236853 ⎘
Fine pitch copper pillar package and method
#2Capacitor and board having the same
#3Disk having an electric connecting element
#4Conductor path structure having a component received in a vibration-damped manner
#5Method of Enhancing Fatigue Life of Grid Arrays
#6Printed circuit board package and display device including the same
#7Hearing device with a microphone structure
#8Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
#9Land side and die side cavities to reduce package z-height
#10Methods and apparatus for package with interposers
#11Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
#12Method and apparatus for flexible circuit cable attachment
#13Method of forming camera module for vehicular vision system
#14Array substrate and method of mounting integrated circuit using the same
#15Multilayer ceramic capacitor and board having the same
#16Electronic component, electric device including the same, and bonding method thereof
#17Resistor element and resistor element assembly
#18Modular display panel
#19Electronic system having increased coupling by using horizontal and vertical communication channels
#20Multilayer ceramic electronic component and board having the same
#21Method for producing an electronic assembly, and electronic assembly, in particular for a transmission control module
#22Method for orienting solder balls on a BGA device
#23Composite electronic component and resistor
#24Composite electronic component and resistor
#25Chip resistor and mounting structure thereof
#26Surface mounted protection device
#27LASER DIODE CHIP ON PRINTED CIRCUIT BOARD
#28Memory controller for selective rank or subrank access
#29Printed circuit board and sensor
#30Mainboard assembly including a package overlying a die directly attached to the mainboard
#31Multilayer ceramic capacitor with decreased high voltage stress defects and board having the same
#32Composite electronic component, method of manufacturing the same, board for mounting thereof, and packaging unit thereof
#33Light distribution method for adaptive driving beam headlamp system, and adaptive driving beam headlamp system
#34Electronic component mount structure, electronic component, and method for manufacturing electronic component
#35Systems and methods for an intermediate device structure
#36Method of forming camera module for vehicular vision system
#37Spoked solder pad to improve solderability and self-alignment of integrated circuit packages
#38Fibrillated liquid crystal polymer powder, method of producing fibrillated liquid crystal polymer powder, paste, resin multilayer substrate, and method of producing resin multilayer substrate
#39Electric connection structure and electric connection member
#40Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
#41Dust guard structure
#42Package module
#43Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows
#44Capacitor and board having the same
#45Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
#46COMMUNICATION MODULE ALIGNMENT
#47Chip capacitor, circuit assembly, and electronic device
#48Modular display panel
#49Surface mount connector pad
#50Optical module
#51Laminated magnetic core inductor with magnetic flux closure path parallel to easy axes of magnetization of magnetic layers
#52Insulating ceramic paste, ceramic electronic component, and method for producing the same
#53Data processing device
#54Integrated circuit with laminated magnetic core inductor and magnetic flux closure layer
#55Integrated circuit with laminated magnetic core inductor including a ferromagnetic alloy
#56Laminated magnetic core inductor with insulating and interface layers
#57Capacitor component and board having the same
#58Modular Display Panel
#59Modular Display Panel
#60Electronic component, electric device including the same, and bonding method thereof
#61Stretchable board
#62Conductor path structure having a component received in a vibration-damped manner
#63SHIELDING MOLD FOR ELECTRIC AND MAGNETIC EMI MITIGATION
#64Hearing device with a microphone structure
#65Modular display panel
#663-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES
#67Array type discrete decoupling under BGA grid
#68Methods and apparatus for package with interposers
#69Accurate positioning and alignment of a component during processes such as reflow soldering
#70MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN
#71Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein
#72Array substrate and method of mounting integrated circuit using the same
#73Composite electronic component and board having the same
#74Capacitor and method of manufacturing the same
#75Substrate, electronic device and display device having the same
#76Modular display panel
#77Endoscope, electronic unit and method for manufacturing electronic unit
#78Multilayer ceramic electronic component and board having the same
#79Light emitting device and substrate
#80Modular display panel
#81Fingerprint identification module and mobile electronic device with same
#82Magnetic Core Inductor Integrated with Multilevel Wiring Network
#83Method and apparatus for flexible circuit cable attachment
#84Amplifier and optical transmitter using the same
#85Electronic system having increased coupling by using horizontal and vertical communication channels
#86Multilayer ceramic capacitor and board having the same
#87Multilayer ceramic capacitor and board having the same
#88Resistor element and resistor element assembly
#89Chip resistor and mounting structure thereof
#90Optoelectronic subassembly with components mounted on top and bottom of substrate
#91Printed circuit board assembly
#92Integrated switched inductor power converter
#93Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
#94Printed circuit boards and solid state drives including the same
#95Land side and die side cavities to reduce package z-height
#96Electronic system having increased coupling by using horizontal and vertical communication channels
#97Electronic component-embedded substrate and electronic component device
#98Capacitor component
#99Display device
#100Circuit structure
#101Stacked printed circuit board packages
#102Integrated electronic components and methods of formation thereof
#103Multilayer ceramic capacitor and board having the same
#104Assembling and handling edge interconnect packaging system
#105Printed-circuit board, printed-wiring board, and electronic apparatus
#106Circuit board with wire conductive pads and method for fixing the wire conductive pads to the circuit board
#107Coil component and circuit board having the same
#108Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors
#109Light emitting module and lighting device having same
#110Printed wiring board having support plate and method for manufacturing printed wiring board having support plate
#111Method of making integrated die paddle structures for bottom terminated components
#112Vertical shielding and interconnect for SIP modules
#113Connection verification technique
#114Electronic component
#115Electronic component
#116Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
#117MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN
#118Electronic component and electronic equipment using same
#119Board and electronic device
#120Display apparatus
#121CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES
#122Multilayer ceramic capacitor and board having the same
#123Lead-free solder alloy
#124Recyclable copper clad laminates containing fiber composition
#125Circuit assembly and method for manufacturing same
#126Multilayer capacitor and board having the same
#127Contact area design for solder bonding
#128Mounting jig for semiconductor device
#129Method of manufacturing wiring board, wiring board, and light emitting device using the wiring board
#130Light guide plate, backlight module and display device
#131Mounted structure of laminated capacitor, and method of mounting laminated capacitor
#132Memory controller for selective rank or subrank access
#133Printed circuit board having a plurality of electronic components arranged on the printed circuit board in at least one group
#134Light emitting device and adaptive driving beam headlamp system
#135Circuit board and on-board structure of semiconductor integrated circuit
#136Composite electronic component, method of manufacturing the same, board for mounting thereof, and packaging unit thereof
#137Multilayer-ceramic-capacitor mounting structure
#138Camera for vehicle vision system
#139Electronic component and electronic component built-in board
#140Circuit board having a passive device inside a via
#141Electronic component mounting board
#142Fluid control apparatus
#143Electronic control device
#144Electronic component and a method for manufacturing an electronic component
#145Electronic control device
#146Electric connection structure and electric connection member
#147Push switch, method of manufacturing push switch, and electronic device including push switch
#148Laminated ceramic chip component including nano thin film layer, manufacturing method therefor, and atomic layer vapor deposition apparatus therefor
#149Camera device
#150Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows
#151Magnetic assembly
#152Elastic electric contact terminal with improved environmental resistance and fabrication method therefor
#153Inter-chip alignment
#154Electronic component and circuit board having the same
#155Semiconductor storage device having a support member for a memory controller
#156Surface mounted protection device
#157Electronic component, mounted electronic component, and method for mounting electronic component
#158Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein
#159Chip resistor element
#160Memory module and method of manufacturing the memory module
#161Composite electronic component and board having the same
#162Coil electronic component
#163Electronic component-containing module
#164Multilayer ceramic capacitor with decreased high voltage stress defects and board having the same
#165Conductor pad for flexible circuits and flexible circuit incorporating the same
#166Development of the advanced component in cavity technology
#167Direct integration of photovoltaic device into circuit board
#168Direct integration of photovoltaic device into circuit board
#169Printed circuit board and display device including the same
#170Display device having dummy terminals
#171Suspension board with circuit and producing method thereof
#172Printed circuit board and display apparatus including the same
#173Mounting substrate, method for manufacturing a mounting substrate, and mounted structure including an electronic component
#174Multilayer capacitor and board having the same
#175Coil component and board having the same
#176Circuit board, power storage device, battery pack, and electronic device
#177Semiconductor chip mounted on a packaging substrate
#178Solder alloy and mounted structure using same
#179Capacitor and method of manufacturing the same
#180Multilayer electronic component and board having the same
#181Circuit board and arrangement with a circuit board
#182Communication module alignment
#183Pad-array structure on substrate for mounting IC chip on substrate, and optical module having said pad-array structure
#184Printed circuit board
#185Light emitting device and wiring board thereof
#186Light-emitting device
#187Wiring board having isolator and bridging element and method of making wiring board
#188Capacitor component and board having the same
#189Multilayer ceramic capacitor and board having the same
#190Data processing device
#191Data processing device
#192Devices and methods for solder flow control in three-dimensional microstructures
#193Alignment mark, circuit board and display device
#194Resin-sealed module
#195Variable sensor interface for a control unit
#196Noise reduction board and electronic device
#197Methods and apparatus for package with interposers
#198Laminated electronic component and laminated electronic component mounting structure
#199Electrical connector with low-stress, reduced-electrical-length contacts
#200Printed circuit board and method of manufacturing the same
#201Wiring board with embedded component and integrated stiffener and method of making the same
#202Inductor and printed circuit board
#203Aircraft LED light unit
#204Method of enhancing fatigue life of grid arrays
#205Composite electronic component and resistance element
#206Mounting substrate
#207Package module
#208Wiring board with dual stiffeners and dual routing circuitries integrated together and method of making the same
#209Integrated electronic assembly for conserving space in a circuit
#210Display device
#211Circuit board, manufacturing method thereof and display apparatus
#212Semiconductor device
#213Composite electronic component
#214Electronic component
#215Laminated electronic component and laminated electronic component mounting structure
#216Module component
#217Light-emitting device and lighting appliance including the light-emitting device
#218Printed circuit board
#219Device for controlling at least one diode
#220Semiconductor package and method for fabricating base for semiconductor package
#221Electronic package assembly
#222Integrated circuit structure and method of forming
#223Circuit board for a microphone component part, and microphone module having such a circuit board
#224Laminate and circuit board
#225Planar lighting device and mounting substrate including conduction pattern with extension parts
#226Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other
#227Connector and LED lighting device including the connector
#228Composite electronic component and resistor
#229Electronic device
#230Front/back control of integrated circuits for flash dual inline memory modules
#231Electronic control device
#232Circuit assembly
#233Spoked solder pad to improve solderability and self-alignment of integrated circuit packages
#234Printed circuit board, method of manufacturing the same and connection terminal
#235Embedded board and method of manufacturing the same
#236Camera for vehicle vision system
#237Multilayer ceramic component and board having the same
#238Method for producing an electronic component
#239Multilayer ceramic component
#240Connection structure of conductors and display apparatus
#241Liquid immersion transfer of electronics
#242Multilayer ceramic capacitor and board having the same
#243Circuit board assembly, control device for a cooler fan module and method
#244Substrate comprising embedded elongated capacitor
#245Land side and die side cavities to reduce package z-height
#246Electronic module
#247Printed wiring board
#248LED lamp using ultra-small LED electrode assembly
#249Power semiconductor module
#250Voltage configurable solid state lighting apparatuses, systems, and related methods
#251Multilayer ceramic capacitor and board having the same mounted thereon
#252Circuit board structure with embedded fine-pitch wires and fabrication method thereof
#253Contact device for establishing an electrical connection to a contact point of a printed circuit board
#254Ultra-small LED electrode assembly and method for manufacturing same
#255Connector for a computing assembly
#256Printed circuit board and display device having the same
#257Lens for illuminating device and illuminating device having said lens
#258Circuit board
#259Electronic component and board having the same
#260Printed circuit board
#261Composite electronic component and board having the same
#262Printed circuit board
#263Method for orienting solder balls on a BGA device
#264Built-in-electronic-component substrate and manufacturing method therefor
#265Light emitting device and adaptive driving beam headlamp system
#266Multilayer ceramic component and board having the same
#267Method of manufacturing a processor
#268Printed circuit board and lighting unit including the same
#269Mounted electronic component including connection portions
#270Bump-on-trace design for enlarge bump-to-trace distance
#271Multilayer ceramic electronic component and board having the same
#272Electronic module and the fabrication method thereof
#273System of package (SoP) module and mobile computing device having the SoP
#274Embedded board and method of manufacturing the same
#275Method of manufacture an electric circuit
#276Multi-terminal electronic component, method of manufacturing the same, and board having the same
#277Flexible LED screen
#278Composite electronic component and board having the same
#279Multilayer ceramic electronic component and board having the same
#280Electronic control device
#281Electromagnetic shielding structures
#282Component protection structures for electronic devices
#283Printed wiring board and method for manufacturing the same
#284Printed wiring board, method for manufacturing the same and semiconductor device
#285Curved display device
#286Metallized particle interconnect with solder components
#287Metallized particle interconnect with solder components
#288Optoelectronic subassembly with components mounted on top and bottom of substrate
#289Mounting jig for semiconductor device
#290Screen control module having greater anti-warp strength of a mobile electronic device and controller thereof
#291Biodegradable materials for multilayer transient printed circuit boards
#292Pattern safety device for preventing interference between patterns
#293Multilayer ceramic capacitor and board having the same
#294Backlight unit and display apparatus having the same
#295Multilayer ceramic capacitor having terminal electrodes and board having the same
#296Control module for an electric appliance
#297Production method of component-embedded substrate, and component-embedded substrate
#298Solder pads, methods, and systems for circuitry components
#299Conformal coating composition containing metal nanoparticles to prevent sulfur related corrosion
#300Insulating ceramic paste, ceramic electronic component, and method for producing the same