234189 ⎘
Constructional details common to different types of electric apparatus; Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks; Liquid cooling with phase change within server blades for removing heat from heat source
Heat conveying structure for electronic device
#302Controlling minimum air inlet temperature using waste heat
#303Cooling heat-generating electronics
#304LOOP HEAT PIPE AND STARTUP METHOD FOR THE SAME
#305Separable liquid-cooling heat-dissipation module
#306VAPOR-COMPRESSION REFRIGERATION APPARATUS WITH BACKUP AIR-COOLED HEAT SINK AND AUXILIARY REFRIGERANT HEATER
#307VAPOR-COMPRESSION REFRIGERATION APPARATUS WITH REFRGIERANT BYPASS AND CONTROLLED HEAT LOAD
#308Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling
#309Coolant-buffered, vapor-compression refrigeration apparatus and method with controlled coolant heat load
#310Heat exchange assembly with integrated heater
#311Heat dissipation structure of electronic device
#312Auxiliary device for conductively removing the heat produced by an electronic card
#313HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE INCORPORATING SAME
#314Liquid-cooled electronics rack with immersion-cooled electronic subsystems
#315Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
#316Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
#317Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
#318Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
#319COMPUTER SERVER SYSTEM AND COMPUTER SERVER THEREOF
#320Liquid cooled condensers for loop heat pipe like enclosure cooling
#321COOLING METHOD AND COOLING SYSTEM FOR ELECTRONIC DEVICE
#322Heat Dissipation Apparatus for Data Center
#323HEAT DISSIPATION APPARATUS FOR DATA CENTER
#324Heat dissipation device with parallel and perpendicular fins
#325Condenser block structures with cavities facilitating vapor condensation cooling of coolant
#326Condenser structures with fin cavities facilitating vapor condensation cooling of coolant
#327Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling
#328Condenser fin structures facilitating vapor condensation cooling of coolant
#329Passive cooling enclosure system and method for electronics devices
#330Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof
#331Heat dissipating system
#332Passive cooling system and method for electronics devices
#333Cooling manifold assembly
#334Characterization of -glycans using exoglycosidases
#335Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
#336Liquid cooling apparatus and method for cooling blades of an electronic system chassis
#337Cooling device and electronic equipment including cooling device
#338Electronic apparatus
#339Convergence of air water cooling of an electronics rack and a computer room in a single unit
#340Systems and methods for cooling a computing component in a computing rack
#341Method and apparatus for isothermal cooling of hard disk drive arrays using a pumped refrigerant loop
#342Cooling device and electronic apparatus using the same
#343Heat dissipation assembly for graphics card and blade server using the same
#344Evaporative cooling system
#345Efficiently cool data centers and electronic enclosures using loop heat pipes
#346Heat exchange system for blade server systems and method
#347COOLING DEVICE OF HEATING ELEMENT AND AN ELECTRONIC DEVICE USING THE SAME
#348Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates
#349Low-profile thermosyphon-based cooling system for computers and other electronic devices
#350Method and apparatus for cooling a blade server
#351FLEXIBLE LOOP THERMOSYPHON
#352Frame-level thermal interface component for transfer of heat from an electronic component of a computer system
#353Thermal management system and method for electronics system
#354Flexible loop thermosyphon
#355System for efficiently cooling a processor
#356Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover
#357Low-profile thermosyphon-based cooling system for computers and other electronic devices
#358Network cooling system II
#359Cooling system or electronic apparatus, and electronic apparatus using the same
#360Small form factor cooling system
#361Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling
#362Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling
#363Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling
#364Flexible loop thermosyphon
#365Water-cooled electronic system
#366Pressure relief valve and adsorbent chamber for two-phase immersion cooling systems and methods for using same
#367Two-phase cooling structure cooling within a single-phase liquid cooled server
#368Hybrid immersion cooling system
#369Liquid immersion cooling system
#370High-efficiency thermal management system and method
#371Mist cooling for computer systems
#372Integrated vapor chamber printed circuit board (PCB) assembly
#373Electrical and liquid cooling midplane
#374Stacked base heat sink with heat pipes in-line with airflow
#375Liquid chamber housings
#376Cooling electronic devices in a data center
#377Heat exchangers for cooling integrated circuits