Modification of solder alloy compositions to suppress interfacial void formation in solder joints

SOLDER JOINT STRUCTURE, SOLDERING METHOD, AND ELECTRONIC-COMPONENT MANUFACTURING APPARATUS USING THE SAME STRUCTURE AND THE METHOD

Materials for use with interconnects of electrical devices and related methods

Method of bonding a solder ball and a base plate and method of manufacturing packaging structure of using the same

SOLDER PASTE COMPOSITION, SOLDER PRECOATING METHOD AND MOUNTED SUBSTRATE

Reducing joint embrittlement in lead-free soldering processes

MODULE

Solder alloy, electronic board using the solder alloy, and method of manufacturing the electronic board

Semiconductor device having elastic solder bump to prevent disconnection

Soldering an electronics package to a motherboard

Automated ball mounting process with solder ball testing

Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering

Wafer-level interconnect for high mechanical reliability applications

Nanoscopic Assurance Coating for Lead-Free Solders

Technique for laminating multiple substrates

Reactive Multilayer Joining WIth Improved Metallization Techniques

MOUNTING STRUCTURE

Lead-free solder alloy

Tin-Based Plating Film and Method for Forming the Same

Paste for soldering and soldering method using the same

Solder, and mounted components using the same

Method of Joining Using Reactive Multilayer Foils With Enhanced Control of Molten Joining Materials

Semiconductor device having improved contacts

Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of passive element device

Temporary chip attach using injection molded solder

Method of soldering component to substrate and electronic device made by the same

Structure of circuit board

Semiconductor power module including epoxy resin coating

Solder ball assembly for a semiconductor device and method of fabricating same

Solder paste and electronic device

Multilayer printed wiring board and component mounting method thereof

Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders

Reactive foil assembly

Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip

Method for diffusion soldering

Soldering structure of through hole

Circuit device and method of manufacturing the same

Capacitor attachment method

Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

Semiconductor device with an improved solder joint

LEAD-FREE SOLDER REWORKING SYSTEM AND METHOD THEREOF

WAVE SOLDER APPARATUS

Method for forming multi-layer bumps on a substrate

Joining method, method of mounting semiconductor package using the same, and substrate-joining structure prepared by the joining method

Apparatus for solder crack deflection

Printed circuit board for semiconductor package and method of manufacturing the same

Soldering method

Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present

Method for joining electronic parts finished with nickel and electronic parts finished with electroless nickel

Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same

Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same

Wiring board, electronic component mounting structure, and electronic component mounting method

Low Profile Stacking System and Method

Low Profile Stacking System and Method

Method for converting electrical components

Semiconductor assembly having substrate with electroplated contact pads

Soldering method

Lighting device of discharge lamp, illumination apparatus and illumination system

CIRCUIT BOARD,METHOD OF MOUNTING SURFACE MOUNTING COMPONENT ON CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT USING THE SAME CIRCUIT BOARD

Junction structure for a terminal pad and solder, and semiconductor device having the same

Semiconductor device with solder balls having high reliability

Methods and apparatus for assembling a printed circuit board

Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same

Conductive ball, formation method for electrode of electronic component, electronic component and electronic equipment

Intermetallic solder with low melting point

Solder joint intermetallic compounds with improved ductility and toughness

Lead-free solder ball

Structure and method for reducing warp of substrate

Grid array package using tin/silver columns

External contact material for external contacts of a semiconductor device and method of making the same

Semiconductor device and automotive AC generator

Lead-containing solder bumps

Lead-containing solder paste

Lead-containing anodes

Ternary alloy column grid array

Method of packaging and interconnection of integrated circuits

Method And Device For Enhancing Solderability

Semiconductor device with improved contacts

Bulk metallic glass solder material

Solder composition for electronic devices

Electronic component and electronic configuration

Semiconductor package having lead free conductive bumps and method of manufacturing the same

Lead-free semiconductor package

Semiconductor device and system having semiconductor device mounted thereon

Soldering method for semiconductor optical device, and semiconductor optical device

Solder paste and printed circuit board

Lead-free semiconductor device

Electronic component and electronic configuration

Reflow soldering method using Pb-free solder alloy and hybrid packaging method and structure

Substrate for mounting electronic part and electronic part

Semiconductor package repair method

Methods of refining lead-containing materials

Method of manufacturing an ink-jet assembly

Semiconductor device and manufacturing method thereof

Semiconductor device and unit equipped with the same

Method for reducing stress between substrates of differing materials

Semiconductor device and method for producing the same

Semiconductor device having a particular electrode structure

High temperature, stable SiC device interconnects and packages having low thermal resistance

Solder composition

Electronic device

Zinc-aluminum solder alloy

Pb-free solder-connected structure and electronic device

Electronic device and manufacturing method of the same

Lead-free solder alloy

Lead-free solder and soldered article

Method of making a circuitized substrate having a plurality of solder connection sites thereon

Method and structure to reduce risk of gold embrittlement in solder joints

Wiring board and method for producing same

Wiring board with semiconductor component

Film circuit substrate having Sn-In alloy layer

Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

Whisker-free lead frames

Low melting-point solders, articles made thereby, and processes of making same

Doped contact formations

Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders

Method of making a solder ball

Low temperature PB-free processing for semiconductor devices

Thermal fatigue resistant tin-lead-silver solder

Electronic parts assembling and testing method, and electronic circuit baseboard manufactured by the method

Semiconductor attachment method

Semiconductor device and manufacturing method of the same

Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present

Semiconductor device and manufacturing method thereof

Mixed alloy lead-free solder paste

Lead-free solder pastes with increased reliability

Method of replenishing an oxidation suppressing element in a solder bath

Solder and packaging therefrom

Electrocodeposition of lead free tin alloys

Lead solder indicator and method

Methods of forming vias in multilayer substrates

In-situ alloyed solders, articles made thereby, and processes of making same

Printed wiring board

Semiconductor assembly having substrate with electroplated contact pads

Method of forming a lead-free bump and a plating apparatus therefor

High density flip chip interconnections

Pre-doped reflow interconnections for copper pads

Soldering method and solder joints formed therein

Semiconductor device

Lead-free solder ball

Immersion plating and plated structures

Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board

Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device

Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip

Soldering an electronics package to a motherboard

Package structure with two solder arrays

Method of semiconductor device assembly including fatigue-resistant ternary solder alloy

Resin substrate

Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film

Ingredient analysis method and ingredient analysis apparatus

Method and structure to reduce risk of gold embrittlement in solder joints

Populated printed wiring board and method of manufacture

Method for compensating for CTE mismatch using phase change lead-free super plastic solders

Conductive material compositions, apparatus, systems, and methods

Low profile stacking system and method

Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board

Methods of forming solder areas on electronic components and electronic components having solder areas

Solder joint structure and method for soldering electronic components

Low temperature solder chip attach structure and process to produce a high temperature interconnection

Lead-free solder balls and method for the production thereof

Structure and method for lead free solder electronic package interconnections

Anti-tombstoning lead free alloys for surface mount reflow soldering

Method of joining using reactive multilayer foils with enhanced control of molten joining materials

Method and arrangement for reduced thermal stress between substrates

Lead-free solder composition for substrates

Soldering method and solder joint member

Z interconnect structure and method

Nanostructured soldered or brazed joints made with reactive multilayer foils

Bonding material and circuit device using the same

Solder composition

Tin/indium lead-free solders for low stress chip attachment

Solder pads and method of making a solder pad

Printed wiring board and electronic apparatus

Electronic package having controlled height stand-off solder joint

Method of bonding and resulting product

Connection pad for embedded components in PCB packaging

Methods of soldering and applications thereof