234174 ⎘
Constructional details common to different types of electric apparatus; Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment; Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards
METHOD AND APPARATUS FOR COOLING SYSTEM
#2HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE
#3Container for One or More Electronic Devices and Methods of Use Thereof
#4SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT
#5TWO-PHASE IMMERSION COOLING SYSTEM
#6SYSTEMS AND METHODS FOR ELECTRONICS COOLING
#7Systems and methods for electronics cooling
#8Heatsink for co-packaged optical switch rack package
#9Heatsink for co-packaged optical switch rack package
#10SERVER HEAT DISSIPATION STRUCTURE
#11Housing structure for electronic boards
#12Systems and methods for using additive manufacturing for thermal management
#13Thermal management for modular electronic devices
#14Cooling electronic devices in a data center
#15SERVER THERMAL MANAGEMENT WITH HEAT PIPES
#16Two-phase fluid-actuated cooling device, system, and method
#17Phase change cooling system and electronic device
#18Removable board with cooling system for chassis-based electronic equipment
#19Integrated card rail and cooling module for embedded computing systems
#20Sensors for cooling system fluid attributes
#21Cooling device
#22Electronics rack with selective engagement of heat sink
#23Heat-pipe heat dissipation system and power device
#24Heat relay network system for telecommunication equipment
#25Thermal management systems and methods for heat generating electronics
#26System and method for thermal management using vapor chamber
#27Thermosiphon systems for electronic devices
#28Stationary cooling structure for board/chassis-level conduction cooling
#29Cooling electronic devices in a data center
#30Method and device for cooling equipment provided with electronic boards, using at least one distinct fluid-cooled cooling board
#31Current converter apparatus having a multi-phase current converter
#32Server thermal management with heat pipes
#33Systems and methods for using additive manufacturing for thermal management
#34Reusable phase-change thermal interface structures
#35Circuit card assembly and method of fabricating the same
#36Thermosiphon systems for electronic devices
#37Server and method for cooling a server
#38Interface card cooling using heat pipes
#39Cooling an electronic device
#40Wickless heat pipe and thermal ground plane
#41Thermosiphon cooler arrangement in modules with electric and/or electronic components
#42Cabinet with modules having a thermosiphon cooler arrangement
#43Mechanically-reattachable liquid-cooled cooling apparatus
#44Thermosiphon systems for electronic devices
#45Device for cooling an electronic card by conduction comprising heat pipes, and corresponding method of fabrication
#46HEAT-TRANSFER ARRANGEMENT FOR ENCLOSED CIRCUIT BOARDS
#47Conduction cooled circuit board assembly
#48Heat dissipation device for communication chassis
#49ELECTRONIC HOUSING WITH ELECTRONIC BOARDS COMPRISING HEAT PIPES
#50Electronic equipment housing cooled by natural and forced ventilation
#51Thermal transfer technique using heat pipes with integral rack rails
#52Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
#53Liquid cooled electronic chassis having a plurality of phase change material reservoirs
#54Apparatus for cooling communication equipment using heat pipe
#55Cooling mechanisms associated with card adapter
#56Cooling apparatus, system, and associated method
#57Integrated heat removal and vibration damping for avionic equipment
#58Thermal management chassis system
#59Arrangement for cooling plug-in units arranged on top of each other in a component support or receiving housing
#60Dry-wet thermal management system
#61Container for one or more electronic devices and methods of use thereof
#62Flexible thermal cooling assembly