234189 ⎘
Constructional details common to different types of electric apparatus; Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks; Liquid cooling with phase change within server blades for removing heat from heat source
R718 ENHANCED IMMERSION COOLING SYSTEM
#2INTEGRATED SINGLE-PHASE DIRECT-TO-CHIP COOLING USING R718
#3INTEGRATED TWO-PHASE DIRECT-TO-CHIP COOLING USING R718
#4REFRIGERANT MANAGEMENT SYSTEM FOR HYBRID AIR/LIQUID COOLING UNIT
#5SYSTEMS, DEVICES, AND METHODS FOR EFFICIENT HEAT MANAGEMENT
#6DUAL PURPOSE COOLING IN COMPUTER MODULES
#7PROTECTED ELECTRONIC DEVICE FOR IMMERSION COOLING ENVIRONMENT AND METHODS FOR MAKING SAME
#8LIQUID COOLING DEVICE WITH SELF-CONFIGURING COLD AND HEAT SOURCES
#9HERMETIC SEALED ELECTRONIC ASSEMBLY FOR NON DIELECTRIC IMMERSION COOLING SYSTEM
#10COMPUTING DEVICE BASED ON PHASE-CHANGE LIQUID COOLING TECHNOLOGY
#11INFORMATION HANDLING SYSTEM WITH HEAT PIPE EXTENDER FOR A LIQUID COOLING PLATE
#12LIQUEFIED NATURAL GAS VEHICLE ASSISTED DATA CENTER COOLING APPARATUS
#13LIQUEFIED NATURAL GAS ASSISTED DATA CENTER COOLING APPARATUS
#14THREE-DIMENSIONAL VAPOR CHAMBER MODULE, SERVER AND IMMERSION LIQUID COOLING SYSTEM
#15ELECTRONIC DEVICE WITH TRIPLE LIQUID COOLING CYCLE
#16Cold Plate Cooling System of Air-liquid Composite Architecture, Motherboard, and Server
#17DIRECT LIQUID COOLING METHOD, DEVICE, AND COMPUTER PROGRAM FOR SERVER COMPONENTS
#18SERVER AND LIQUID-COOLING SYSTEM FOR SERVER
#19MOBILE EDGE COMPUTING (MEC) SERVER DEVICE AND METHOD THEREOF
#20COOLING DEVICE
#21A MOUNTABLE MOBILE EDGE COMPUTING (MEC) SERVER AND METHOD FOR MOBILE EDGE COMPUTING
#22METHODS AND APPARATUS TO COOL COMPONENTS OF SERVERS
#23Hybrid Dry Adiabatic Cooling Chilled Water Plant for Data Centers and Other IT Environments
#24LIQUID-COOLING CIRCULATING SYSTEM AND METHOD FOR SERVER, ELECTRONIC DEVICE AND STORAGE MEDIUM
#25ORGANIC HEAT TRANSFER SYSTEM, METHOD, AND FLUID
#26LIQUID COOLING PLATE AND SERVER
#27LIQUID COOLED MODULE FOR NARROW PITCH SLOTS
#28SYSTEM AND METHOD FOR COOLING INTERCONNECT MODULES
#293-WAY QUICK-DISCONNECT FLUID COUPLINGS WITH AUTOMATIC BYPASS SWITCHING
#30DATA CABINET HEAT-DISSIPATING SYSTEM AND METHOD
#31HYBRID AIR/LIQUID COOLING UNIT
#32Tube for Refrigerant in Server Cooling Applications
#33Hybrid Dry Adiabatic Cooling Chilled Water Plant for Data Centers and Other IT Environments
#34GAS COOLED CONDENSERS FOR LOOP HEAT PIPE LIKE ENCLOSURE COOLING
#35DUAL-PHASE SELECTIVELY VAPOR-PERMEABLE MEMBRANE HEAT SINKS AND SERVER RACK COOLING SYSTEMS INTEGRATING THE SAME
#36DISTRIBUTED IMPINGEMENT AND RECOVERY MANIFOLD (DIRM) COLD PLATE
#37PHASE CHANGE COOLING SYSTEM
#38SERVER AND HEAT DISSIPATION MODULE
#39Integrated, Pumped, Closed-Loop Two-Phase Heatsink
#40DEVICES, SYSTEMS, AND METHODS FOR A HYBRID COOLING SYSTEM
#41MODULAR, TWO-PHASE COOLING SYSTEMS
#42SERVER ASSEMBLY WITH CLOSED CONDENSING CIRCUIT AND COOLING APPARATUS CONTAINING THE SAME
#43SYSTEMS AND METHODS FOR CENTRALIZED AND SCALABLEVAPOR MANAGEMENT SYSTEM IN IMMERSION COOLING
#44Implementation of Two-Phase Cold Plate Loops with Design Features to Optimize Thermofluidic Performance in Space Constrained Computer Architectures
#45LIQUID COOLING PLATE ASSEMBLY AND SERVER
#46LIQUID COOLING SYSTEM FOR DATA CENTER, CONTROL METHOD, AND EDGE DATA CENTER
#47OPTIMIZED CHIP COOLING INFRASTRUCTURE
#48AIR-CONDITIONING SYSTEM FOR DATA CENTER
#49OPTIMIZED CHIP COOLING INFRASTRUCTURE
#50IMMERSION COOLING SYSTEM AND TANK STRUCTURE THEREOF
#51DRY COOLING ARRANGEMENT FOR A DATACENTER
#52COOLING SYSTEM FOR ELECTRONIC COMPONENT RACKS
#53PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION COOLING SYSTEMS AND METHODS FOR USING SAME
#54SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES
#55IMMERSION COOLING DEVICE
#56SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES
#57IMMERSION LIQUID COOLING DEVICE
#58SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS
#59TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION STRUCTURE HAVING SHORTENED EVACUATION ROUTE FOR VAPOR BUBBLES
#60HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OUTSIDE A CHIP PACKAGE
#61ANGLED AND STEPPED FACEPLATE FOR TELECOMMUNICATIONS AND NETWORKING SHELF AND CIRCUIT PACKS
#62System for the Reuse of Heat in a Data Center
#63SERVER HEAT DISSIPATION SYSTEM BASED ON GRAVITY HEAT PIPE
#64Immersed cabinet and heat dissipation system thereof
#65IMMERSION COOLING SERVER SYSTEM WITH AI ACCELERATOR APPARATUSES USING IN-MEMORY COMPUTE CHIPLET DEVICES FOR TRANSFORMER WORKLOADS
#66HERMETIC SEALED ELECTRONIC ASSEMBLY FOR NON DIELECTRIC IMMERSION COOLING SYSTEM
#67LIQUID-COOLING HEAT DISSIPATION DEVICE, CABINET, AND SYSTEM
#68Devices, systems, and methods for a hybrid cooling system
#69IMMERSION LIQUID COOLING EQUIPMENT AND HEAT DISSIPATION METHOD FOR ELECTRONIC DEVICE
#70IMMERSION COOLING SYSTEM WITH MULTIPLE COOLING LIQUIDS
#71IMMERSION COOLING SYSTEM
#72Pressure based phase immersion cooling system
#73Server and cooling system for enhanced immersion cooling
#74Modular, two-phase cooling systems
#75High-availability liquid cooling system for chip and server
#76High power density chips based two-phase loop recirculation
#77Distribution hardware for two phase system recirculation
#78Systems and methods for multiphase thermal management
#79Chip to server packaging design for immersion systems
#80Liquid-cooling plate for CPU
#81SYSTEMS AND METHODS OF IMPROVING THERMAL MANAGEMENT OF HEAT-GENERATION COMPONENTS
#82Cooling system
#83Methods and devices for testing immersion cooling controllers
#84Systems and methods for centralized and scalable vapor management system in immersion cooling
#85Dual-stacked motherboards for fluid immersion cooling
#86APPARATUS AND SYSTEM FOR TWO-PHASE SERVER COOLING WITH SERIAL CONDENSER UNITS
#87ENHANCED FLUID REPLACEMENT STRUCTURES FOR USE IN IMMERSION COOLING TANKS
#88Integrated immersion system for servers
#89System for modular liquid spray cooling of electronic devices
#90Cooling system of electronic systems, in particular for data centre
#91Redundant module and systems for high density servers
#92SELF-CONTAINED IMMERSION COOLING SERVER ASSEMBLIES
#93Disaggregated system architecture for immersion cooling
#94Leak protection for cold plate liquid cooling
#95Systems and methods for immersion-cooled datacenters
#96Multiple phase multiple system architecture
#97SYSTEMS AND METHODS FOR IMMERSION-COOLED COMPUTERS
#98Electronic device and heat dissipation assembly
#99Thermal management plate for critical processors
#100Electronic apparatus having immersion cooling system and operating method thereof
#101Computer cooling
#102COOLING SYSTEMS AND HEAT EXCHANGERS
#103Rack system for housing at least one immersion case
#104Data center rack system with integrated liquid and dielectric immersion cooling
#105Rack system for housing an electronic device
#106Method and extraction system for extracting an electronic device from an immersive cooling container
#107Hybrid cooling device for acceleration hardware
#108Cooling electronic devices in a data center
#109Cooling system providing cooling to an infrastructure having a plurality of heat-generating units
#110Full system self-regulating architecture
#111SCALABLE THERMAL RIDE-THROUGH FOR IMMERSION-COOLED SERVER SYSTEMS
#112Managing computational bursting on server nodes
#113Cooling packages for heterogenous chips
#114Fluid cooling system
#115Cooling for server with high-power CPU
#116ELECTRONIC DEVICE
#117Testing methods and apparatuses using simulated servers
#118Server
#119System for cooling server boards in a data center
#120Scalable thermal ride-through for immersion-cooled server systems
#121Testing methods and apparatuses using simulated servers
#122LIQUID COOLED MODULE FOR NARROW PITCH SLOTS
#123Fluid cooling system
#124Two-phase cooling systems for autonomous driving super computers
#125Vapor chamber, heat sink, and terminal
#126Cooling of server high-power devices using double-base primary and secondary heat sinks
#127Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover
#128Cooling system
#129TWO-PHASE MANIFOLD COLD PLATE FOR LIQUID COOLING
#130Self-contained immersion cooling server assemblies
#131Cooling systems adapted to be thermally connected to heat-generating equipment
#132Fluid cooling system
#133Computer server
#134Wickless capillary driven constrained vapor bubble heat pipes
#135Cooling electronic devices in a data center
#136Heat dissipation system
#137Heatsink for multiple memory modules
#138RACK MOUNTABLE IMMERSION COOLING ENCLOSURES
#139Computing apparatus with closed cooling loop
#140Thermal management for modular electronic devices
#141Heat removal from memory modules
#142Fixing device for double sided heat sink and associated heat dissipating system
#143Cooling electronic devices in a data center
#144Chassis for a liquid immersion cooling system
#145Systems and methods for combined active and passive cooling of an information handling resource
#146Cooling electronic devices in a data center
#147Cooling electronic devices in a data center
#148FANLESS RAIL COOLED ELECTRONICS APPARATUS
#149Magnetic fluid connector
#150TRANSMISSION DEVICE
#151Cooling electronic devices in a data center
#152Cooling electronic devices in a data center
#153Extended heat sink design in server
#154Mechanism to release cards and other components from computer
#155SERVER THERMAL MANAGEMENT WITH HEAT PIPES
#156Cooling system
#157Computer server
#158Cooling device and manufacturing method therefor
#159Two-phase liquid cooled electronics
#160Fixing device for double sided heat sink and associated heat dissipating system
#161Liquid-cooled server chassis
#162Cooling device and electronic device
#163DEVICE FOR COOLING ELECTRONIC COMPONENTS
#164Chassis heat dissipation structure
#165Lifting mechanism and electronic device
#166Memory device with memory modules located within liquid coolant chamber
#167Movable heatsink utilizing flexible heat pipes
#168System to reduce coolant use in an array of circuit boards
#169Cooling system for high-performance computer
#170Cooling mechanism of high mounting flexibility
#171Liquid immersion cooling device and information processing apparatus
#172Cooling electronic devices within a data center
#173Thermal solution for transceiver module
#174System and method for fluid cooling of electronic devices installed in an enclosure
#175Two-phase liquid-vapor computer cooling device
#176Electronic apparatus
#177Computer system with cooled electric power supply unit
#178Active control for two-phase cooling
#179AN IMMERSION COOLING SYSTEM
#180Passive two-phase cooling with forced cooling assist
#181Passive two-phase cooling with forced cooling assist
#182Two-phase liquid cooled electronics
#183Two-phase liquid cooled electronics
#184Cooling electronic devices in a data center
#185Thermal management apparatus
#186Cooling assembly
#187Liquid cooling system with a displacement appendage for an information handling system
#188Computer circuit board cooling arrangement
#189Thermosiphon systems for electronic devices
#190Magnetic fluid connector
#191Systems and methods for cooling of information handling resources
#192Server Cooling System Capable of Performing a Two-Phase Immersion Typed Heat Dissipation Process
#193SYSTEM AND METHOD FOR COOLING A COMPUTER PROCESSOR
#194Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms
#195Wickless capillary driven constrained vapor bubble heat pipes for application in display devices
#196Wickless capillary driven constrained vapor bubble heat pipes for application in rack servers
#197System and method for fluid cooling of electronic devices installed in a sealed enclosure
#198Cooling electronic devices in a data center
#199Active control for two-phase cooling
#200Electronic equipment
#201Cooling apparatus and electronic device
#202Cooling apparatus and electronic device
#203Information processing device and server
#204Cooling mechanism of high mounting flexibility
#205IMPROVED RAIL COOLING ARRANGEMENT FOR SERVER APPARATUS
#206Heat-pipe heat dissipation system and power device
#207System and method for fluid cooling of electronic devices installed in a sealed enclosure
#208Cooling electronic devices in a data center
#209Immersion cooling system with low fluid loss
#210Thermosiphon systems for electronic devices
#211Server with heat pipe cooling
#212Cooling electronic devices in a data center
#213Cooling device and electronic device system
#214Active control for two-phase cooling
#215Cooling device and electronic device
#216COOLING DEVICE AND ELECTRONIC DEVICE PROVIDED WITH COOLING DEVICE
#217Cooling electronic devices in a data center
#218Apparatus and method for cooling an information handling system
#219Fluid heat exchange apparatus with recirculating structure
#220Cooling mechanism of high mounting flexibility
#221Two-phase cooling with ambient cooled condensor
#222Two-phase cooling with ambient cooled condensor
#223Active control for two-phase cooling
#224System for cooling hard disk drives using vapor momentum driven by boiling of dielectric liquid
#225Partitioned, rotating condenser units to enable servicing of submerged IT equipment positioned beneath a vapor condenser without interrupting a vaporization-condensation cycling of the remaining immersion cooling system
#226Heat dissipation device and method of dissipating heat
#227Indirect evaporator cooler heat exchanger manufacturing method
#228Thermosiphon systems for electronic devices
#229Cooling electronic devices in a data center
#230Server thermal management with heat pipes
#231Datacenter immersed in cooling liquid
#232System and method for fluid cooling of electronic devices installed in a sealed enclosure
#233Method of absorbing sensible and latent heat with series-connected heat sinks
#234System and method for thermally coupling memory devices to a memory controller in a computer memory board
#235Bimodal cooling in modular server system
#236Cooling system for electronic device storing apparatus and cooling system for electronic device storing building
#237Cooling assembly
#238Flexible two-phase cooling system
#239Multi-component shared cooling system
#240Method of operating a cooling apparatus to provide stable two-phase flow
#241Cooling device and electronic equipment
#242Method of cooling series-connected heat sink modules
#243HEAT CONVEYING STRUCTURE FOR ELECTRONIC DEVICE
#244Direct coolant contact vapor condensing
#245Field-replaceable bank of immersion-cooled electronic components and separable heat sinks
#246Spacing-saving thermal management system for electronic devices
#247Computer provided with cooling system
#248Valve controlled, node-level vapor condensation for two-phase heat sink(s)
#249Heat pipe assemblies
#250Valve controlled, node-level vapor condensation for two-phase heat sink(s)
#251SYSTEM FOR COOLING MULTIPLE IN-LINE CENTRAL PROCESSING UNITS IN A CONFINED ENCLOSURE
#252Server with heat pipe cooling
#253Thermosiphon systems for electronic devices
#254Electronic apparatus and cooling method
#255Server and method for cooling a server
#256Heat sink for processor
#257System for cooling hard disk drives using vapor momentum driven by boiling of dielectric liquid
#258Stand alone immersion tank data center with contained cooling
#259Partitioned, rotating condenser units to enable servicing of submerged it equipment positioned beneath a vapor condenser without interrupting a vaporization-condensation cycling of the remaining immersion cooling system
#260Low thermal resistance cooler module for embedded system
#261Immersion-cooled and conduction-cooled method for electronic system
#262Cooling heat-generating electronics
#263Fluid heat exchange apparatus
#264Pump-enhanced, sub-cooling of immersion-cooling fluid
#265Sectioned manifolds facilitating pumped immersion-cooling of electronic components
#266Sectioned manifolds facilitating pumped immersion-cooling of electronic components
#267Pump-enhanced, sub-cooling of immersion-cooling fluid
#268Vapor-compression refrigeration apparatus with backup air-cooled heat sink and auxiliary refrigerant heater
#269Wicking and coupling element(s) facilitating evaporative cooling of component(s)
#270Server system and server thereof
#271Wicking and coupling element(s) facilitating evaporative cooling of component(s)
#272Coolant drip facilitating partial immersion-cooling of electronic components
#273Vapor condenser with three-dimensional folded structure
#274Cooling host module
#275Cooling host module
#276Contaminant separator for a vapor-compression refrigeration apparatus
#277Passive cooling enclosure system and method for electronics devices
#278Thermosiphon systems for electronic devices
#279HEAT SINK FOR USE IN AN ELECTRONICS SYSTEM
#280Cooled Part for Expansion Circuit Board Cooling
#281COLD PLATE WITH REDUCED BUBBLE EFFECTS
#282Gas cooled condensers for loop heat pipe like enclosure cooling
#283Characterization of N-glycans using exoglycosidases
#284Condenser fin structures facilitating vapor condensation cooling of coolant
#285Electronic device with heat dissipation apparatus
#286Cooling module
#287User-serviceable liquid DIMM cooling system
#288Wicking vapor-condenser facilitating immersion-cooling of electronic component(s)
#289Multi-fluid, two-phase immersion-cooling of electronic component(s)
#290Intra-condenser contaminant extractor for a vapor-compression refrigeration apparatus
#291CONTAMINANT COLD TRAP FOR A VAPOR-COMPRESSION REFRIGERATION APPARATUS
#292Contaminant separator for a vapor-compression refrigeration apparatus
#293THERMOELECTRIC-ENHANCED, VAPOR-CONDENSER FACILITATING IMMERSION-COOLING OF ELECTRONIC COMPONENT(S)
#294Valve controlled, node-level vapor condensation for two-phase heat sink(s)
#295Thermal management infrastructure for IT equipment in a cabinet
#296Flow boiling heat sink with vapor venting and condensing
#297Valve controlled, node-level vapor condensation for two-phase heat sink(s)
#298Flow boiling heat sink structure with vapor venting and condensing
#299Two-phase, water-based immersion-cooling apparatus with passive deionization
#300Thermosiphon systems for electronic devices