Substrate material for an hdd suspension

Flexible circuit

Metal wiring, method of forming the metal wiring, display substrate having the metal wiring and method of manufacturing the display substrate

Printed wiring board, method for manufacturing same, and circuit device

Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor

Apparatus and method incorporating discrete passive components in an electronic package

High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof

Method of manufacturing wiring board

Wired circuit board

Circuit substrate and method of manufacture

Printed wiring board, its manufacturing method, and circuit device

Thin film-capacitor-embedded printed circuit board and method of manufacturing the same

Method for producing a printed circuit board

Printed circuit board with film capacitor embedded therein and method for manufacturing the same

Integrated circuit support structures and their fabrication

Method of metallizing a silicone rubber substrate

Method for fabricating metal wires

Circuit substrate

Method of preparing a metal-silicone rubber composite

Reactively formed integrated capacitors on organic substrates and fabrication methods

Copper conducting wire structure and fabricating method thereof

Etchant rinse method

Conductive sheet having conductive layer with improved adhesion and product including the same

Method of manufacturing a film printed circuit board

Wiring line structure and method for forming the same

Structure for mounting semiconductor part in which bump and land portion are hardly detached from each other and method of manufacturing mounting substrate used therein

Electrical connector structure of circuit board and method for fabricating the same

Multilayer printed wiring board and a process of producing same

Method of manufacturing wiring board

Method of manufacturing a multilayer wiring board

Wiring board and production method thereof

Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same

Soft thin laminated substrate

Flexible circuits and method of making same

Flexible electronic circuit articles and methods of making thereof

Copperless flexible circuit

Roughened printed circuit board

Thin film circuit integrating thick film resistors thereon

Metal coated substrate and manufacturing method of the same

Wiring board and method for producing same

Ceramic thin film on base metal electrode

Method for manufacturing a bump-attached wiring circuit board

Printed circuit board and method of fabricating same

Polyimide film and polyimide composite sheet

Wiring board, method of manufacturing the same, and semiconductor device

Substrate with many via contact means disposed therein

Film multilayer body and flexible circuity board

Laminate for flexible printed circuit board comprising tie layer of ternary copper alloy

Method for fabricating a high-frequency and high-power semiconductor module

Method and apparatus for laminating a flexible printed circuit board

Method and apparatus for providing a deposition in vacuum for laminating a circuit board

Semiconductor package having protective layer for re-routing lines and method of manufacturing the same

Multilayer printed wiring board and a process of producing same

Printed circuit board and method for manufacturing printed circuit board

Method for making a circuit plate

Wired circuit forming board, wired circuit board, and thin metal layer forming method

Polyimide metal laminate and its production method

Method for pattern metalization of substrates

Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same

Wired circuit board and production method thereof

Board for printed wiring, printed wiring board, and method for manufacturing them

Wiring substrate and method using the same

Metallized polyimide film and manufacturing method therefor

Transparent, electrically conductive, coated polyester film, process for its production, and its use

Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board

Method for pattern metalization of substrates

Device with through-hole interconnection and method for manufacturing the same

Flexible printed circuit board and process for producing the same

Metallized polymide film

Production method of suspension board with circuit

Semiconductor device with intermediate connector

Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor

Double sided wired circuit board

Process for forming metal layers

Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same

Thin film circuit board device and method for manufacturing the same

Stitched micro-via to enhance adhesion and mechanical strength

Method of fabricating a thin film integrated circuit with thick film resistors

Suspension board with circuit and producing method thereof

Interconnection circuit and electronic module utilizing same

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Conductive sheet having conductive layer with improved adhesion and product including the same

Copper-clad laminate

Multilayered substrate for semiconductor device and method of manufacturing same

Multilayer wiring board and manufacture method thereof

Configuration and method for manufacturing filters comprising LC circuit