234156 ⎘
Constructional details common to different types of electric apparatus; Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
ELECTRONIC CONTROL DEVICE
#302Thermally enhanced electronic package
#303Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same
#304Power module, power converter device, and electrically powered vehicle
#305Printed circuit board with fins
#306Heat-dissipating module and electronic device using same
#307Device for electromagnetic shielding and dissipation of heat released by an electronic component, and corresponding electronic circuit
#308Thermal management of electronic devices
#309Apparatus and methods for thermal management of electronic devices
#310Thermal interface members for removable electronic devices
#311HEAT DISSIPATING SUBSTRATE
#312Heat dissipating circuit board and method of manufacturing the same
#313Control unit housing
#314Method for manufacturing a ceramic elements module
#315Circuit board structure having measures against heat
#316Housing for electronic ballast
#317Complete power management system implemented in a single surface mount package
#318Electric control unit having a housing part and a cooling part
#319Systems and methods for printed board assembly isolated heat exchange
#320Circuit board assembly
#321Electrical connector and heat sink
#322ELECTRONIC CONTROL DEVICE
#323Thermal management of electronic devices
#324Thermal dissipation heat slug sandwich
#325Thermal management of electronic devices
#326ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING
#327Structure and manufacturing method of substrate board
#328Electronic-component-mounting board
#329Apparatus and methods for thermal management of electronic devices
#330Structure and method for efficient thermal dissipation in an electronic assembly
#331Circuit Carrier Structure with Improved Heat Dissipation
#332Multi-layer electrically isolated thermal conduction structure for a circuit board assembly
#333Thermal energy removal structure and method
#334Light source module with high heat-dissipation efficiency
#3353-dimensional multi-layered modular computer architecture
#336Printed circuit (PC) board module with improved heat radiation efficiency
#337HEAT-DISSIPATING MODULE
#338Method and System of Heat Conductor
#339DISPLAY DEVICE
#340Printed circuit board having vertical heat dissipating element
#341Thermal Management system and method for semiconductor lighting systems
#342Method and structure for RF antenna module
#343Electronic Apparatus
#344ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING
#345Semiconductor device having a mount board
#346Device for increased thermal conductivity between a printed wiring assembly and a chassis
#347Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards
#348Wiffle tree components, cooling systems, and methods of attaching a printed circuit board to a heat sink
#349Light treatment head
#350Heat dissipation system for a miniaturized form factor communications card
#351Ceramic foam cold plate
#352Electronic device
#353Arrangement for cooling SMD power components on a printed circuit board
#354Circuit board structure with heat radiating layer
#355Semiconductor device having a mount board
#356Printed circuit board with a heat dissipation device
#357Flexible circuit board with heat sink
#358Complete power management system implemented in a single surface mount package
#359Complete power management system implemented in a single surface mount package
#360Heat dissipating assembly for a heat element
#361Electronic assembly with a heat sink in particular for a discharge lamp control module for motor vehicle headlights
#362Surface mount heat sink
#363Heat management in circuit card assemblies
#364Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device
#365Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink
#366Portable power amplifier
#367Electrical assemblage and method for removing heat locally generated therefrom
#368Cooling structure for electronic element
#369Thermal interposer for electronic device
#370Flexible circuit board and heat spreader thereof
#371Thermal management assemblies for electronic assemblies circumferentially mounted on a motor
#372Method and apparatus for separating a thermal load path from a structural load path in a circuit board environment
#373Monolithic signal carrier device implemented in cryogenic quantum computing applications
#374Dissipating heat using phase change material
#375Unibody thermal enclosure
#376Electronic components
#377Power management and distribution system and method
#378Power management and distribution system and method
#379Junction box thermal management