233883 ⎘
Apparatus or processes for manufacturing printed circuits; Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering; Solder materials or compositions; Methods of application thereof Plating of solder
Pre-Plating of Solder Layer on Solderable Elements for Diffusion Soldering
#2Composite solder balls metallised on the surface and calibrated for the assembly of electronic boards
#3Pre-plating of solder layer on solderable elements for diffusion soldering
#4Apparatus and method relating to electrochemical migration
#5Printed wiring board and method for manufacturing the same
#6Method for manufacturing printed wiring board
#7Printed wiring board and method for manufacturing printed wiring board
#8Manufacturing method of transformer circuit board and transformer thereof
#9Flexible circuit board and method for producing same
#10Circuit board, circuit module, method of manufacturing circuit board, and method of manufacturing circuit module
#11Solder-pinning metal pads for electronic components
#12Method of forming a solderable solder deposit on a contact pad
#13Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic Apparatus
#14Substrates with ultra fine pitch flip chip bumps
#15PACKAGE AND METHOD OF MANUFACTURING PACKAGE THEREOF
#16Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide
#17Liquid immersion transfer of electronics
#18Tin-based solder composition with low void characteristic
#19Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide
#20Wiring substrate and production method therefor
#21Printed wiring board, method for manufacturing printed wiring board and package-on-package
#22Wiring substrate and semiconductor device
#23Printed circuit board and method for manufacturing same
#24Process for etching a recessed structure filled with tin or a tin alloy
#25Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface
#26Wiring board and semiconductor device
#27Semiconductor device, method of manufacturing the same, and method of manufacturing wiring board
#28Packaging substrate with conductive structure
#29CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF
#30WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
#31Wiring board and method of manufacturing the same
#32Method for manufacturing semiconductor device, and semiconductor device
#33Method of manufacturing printed circuit board having buried solder bump
#34Method of fabricating wiring board and method of fabricating semiconductor device
#35Method to form solder deposits on substrates
#36Method for fabricating electrical bonding pads on a wafer
#37Printed circuit board and method of manufacturing the same
#38PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
#39Coreless packaging substrate and method for fabricating the same
#40Method of manufacturing a printed wiring board
#41Semiconductor device
#42PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#43Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface
#44Printed circuit board having a buried solder bump and a circuit layer flush with an insulating layer
#45Printed circuit board and method of manufacturing the same
#46LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE
#47Connection structure of flexible printed circuits and optical pickup device including the connection structure
#48Semiconductor device having substrate with differentially plated copper and selective solder
#49Printed circuit board, method of fabricating printed circuit board, and semiconductor device
#50Method of manufacturing wiring board having a semiconductor thereon
#51METHOD OF PRODUCING ELECTRONIC COMPONENT
#52METHOD OF FILLING VIAS WITH FUSIBLE METAL
#53Printed circuit board for a package and manufacturing method thereof
#54Method of fabricating a probe card
#55Method of manufacturing printed circuit board
#56Method for fabricating electrical bonding pads on a wafer
#57Packaging substrate having electrical connection structure and method for fabricating the same
#58Circuit board and method for fabricating the same
#59Circuit board
#60Packaging substrate with conductive structure
#61Connection structure between printed circuit board and electronic component
#62Method for manufacturing semiconductor device, and semiconductor device
#63SOLDERING STRUCTURE BETWEEN CIRCUIT BOARDS
#64Circuit board surface structure
#65Circuit board surface structure and fabrication method thereof
#66Method of manufacturing semiconductor device
#67Circuit board structure
#68Producing method of wired circuit board
#69Reverse build-up process for fine bump pitch approach
#70System and method for solder bump plating
#71Low fabrication cost, high performance, high reliability chip scale package
#72Tin-Based Plating Film and Method for Forming the Same
#73Electrically connecting terminal structure of circuit board and manufacturing method thereof
#74Manufacturing method package substrate
#75Gold-containing solder deposit, method for production thereof, soldering method and use
#76Methods for repairing circuit board having defective pre-soldering bump
#77Multilayer interconnection substrate and method of manufacturing the same
#78Method for forming metal bumps
#79LAMINATED IC PACKAGING SUBSTRATE AND INTER-CONNECTOR STRUCTURE THEREOF
#80Method for fabricating circuit board with conductive structure
#81Joining method, method of mounting semiconductor package using the same, and substrate-joining structure prepared by the joining method
#82Printed circuit board for semiconductor package and method of manufacturing the same
#83Optical disc drive apparatus, flexible printed circuit board joint structure, and joint structure of flexible printed circuit boards for optical pickup
#84Conductive structures for electrically conductive pads of circuit board and fabrication method thereof
#85Tin and tin alloy electroplating method with controlled internal stress and grain size of the resulting deposit
#86METHOD FOR MANUFACTURING WIRING BOARD
#87Circuit substrate manufacturing method
#88Aqueous solution for surface treatment of metal and method for preventing discoloration of metal surface
#89Pre-solder structure on semiconductor package substrate and method for fabricating the same
#90Substrate for pre-soldering material and fabrication method thereof
#91Method of fabricating wiring board and method of fabricating semiconductor device
#92Method for manufacturing bonded substrates and substrates for use in the bonded substrates
#93Fabricating process of an electrically conductive structure on a circuit board
#94Fabrication method of conductive bump structures of circuit board
#95FINE PAD PITCH ORGANIC CIRCUIT BOARD WITH PLATING SOLDER AND METHOD FOR FABRICATING THE SAME
#96Substrate bump formation
#97Printed circuit board having reduced mounting height
#98Circuit boards, electronic devices, and methods of manufacturing thereof
#99Method of making a circuitized substrate having a plurality of solder connection sites thereon
#100Film circuit substrate having Sn-In alloy layer
#101Method for fabricating connection terminal of circuit board
#102Method for fabricating electrical connection structure of circuit board
#103Method for fabricating conductive bump of circuit board
#104Method for fabricating electrical connections of circuit board
#105Electrocodeposition of lead free tin alloys
#106Method for fabricating electrical connection structure of circuit board
#107Method for forming bump on electrode pad with use of double-layered film
#108Conductive fine particles, method for plating fine particles, and substrate structural body
#109PIN GRID ARRAY PACKAGE CARRIER AND PROCESS OF MOUNTING PASSIVE COMPONENT THEREON
#110Immersion plating and plated structures
#111Low fabrication cost, high performance, high reliability chip scale package
#112BUMPING PROCESS, BUMP STRUCTURE, PACKAGING PROCESS AND PACKAGE STRUCTURE
#113Low fabrication cost, high performance, high reliability chip scale package
#114Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
#115Connection structure of rigid printed circuit board and flexible circuit, the connection process and the circuit module using it
#116Pre-solder structure on semiconductor package substrate and method for fabricating the same
#117Circuit substrate manufacturing method
#118Method and apparatus for the production of an electronic component with external contact areas
#119Substrate for pre-soldering material and fabrication method thereof
#120Flexible substrate and a connection method thereof that can achieve reliable connection