Patents-Review.com
ClassID:

234173 ⎘

H05K7/20663 - CPC Classification

Classification description:

Constructional details common to different types of electric apparatus; Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment Liquid coolant with phase change, e.g. heat pipes

Sub-classes:
Recent Application in this class:
#1
20250294704
2025-09-18

CRYOGENIC CABINET

 #2
20250169029
2025-05-22

IMMERSED LIQUID-COOLING SERVER AND WASTE HEAT RECOVERY SYSTEM THEREOF

 #3
20240341052
2024-10-10

DUAL-INVERTER ASSEMBLY

 #4
20240179875
2024-05-30

Systems and methods for cooling a fluid circuit for cooling a rack of servers

 #5
20240015929
2024-01-11

IMMERSION COOLING SYSTEM

 #6
20230088329
2023-03-23

Liquid cooling server deployment and delivery apparatus and operation

 #7
20230086534
2023-03-23

Bidirectional connector for server liquid cooling

 #8
20220354022
2022-11-03

Systems and methods for cooling a fluid circuit for cooling a rack of servers

 #9
20220053673
2022-02-17

Heat dissipation system and an associated method thereof

 #10
20210392793
2021-12-16

Switch-mode power supply waste heat recovery and utilization system

 #11
20210227723
2021-07-22

Thermal management with variable conductance heat pipe

 #12
20210185859
2021-06-17

Cooling system for edge computing device

 #13
20200401090
2020-12-24

SYSTEMS AND METHODS FOR TIERING OF HEATPIPES

 #14
20200393206
2020-12-17

Immersion cooling module and electronic apparatus having the same

 #15
20200103733
2020-04-02

PROJECTION-TYPE DISPLAY APPARATUS

 #16
20200016705
2020-01-16

THERMAL-CONTROL, TRUSS-PLATE APPARATUS AND METHOD

 #17
20200015387
2020-01-09

Cooling electronic devices in a data center

 #18
20200008321
2020-01-02

Thermal management with variable conductance heat pipe

 #19
20190369684
2019-12-05

FANLESS RAIL COOLED ELECTRONICS APPARATUS

 #20
20190293361
2019-09-26

SERVER THERMAL MANAGEMENT WITH HEAT PIPES

 #21
20190166724
2019-05-30

Liquid cooled chassis

 #22
20190049189
2019-02-14

COOLING APPARATUS FOR ELECTRONIC DEVICE WITH VAPOR-LIQUID PUMP

 #23
20190008078
2019-01-03

Heat dissipation system and an associated method thereof

 #24
20180292144
2018-10-11

Heat exchanger module

 #25
20170311485
2017-10-26

COOLING DEVICE AND METHOD OF MANUFACTURING THE SAME

 #26
20170245392
2017-08-24

Electronics rack with compliant heat pipe

 #27
20170181322
2017-06-22

Scalable rack-mount air-to-liquid heat exchanger

 #28
20170043438
2017-02-16

Method for manufacturing server room cooling apparatus and air conditioning system for data center provided with same

 #29
20160330873
2016-11-10

Cooling electronic devices in a data center

 #30
20160021791
2016-01-21

Server thermal management with heat pipes

 #31
20150351286
2015-12-03

ELECTRONIC APPARATUS COOLING SYSTEM

 #32
20150296665
2015-10-15

Cooling arrangement for components disposed in an interior of a switch cabinet

 #33
20150208551
2015-07-23

Apparatuses for Transmitting Heat Between a Rail of Rack Mounted Equipment and a Channel of a Cooling Rack Enclosure, And Related Components, Systems, and Methods

 #34
20150195949
2015-07-09

DX Cooling System for Telecommunication Shelters

 #35
20150192369
2015-07-09

Variable thickness heat pipe

 #36
20150021000
2015-01-22

CABINET FOR POWER ELECTRONIC APPARATUS

 #37
20140133099
2014-05-15

Air-cooling and vapor-condensing door assembly

 #38
20140133098
2014-05-15

Inlet-air-cooling door assembly for an electronics rack

 #39
20140133096
2014-05-15

Air-cooling and vapor-condensing door assembly

 #40
15967092
2019-06-18

Coupling designs for a data center building using indirect evaporative cooling (IDEC) units

 #41
13507593
2015-10-06

Thermal control, truss-plate apparatus and method