234156 ⎘
Constructional details common to different types of electric apparatus; Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
ELECTRONIC DEVICE
#2System and Method for Thermal Management for Circuit Breaker Panel
#3Power Conversion Module And Uninterruptible Power Supply
#4TEST DEVICE FOR TESTING STORAGE DEVICE, TEST RACK, AND TEST SYSTEM INCLUDING TEST DEVICE
#5LIGHT VALVE MODULE AND PROJECTION DEVICE
#6MOTOR CONTROLLER HEAT DISSIPATING SYSTEMS AND METHODS
#7OPTICAL MODULE CAGE INCLUDING METAL PAD
#8HEAT DISSIPATING ASSEMBLY FOR CIRCUIT
#9Heatsink techniques for optical and electrical modules
#10WEARABLE ELECTRONIC DEVICE COMPRISING HEAT TRANSFER MEMBER
#11PERSONAL CARE COMPOSITIONS INCLUDING ANTIPERSPIRANT, DEODORANT, AND ASTRINGENT COMPOSITIONS
#12SOLID STATE TRANSFORMER AND STACK-UP STRUCTURE OF PRINTED CIRCUIT BOARD THEREOF
#13Information handling system hybrid heat block keyboard
#14Direct Contact Fluid Based Cooling Module
#15SYSTEMS AND METHODS OF 3D-PRINTING A CIRCUIT BOARD ON A HEAT SINK ASSEMBLY HAVING POWER DEVICES BONDED THERETO
#16SYSTEM AND METHOD TO HELP MITIGATE HEAT IN AN ELECTRONIC DEVICE
#17ELECTRONIC APPARATUS
#18PROCESSOR UNIT WITH ACTIVE COOLING SYSTEM FOR PROCESSOR DEVICE
#19DUAL MODE COOLING SYSTEM FOR USE WITH IN-WALL VIDEO-CODEC AND OTHER ELECTRONIC CIRCUITS
#20PASSIVE THERMAL-CONTROL STRUCTURE FOR SPEAKERS AND ASSOCIATED APPARATUSES AND METHODS
#21INVERTER WITH CLOSED COOLING CHANNEL
#22CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
#23HETEROGENOUS MULTI-LAYER STRUCTURE
#24Heatsink techniques for optical and electrical modules
#25ELECTRONIC DEVICE WITH BELOW PCB THERMAL MANAGEMENT
#26SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
#27SYSTEMS AND METHODS FOR COOLING A WIRELESS CHARGING SYSTEM
#28SEMICONDUCTOR MEMORY DEVICE
#29LIQUID COOLED ELECTRONIC DEVICE
#30HEAT EXCHANGER ASSEMBLY
#31HEAT TRANSFER DEVICES FOR ENHANCED THERMAL PERFORMANCE OF ELECTRONIC SYSTEMS
#32DATA THROUGHPUT USING A METAL BRACKET
#33Heat dissipation device of electronic equipment
#34Method and apparatus for managing heat distribution in a semiconductor device
#35Packaged Device, Packaged Module, and Power Conversion Device
#36ELECTRONIC DEVICE AND PRODUCT
#37SURGE SUPPRESSION DEVICE
#38LIQUID-COOLING HEAT DISSIPATION DEVICE, CABINET, AND SYSTEM
#39HEAT CONDUCTING MEMBER, OPTICAL MODULE, HEAT SINK, AND METHOD FOR PREPARING HEAT CONDUCTING MEMBER
#40MECHANICALLY FIXING CIRCUIT BOARDS IN A MOTOR
#41Dual mode cooling system for use with in-wall video-codec and other electronic circuits
#42Cooling system and methods
#43COOLING SYSTEM AND METHODS
#44COOLING SYSTEM AND METHODS
#45Cooling system and methods
#46Self-aligning heat fins for thermal management
#47Heat transfer interfaces for circuit card assembly (CCA) modules
#48SYSTEM AND METHOD FOR FAN-LESS THERMAL MITIGATION FOR INDUSTRIAL-GRADE APPLIANCES
#49INTEGRATED VAPOR CHAMBER AND HEAT SINK
#50LAMINATE SUBSTRATE WITH EMBEDDED MULTI-LAYERED HEAT SLUG
#51ELECTRIC CONTROL COMPONENT, AIR CONDITIONER HAVING SAME, AND ASSEMBLY METHOD FOR ELECTRIC CONTROL COMPONENT
#52HEAT DISSIPATION MODULE AND POWER CONVERSION DEVICE COMPRISING SAME
#53Photosensitive assembly, camera module and electronic device
#54Memory system and label component
#55Circuit card assembly (CCA) module thermal interface devices
#56Electronic device
#57Power electronics cooling assemblies and methods for making the same
#58Electronic device
#59HANDHELD ELECTRONIC DEVICE
#60HANDHELD ELECTRONIC DEVICE
#61Handheld electronic device
#62Mobile terminal
#63ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD MODULE
#64HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE ADOPTING THE SAME
#65LIQUID COOLING PLATE RADIATOR AND COMPUTING DEVICE
#66CIRCUIT CARD ASSEMBLIES
#67CONTROLLED-FORCE THERMAL MANAGEMENT DEVICE INSTALLATION
#68Mechanical device for cooling an electronic component
#69COOLING SYSTEM
#70DIMM COOLING ASSEMBLY WITH HEAT SPREADER ANTI-ROTATION MECHANISM
#71Heat sink integrated insulating circuit board
#72Heat Sink Component With Land Grid Array Connections
#73ELECTRONIC CONTROL DEVICE WITH IMPROVED COOLING OF COMPONENTS
#74Electronic control device
#75Thermal press-fit terminal
#76Ceramic circuit board, heat-dissipating member, and aluminum-diamond composite
#77Host electronic device having a movable cooling component for removable electronic device
#78Systems and methods of 3D-printing a circuit board on a heat sink assembly having power devices bonded thereto
#79HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE
#80Electronic device including heat dissipation structure
#81Thermal management of circuit boards
#82ELECTRONIC DEVICE
#83Heat Sink
#84Electronic device comprising heat radiating structure
#85Electronic device
#86Direct contact fluid based cooling module
#87HEAT DISSIPATION APPARATUS, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
#88Heat sinks with beyond-board fins
#89Memory system and label component
#90Power electronics module with improved cooling
#91Heat-conducting assembly and terminal
#92Electromagnetic interference shielding and thermal management systems and methods for automotive radar applications
#93Apparatus for heat management in an electronic device
#94Flexible circuit board with thermally conductive connection to a heat sink
#95Driver board assemblies and methods of forming a driver board assembly
#96HEAT DISSIPATION PLATE
#97Metal member-equipped circuit board, circuit assembly, and electrical junction box
#98Thermal-control system of a video-recording doorbell and associated video-recording doorbells
#99Electronic device with heat-conductive cover
#100Separating temperature domains in cooled systems
#101Vehicular camera with enhanced heat dissipation
#102Circuit board and method for manufacturing circuit board
#103Vehicular camera module
#104Thermal-control system of a video-recording doorbell and associated video-recording doorbells
#105Connector assembly
#106Electronic apparatus and structure
#107Power overlay module and method of assembling
#108Power electronics cooling assemblies and methods for making the same
#109Notebook computer cooler using thermoelectric element
#110Board housing case
#111Passive thermal-control structure for speakers and associated apparatuses and methods
#112Passive thermal-control structure for speakers and associated apparatuses and methods
#113Thermal management of circuit boards
#114System device aggregation in a liquid cooling environment
#115Circuit connection module
#116Heat dissipation structure and electronic device adopting the same
#117Integrated circuit / printed circuit board assembly and method of manufacture
#118Semiconductor module and vehicle
#119Electronic control device having a heat radiation structure
#120Motor controller heat dissipating systems and methods
#121Cooling mechanism for electrionic component mounted on a printed wiring board
#122HEAT SINK DEVICE PROVIDED WITH A SECONDARY COLD PLATE
#123Electric power converter
#124Heat dissipation device
#125ELECTRONIC DEVICE
#126ELECTRONIC DEVICE
#127Heat dissipation device having shielding/containment extensions
#128CONNECTOR
#129Integrated circuit / printed circuit board assembly and method of manufacture
#130Electronic assembly having sectional thermal management
#131System and method to help mitigate heat in an electronic device
#132METAL MEMBER-EQUIPPED CIRCUIT BOARD, CIRCUIT ASSEMBLY, AND ELECTRICAL JUNCTION BOX
#133Heat exchange assembly for a communication system
#134Secondary side heatsink techniques for optical and electrical modules
#135Vehicular camera with enhanced heat dissipation
#136Power module including a carrier assembly with combination of circuit board and lead frame
#137Multi-chip package with partial integrated heat spreader
#138Heat dissipation device
#139Printed wiring board having thermoelectric emlement accommodatred therein
#140Heat-conducting assembly and terminal
#141Modular electronically scanned array (ESA)
#142Electronic device comprising heat transfer member having metal plate and heat transfer material coupled thereto
#143Camera module for vehicular vision system
#144HEAT DISSIPATION DEVICE AND ELECTRONIC DEVICE
#145Heat dissipation structure and heat dissipation method
#146Electronic control device
#147Direct contact fluid based cooling module
#148Thermal management of electronics using co-located microjet nozzles and electronic elements
#149Circuit board module and heat-dissipating board structure thereof
#150Methods and systems for thermal control
#151Electrically insulating thermal connector having a low thermal resistivity
#152THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
#153Rotatable water-cooling tube and electronic device with same
#154HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION METHOD OF ELECTRONIC DEVICE
#155Thermal management for modular electronic devices
#156Electronic device comprising heat dissipation structure
#157Fixing device for double sided heat sink and associated heat dissipating system
#158Vehicular sensing device with cooling feature
#159Electronic equipment
#160Plug assembly
#161Plug assembly
#162Power module, power converter device, and electrically powered vehicle
#163Power semiconductor device and method for manufacturing power semiconductor device
#164Cooling of power electronics circuits
#165Electronic device and rigid-flexible substrate module
#166HANDHELD COMMUNICATION DEVICE AND THIN HEAT DISSIPATING STRUCTURE THEREOF
#167Mounting assembly with a heatsink
#168Compact thermally efficient traction motor inverter
#169Camera for vehicle vision system with enhanced heat removal
#170Camera for vehicle vision system with enhanced alignment features
#171Power circuit device
#172Flame retardant structure for electronic component
#173Electrically insulating thermal connector having a low thermal resistivity
#174CIRCUIT STRUCTURE
#175Electrical unit
#176Thermal cooling system
#177Device array backframe with integral manifolding for high performance fluid cooling
#178Heat-dissipating structure of electronic device
#179Combination parallel path heatsink and EMI shield
#180Semiconductor device
#181Control device for a gearbox control system of a motor vehicle
#182Electronic device with laterally extending thermally conductive body and related methods
#183Variable thermal resistance
#184PCB MODULE WITH MULTI-SURFACE HEAT DISSIPATION STRUCTURE, HEAT DISSIPATION PLATE USED IN PCB MODULE, MULTI-LAYER PCB ASSEMBLY, AND MODULE CASE
#185Circuit assembly and electrical junction box
#186Electrical junction box with removable sealing cover
#1873-dimensional multi-layered modular computer architecture
#188Power module, power converter device, and electrically powered vehicle
#189SUBSTRATE UNIT AND METHOD OF MANUFACTURING SUBSTRATE UNIT
#190Power conditioner
#191Storage device
#192Adapter cooling apparatus and method for modular computing devices
#193System and method for thermal management of electronic devices
#194Conformable thermal bridge
#195Thermal clamp for cyrogenic digital systems
#196Combination parallel path heatsink and EMI shield
#197Heat dissipation for substrate assemblies
#198Heat spreader and power module
#199Parallel heat spreader
#200Double insulated heat spreader
#201CONTROL OF THERMAL ENERGY TRANSFER FOR PHASE CHANGE MATERIAL IN DATA CENTER
#202Power module, power converter device, and electrically powered vehicle
#203Semiconductor memory device
#204Electronic assembly with one or more heat sinks
#205Thermally conductive and vibration damping electronic device enclosure and mounting
#206INTEGRATED THERMAL EMI STRUCTURE FOR ELECTRONIC DEVICES
#207Packaging Structure and Optical Module Using the Same
#208Electronic module with laterally-conducting heat distributor layer
#209Power module
#210Electric power converter
#211ELECTRONIC DEVICE
#212Power module, power converter device, and electrically powered vehicle
#213Activity monitoring base station
#214Electrical assembly within a connector housing
#215Printed circuit board and semiconductor package
#216Method for manufacturing cooler for semiconductor-module, cooler for semiconductor-module, semiconductor-module and electrically-driven vehicle
#217ELECTRICAL CONTROL DEVICE
#218Heat dissipation assembly and portable electronic device employing same
#219Package assembly and method for manufacturing the same
#220Ganged shielding cage with thermal passages
#221Apparatus for cooling and mounting a circuit board
#222THERMAL INTERPOSER SUITABLE FOR ELECTRONIC MODULES
#223Integrated power module with improved isolation and thermal conductivity
#224EXPLOSION-PROTECTED ARRANGEMENT OF ELECTRICAL AND/OR ELECTRONIC COMPONENTS
#225Amplifier module with enhanced heat dissipating function and semiconductor device
#226Electronic device, drive apparatus having the electronic device and manufacturing method of the electronic device
#227Electronic device and drive device including the same
#228Heat transfer management apparatuses having a composite lamina
#229Silicon-based heat dissipation device for heat-generating devices
#230Heat transfer management apparatuses having a composite lamina
#231Carrier, Semiconductor Module and Fabrication Method Thereof
#232Power tool having a heat radiation member for a controller
#233Electronic device and cooling system
#234Cooling device and power module equipped with cooling device
#235Power semiconductor module
#236ELECTRONIC CIRCUIT APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT APPARATUS
#237Connector, connector assembly and apparatus
#238Serviceable electrical box thermal management
#239Wiring board and electronic device
#240FREQUENCY UP CONVERTER HAVING COMPACT SIZE AND ENHANCED HEAT EMISSION CHARACTERISTICS
#241COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MOUNT PACKAGE
#242Heat-dissipating resin composition, and component and electronic device including the same
#243Electronic device
#244Thermal management system and method
#245Conduction cooled module
#246Wiring board, method for manufacturing wiring board, and electronic device
#247Electronic device
#248Electronic system
#249Thermal interface material assemblies and related methods
#250Electronic assembly for an inverter
#251Achieving power supply and heat dissipation (cooling) in three-dimensional multilayer package
#252Semiconductor device
#253Heat dissipation for substrate assemblies
#254ELECTRONIC ASSEMBLY
#255Dissipating heat during device operation
#256Double insulated heat spreader
#257THERMAL CONNECTOR
#258Circuit board with thermal control
#259Wearable portable electronic device with heat conducting path
#260SYSTEM FOR COOLING AN INTEGRATED CIRCUIT WITHIN A COMPUTING DEVICE
#261Electronic device
#262RECTANGULAR LED LIGHTING APPARATUS
#263Thermoelectric cooler/heater integrated in printed circuit board
#264Optical module
#265Electronic device with heat dissipating electromagnetic interference shielding structures
#266SMART PHONE ON A CHIP AND METHOD MAKING SAME
#267Thermal dissipative retractable flex assembly
#268Passive cooling system integrated into a printed circuit board for cooling electronic components
#269Electronic component and fabrication process of this electronic component
#270Circuit assemblies including thermoelectric modules
#271SEMICONDUCTOR POWER MODULE, PRODUCTION METHOD OF SEMICONDUCTOR POWER MODULE AND CIRCUIT BOARD
#272METHOD OF EMBEDDING CPU/GPU/LOGIC CHIP INTO A SUBSTRATE OF A PACKAGE-ON-PACKAGE STRUCTURE
#273Circuit board structure having measures against heat
#274Electronic module with laterally-conducting heat distributor layer
#275Thermally conductive printed circuit board bumpers
#276Thermal interface for multi-chip packages
#277Solid-state drive with passive heat transfer
#278Achieving power supply and heat dissipation (cooling) in three-dimensional multilayer package
#279THERMAL SPREADER HAVING GRADUATED THERMAL EXPANSION PARAMETERS
#280Thermally enhanced electronic package
#281SHELL STRUCTURE
#282SOLID VIA PINS FOR IMPROVED THERMAL AND ELECTRICAL CONDUCTIVITY
#283Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight
#284PCB HEAT SINK FOR POWER ELECTRONICS
#285ELECTRONIC DEVICE AND HEAT SINK EMPLOYING THE SAME
#286HIGH TEMPERATURE ENVIRONMENT CAPABLE MOTOR CONTROLLER
#2873-dimensional multi-layered modular computer architecture
#288Thermal management system and method
#289METHODS AND SYSTEM FOR EFFECTIVELY REMOVING HEAT FROM A WIRELESS BASE STATION
#290Ceramic elements module
#291Thermal interface members for removable electronic devices
#292HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#293Control module for a transmission control installed in an automatic transmission
#294APPARATUS FOR MANAGING HEAT DISTRIBUTION IN AN OSCILLATOR SYSTEM
#295Circuit assemblies including thermoelectric modules
#296Printed circuit board
#297Method and system for cooling of integrated circuits
#298OPTICAL MODULE
#299Electronic module with laterally-conducting heat distributor layer
#300Electronic device