High impedance electromagnetic surface and method

Multi-layered printed circuit board embedded with filter

PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITORS USING HYBRID MATERIAL AND METHOD OF MANUFACTURING THE SAME

Rigid flex interconnect via

Circuit substrate and manufacturing method thereof

Multilayered wiring board and method for fabricating the same

Multilayer circuit board and method for manufacturing the same

Multilayer printed wiring board and method for producing the same

Ferrite material and ceramic substrate

Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications

Hard disk drive and wireless data terminal using the same

Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein

Method of manufacturing wiring board

Method of fabricating a high-layer-count backplane

Multilayer laminated circuit board

Flexible wiring board and flex-rigid wiring board

Methods for forming multilayer structures

Method and apparatus for marking a printed circuit board

High frequency circuit module

Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors

Multi-layer substrate having conductive pattern and resin film and method for manufacturing the same

Wiring board and method for manufacturing the same

Integrated circuit package substrate having a thin film capacitor structure

Graded liquid crystal polymer package

Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same

Method of making a multi-chip electronic package having laminate carrier

Thick film paste via fill composition for use in LTCC applications

Method of forming metal interconnect layers for flip chip device

Wiring board and circuit apparatus

Circuit board and production method therefor

Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs

Insulating substrate and manufacturing method therefor, and multilayer wiring board and manufacturing method therefor

Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof

Circuit board, electronic device employing circuit board, and mehtod of producing circuit board

Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate

Electrostatic discharge protection for embedded components

Layered board and manufacturing method of the same, electronic apparatus having the layered board

Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure

Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure

Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure

Method for producing a ceramic substrate

Printed wiring board

Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure

Method for producing laminated dielectric

Printed circuit board having colored outer layer

Materials, structures and methods for microelectronic packaging

Method of forming a multi-layer printed circuit board and the product thereof

Integrated patch antenna and electronics assembly and method for fabricating

Composite laminate and method for manufacturing the same

Substrate having a functionally gradient coefficient of thermal expansion

Printed circuit board including embedded capacitors and method of manufacturing the same

Stacked chip electronic package having laminate carrier and method of making same

Device mounting board

Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods

Method of fabricating a circuit board

Layered board and manufacturing method of the same, electronic apparatus having the layered board

Circuit device and manufacturing method thereof

Method of making an electronic package

Multiple propagation speeds of signals in layered circuit apparatus

Device mounting board

Electronic circuit board having microstrip lines

Laminate ceramic circuit board and process therefor

Integrated circuit package with low modulus layer and capacitor/interposer

Electronic package with optimized lamination process

Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same

Multilayer wiring board incorporating carbon fibers and glass fibers

Microwave circuit

Maximizing capacitance per unit area while minimizing signal transmission delay in PCB

High frequency module board device

Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making

Printed circuit board substrate and method for constructing same

Signal line circuit device

Laminated plate and part using the laminated plate

Surface mounting of components

High-frequency module, and method of producing same

Integrated circuit package substrate having a thin film capacitor structure

Integrated circuit package substrate having a thin film capacitor structure

Capacitor and method for manufacturing the same

Multilayer wiring circuit board

Capacitor and method of producing same

Multi-layered interconnect structure using liquid crystalline polymer dielectric

High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same

Circuit board

Method of fabricating a high-layer-count backplane

Laminated wiring board and its mounting structure

Method of forming a multi-layer printed circuit board and the product thereof

Package for semiconductor devices

Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards

Metal-free monolithic epitaxial graphene-on-diamond PWB with optical waveguide