Fabrication method of packaging substrate having embedded passive component

Embedded component substrate and method for fabricating the same

Multilayer ceramic capacitor with interposer, and interposer for multilayer ceramic capacitor

Circuit board device and circuit board device for reducing acoustic noise

Wiring board and method for manufacturing the same

Method for soldering a connecting element

Multilayer ceramic capacitor and board for mounting of the same

Wiring board, and electronic device

Composite electronic component and board for mounting thereof

Module, module component composing the module, and method of manufacturing the module

Array substrate and method of mounting integrated circuit using the same

Electric power sensor

Companion integrated circuit having decoupling capacitor and mobile device having the same

Circuit board, electronic component and method of manufacturing circuit board

Semiconductor device mounting structure, backlight device, and mounting substrate

Chip electronic component and board for mounting thereof

Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface

Multilayer ceramic electronic component and board for mounting thereof

Surface-mount type electric connecting terminal, and electronic module unit and circuit board using the same

Electronic device module and manufacturing method thereof

Multilayer ceramic capacitor and board for mounting thereof

Electronic element mounting board and electronic device

Multilayer ceramic capacitor having multilayer external electrodes and board having the same

Electronic component mounting system and electronic component mounting method

Multilayer ceramic capacitor and circuit board having the same

Substrate

Power semiconductor device

Electronic component, method of manufacturing the same, and mount structure of electronic component

Chip-component structure

Method for manufacturing printed wiring board with conductive post and printed wiring board with conductive post

Passive electrical devices with a polymer carrier

Structure of circuit board with voids

Electronic component

Illumination device

Electronic component

Wiring substrate and method of making wiring substrate

Chip component mounting structure, and module component

Light-emitting device

OLED lighting module

Multilayer wiring board with built-in electronic component

Printed wiring board

Manufacturing method of device embedded substrate and device embedded substrate manufactured by this method

Integrated electronic components and methods of formation thereof

Assembled circuit and electronic component

Printed circuit board with coextensive electrical connectors and contact pad areas

Structure mounted with electronic component

Wiring board having an opening with an angled surface

Printed circuit boards for communications connectors having openings that improve return loss and/or insertion loss performance and related connectors and methods

Composite electronic component and board with the same mounted thereon

Thin low profile strip dual in-line memory module

Wiring substrate, manufacturing method therefor, and semiconductor package

Producing an apparatus by covering an electronic component with a conformal coating containing metal nanoparticles

Package substrates and integrated circuit packages including the same

Spacer layer for embedding semiconductor die

Electronic component mounting structure and printed wiring board

Multilayer ceramic capacitor and board with the same mounted thereon

Electronic component mounting device and semiconductor device including the same

Plug connector with firmly fixed terminals

Circuit board, and semiconductor device having component mounted on circuit board

Electronic apparatus, method of optimizing de-coupling capacitor and computer-readable recording medium

Wiring board and electronic device

Over-current protection device and protective circuit board containing the same

Circuit board and electronic apparatus including the same

Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method

Buttoned soldering pad for use with fine-pitch hot bar soldering

Semiconductor memory device

Printed wiring board and method for manufacturing printed wiring board

Surface-mount type electric connecting terminal, and electronic module unit and circuit board using the same

Multilayer ceramic electronic component and board having the same mounted thereon

Electrical device and method for producing same

Ceramic electronic component with metal terminal

Electrical connector with low-stress, reduced-electrical-length contacts

Solder piece, chip solder and method of fabricating solder piece

Electronic package structure

Component-embedded substrate

Electronic package structure

Engine control unit

Composite electronic component and board for mounting the same

Electronic apparatus and land grid array module

Array-type multilayer ceramic electronic component and board having the same mounted thereon

Heat dissipating high power systems

Electronic component, electric device including the same, and bonding method thereof

Flat cable assembly and method of assembling the same

Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method

Integrated electronic assembly for conserving space in a circuit

Electronic component unit and manufacturing method therefor

Multilayer ceramic capacitor and board having the same

Capacitor-mounted structure and capacitor

Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Three-dimensional power supply module with passive stacked over cavity

Multilayer ceramic capacitor, manufacturing method thereof and board for mounting the same thereon

Printed wiring board and method for manufacturing the same

Wiring substrate and light emitting device

Solder wettable flanges and devices and systems incorporating solder wettable flanges

Conductor pad for flexible circuits and flexible circuit incorporating the same

Composite electronic component and board having the same

Circuit substrate and electronic device

Composite electronic component and board having the same

Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein

Embedded multilayer ceramic electronic component and printed circuit board having the same

Multilayer ceramic capacitor and board having the same mounted thereon

Contact

Data processing device

Magnetic core inductor integrated with multilevel wiring network

Circuit board

Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method

Multilayer ceramic capacitor, method of manufacturing the same, and board having the same mounted thereon

Method of producing electronic components

Method of producing electronic components and method of producing substrate-type terminals

Utilizing chip-on-glass technology to jumper routing traces

Composite electronic component and board having the same

Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein

Multilayer ceramic capacitor and board having the same mounted thereon

Connection apparatus for electrically conductive pads and touch control screen

Multilayer ceramic capacitor and board for mounting of the same

Devices and methods for solder flow control in three-dimensional microstructures

Wiring board and method of manufacturing the same

Circuit board for mounting electronic components

Multilayer ceramic capacitor and board having the same mounted thereon

Capacitor arrangement structure and method of mounting capacitor

Chip resistor and mounting structure thereof

Multilayer ceramic capacitor and board having the same mounted thereon

Joining method, joint structure and method for producing the same

Array substrate assembly and display device

Wiring substrate and manufacturing method of wiring substrate

Small footprint semiconductor package

Method of making a circuit board structure with embedded fine-pitch wires

Sensor unit, method of manufacturing the same, electronic apparatus, and moving object

Electronic textile with means for facilitating waste sorting

Capacitor element mounting structure and capacitor element mounting method

Printed circuit board including electronic component embedded therein and method for manufacturing the same

Semiconductor device and method of forming high routing density interconnect sites on substrate

Printed circuit board and method of mounting components on the printed circuit board

Ceramic multilayer substrate and method for producing the same

Electrical circuit board trace pattern to minimize capacitor cracking and improve reliability

Multilayer ceramic electronic component and board for mounting the same

Ceramic multilayer wiring substrate and module including the same

Substrate with built-in electronic component

Packaged capacitor component with multiple self-resonance frequencies

Laminated electronic component and mounting structure thereof

Method of interconnecting microchips

Chip package connector assembly

LED with IC integrated lighting module

Electronic part and electronic control unit

Circuit board element having at least one LED

Audio and video reproduction apparatus having main board on which surface mount type connectors are mounted

Module board

Component-embedded resin substrate

Circuit board, optoelectronic component and arrangement of optoelectronic components

Printed circuit board and method for manufacturing the same

Semiconductor package and method for fabricating base for semiconductor package

Printed circuit board with embedded component and method for manufacturing same

Method of manufacturing module

Voltage noise reduction through co-layouts of multilayer ceramic capacitors and solid electrolytic polymer capacitors

Position indicator and capacitor

Electronic component embedded substrate and method of manufacturing electronic component embedded substrate

Methods and apparatus for package with interposers

Mounting structure of chip component and electronic module using the same

Semiconductor package and method for fabricating base for semiconductor package

Electronic component embedded substrate and manufacturing method thereof

PCB pad for imager of vehicle vision system

Sensor device and method for manufacture

Wiring substrate having a plurality of connection terminals and a filling member provided therebetween

Printed circuit board, and method for manufacturing printed circuit board

Multilayered chip electronic component and board for mounting the same

Multilayer ceramic capacitor and printed circuit board including the same

Substrate structure having electronic components and method of manufacturing substrate structure having electronic components

Method of manufacturing mounting substrate on which monolithic ceramic capacitors are mounted and mounting structure

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Land side and die side cavities to reduce package Z-height

Printed circuit board with compact groups of devices

Printed circuit board and method for manufacturing the same

Acoustically quiet capacitors

Magnetic core inductor integrated with multilevel wiring network

Method of making magnetic core inductor integrated with multilevel wiring network

Circuit module

Connection verification technique

Printed circuit board

Infrared sensor

Monolithic capacitor mounting structure and monolithic capacitor

Electronic circuit module component

Chip component-embedded resin multilayer substrate and manufacturing method thereof

Circuit board, electronic device, and method of manufacturing circuit board

Electronic component

Assembly having a substrate, an SMD component, and a lead frame part

Substrate structure and semiconductor package using the same

Mounting structure and mounting method

High-speed optical module with flexible printed circuit board

Grid arrays with enhanced fatigue life

Electronic device, electronic apparatus, method of manufacturing base substrate, and method of manufacturing electronic device

Ceramic electronic component and electronic device

Electronic component, electronic-component-embedded substrate, and method for producing electronic component

Wiring substrate and method for manufacturing wiring subtrate

Solid-state device including a conductive bump connected to a metal pattern and method of manufacturing the same

Wired circuit board

Electronic system having increased coupling by using horizontal and vertical communication channels

LED array for replacing flourescent tubes

Method for manufacturing mount assembly

Printed circuit board, method of manufacturing the same and connection terminal

Planar lighting device and mounting substrate including conduction pattern with extension parts

Recyclable circuit assembly

Wiring board and method for manufacturing the same

Package systems including passive electrical components

Component-embedded substrate

LED device, method of manufacturing the same, and light-emitting apparatus

Method and products related to deposited particles

Metal core printed circuit board and electronic package structure

Light-source module and light-emitting device

Method for manufacturing printed wiring board

Method and device for differential signal channel length compensation in electronic system

Circuit arrangement with shunt resistor

Semiconductor chip package with undermount passive devices

Method and apparatus for printed circuit board with stiffener

Mainboard assembly including a package overlying a die directly attached to the mainboard

3-D stacking of active devices over passive devices