-MOUNTED CIRCUIT BOARD MODULE AND PROCESS FOR FABRICATING THE SAME

System and method for mounting shielded cables to printed circuit board assemblies

PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND CONNECTOR

Method for producing an electronic module by means of sequential fixation of the components, and corresponding production line

Interconnecting device and method used to electrically mount a daughter board to a motherboard

ELECTRONIC PACKAGE STRUCTURE

PRINTED CIRCUIT BOARD, METHOD OF MOUNTING SURFACE MOUNTED DEVICES ON THE PRINTED CIRCUIT BOARD AND LIQUID CRYSTAL DISPLAY INCLUDING THE PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD UNIT AND METHOD OF MAKING THE SAME

METHOD FOR PRODUCING AN ELECTRONIC MODULE BY SEQUENTIAL FIXATION OF THE COMPONENTS

Conductive connecting pin and package substrate

Substrate pad structure

Printed wiring board, air conditioner, and method of soldering printed wiring board

BUS BAR TO PRINTED CIRCUIT BOARD INTERFACE FOR ELECTRIC AND HYBRID ELECTRIC VEHICLES

Electronic-component-mounting board

Printed circuit board and display apparatus having the same

Connecting structure of printed circuit board for coaxial cable

Electronic device mounting structure for busbar

Conductive connecting pins for a package substrate

Camera module and mobile terminal unit

Electronic assembly having spring-loaded contact bridge with fuse function

Radio frequency identification (RFID) tag lamination process using liner

Substrate with pin, manufacturing method thereof, and semiconductor product

Arrangement of at least one power semiconductor module and a printed circuit board

Multi-chip semiconductor device having leads and method for fabricating the same

Connector assembly with improved solder tails

Rugged Chip Packaging

Gooseneck microphone with covering member in output module

PAD AND CIRCUIT BOARD, ELECTRONIC DEVICE USING SAME

Circuit board assembly

WIRING SUBSTRATE AND CURRENT DETECTION DEVICE

Connector device, method of manufacturing the same, and battery pack using the same

SUBSTRATE WITH PIN, WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

Electronic component mounting structure

Conductive dome probes for measuring system level multi-GHZ signals

Mounting board including a flat-type electrical element and capable of being reduced in size, and lead-attached electric element that is flat in shape and has a lead bonded to each electrode face

Contact carriers (tiles) for populating larger substrates with spring contacts

Method for mounting a semiconductor package onto PCB

Stacked module connector

Motor

Contact lead

Electronic component for an electronic carrier substrate

Probe card assembly and kit

ELECTRONIC PACKAGE STRUCTURE

Printed circuit board, light emitting apparatus having the same and manufacturing method thereof

PRINTED CIRCUIT BOARD CONNECTORS AND METHODS OF MANUFACTURING THE SAME

Thin wafer detectors with improved radiation damage and crosstalk characteristics

Printed Circuit Board Connectors and Methods of Manufacturing the Same

METHODS OF MANUFACTURING PRINTED CIRCUIT BOARD ASSEMBLY

Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering

Surface mounting piezoelectric oscillator

Cable assembly with wire management board and method of manufacturing the same

Method for soldering charge coupled device and tooling thereof

POP package and method of fabricating the same

Soldering method and laser soldering apparatus

PROCESS AND APPARATUS FOR JOINING AT LEAST TWO ELEMENTS

Connector and portable electronic device using the same

System and method for reducing stress-related damage to ball grid array assembly

Surface mount attachment of components

Connecting structure for cold cathode fluorescent tubes of backlight module

Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments

Optoelectronic module

Light-emitting heat-dissipating device and manufacturing method thereof

Surface mounting lug terminal and method for mounting the same

Surface mounting structure for electronic component

System component of a control device

SEMICONDUCTOR PACKAGE AND METHOD OF MOUNTING THE SAME

Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component

Circuit board including hybrid via structures

Multilayer electronic component, electronic device, and method for manufacturing multilayer electronic component

System and method of attaching an integrated circuit assembly to a printed wiring board

Leaded Package Integrated Circuit Stacking

Molded SiP package with reinforced solder columns