236854 ⎘
Apparatus for fabricating stretchable electrical circuit
#2Assembly process for circuit carrier and circuit carrier
#3Capacitor and board having the same
#4Semiconductor memory system
#5Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#6Vehicular vision system camera with coaxial cable connector
#7Printed wiring board, printed circuit board, and electronic device
#8Semiconductor memory system
#9Electrical connection contact for a ceramic component, a ceramic component, and a component arrangement
#10Method of determining curing conditions, method of producing circuit device and circuit device
#11Thermally conductive flexible adhesive for aerospace applications
#12Trace Design for Bump-on-Trace (BOT) Assembly
#13Reducing thermal cycling fatigue
#14Method for orienting solder balls on a BGA device
#15Printed circuit board and sensor
#16Placement method for circuit carrier and circuit carrier
#17Electronic component mount structure, electronic component, and method for manufacturing electronic component
#18Method of manufacturing a chip component
#19Method of making an electronic device having a thin film resistor formed on an LCP solder mask and related devices
#20Spoked solder pad to improve solderability and self-alignment of integrated circuit packages
#21Capacitor and board having the same
#22Capacitor component
#23Electronic assembly that includes a substrate bridge
#24Integrated die paddle structures for bottom terminated components
#25Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
#26Capacitor component and board having the same
#27Surface mount metal unit and electric device including same
#28Thermally conductive flexible adhesive for aerospace applications
#29Method for manufacturing electronic devices
#30Method for placing an SMD semiconductor light source component of an illumination device for a motor vehicle
#31Accurate positioning and alignment of a component during processes such as reflow soldering
#32Stand-off block
#33Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices
#34Reducing thermal cycling fatigue
#35FORMING A STRESS COMPENSATION LAYER AND STRUCTURES FORMED THEREBY
#36Multi-stacked electronic device with defect-free solder connection
#37Multi-stacked electronic device with defect-free solder connection
#38Circuit boards and circuit board assemblies
#39METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUIT DEVICE, AND CIRCUIT DEVICE
#40Multi-layer ceramic capacitor assembly
#41Shunt resistor for measuring current
#42Method for positioning at least one electronic component on a circuit board
#43Semiconductor memory system
#44Coil component and circuit board having the same
#45Printed wiring board, printed circuit board, and electronic device
#46Method of making integrated die paddle structures for bottom terminated components
#47Electrical connection contact for a ceramic component, a ceramic component, and a component arrangement
#48Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrate
#49Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#50Method of making an electronic device having a thin film resistor formed on an LCP solder mask and related devices
#51Electronic component device, method of mounting electronic component device on circuit board, and mounting structure of electronic component device on circuit board
#52Mounting structure and method for manufacturing same
#53Recyclable copper clad laminates containing fiber composition
#54Capacitor component
#55Circuit assembly and method for manufacturing same
#56Mounting jig for semiconductor device
#57Method of fabricating stretchable electrical circuit
#58Integrated electro-optical module assembly
#59Circuit board and on-board structure of semiconductor integrated circuit
#60Multilayer-ceramic-capacitor mounting structure
#61Wiring board, electric motor, electric apparatus, and air conditioner
#62LED lighting apparatus
#63Laminated ceramic chip component including nano thin film layer, manufacturing method therefor, and atomic layer vapor deposition apparatus therefor
#64Electronic component having a connection element
#65Chip component
#66Electronic component, mounted electronic component, and method for mounting electronic component
#67Electronic circuit device
#68Wire bonded electronic devices to round wire
#69Electronic component-containing module
#70Vehicle vision system camera with coaxial cable connector
#71Trace design for bump-on-trace (BOT) assembly
#72Chip resistor
#73Suspension board with circuit and producing method thereof
#74Mounting substrate, method for manufacturing a mounting substrate, and mounted structure including an electronic component
#75Wiring board soldered with lead wire and electronic device comprising wiring board
#76Clamping device for soldering operations
#77Method of mounting electronic part, circuit substrate, and image forming apparatus
#78Semiconductor chip mounted on a packaging substrate
#79Forming a solder joint between metal layers
#80Circuit board and arrangement with a circuit board
#81Electronic component and board having electronic component mounted thereon
#82Method of manufacturing electronic component module and electronic component module
#83Capacitor component and board having the same
#84Method of making an electronic device having a thin film resistor formed on an LCP solder mask and related devices
#85Method of manufacturing flexible, lightweight photovoltaic array
#86Bare die integration with printed components on flexible substrate
#87Resin-sealed module
#88Mounting substrate, manufacturing method for the same, and component mounting method
#89Inductor and printed circuit board
#90Multi-stacked electronic device with defect-free solder connection
#91Electronic control module and method for producing an electronic control module
#92Conical inductor, printed circuit board, and optical module
#93Magnetic intermetallic compound interconnect
#94Display carrier attached light bar for backlit displays
#95Thermally conductive flexible adhesive for aerospace applications
#96Electrical switch
#97Method for coating conductive substrate with adhesive
#98Multi-stacked electronic device with defect-free solder connection
#99Method of forming a surface mount component having magnetic layer thereon
#100Affixing structure for electronic component
#101Void evaluation apparatus and void evaluation method in the solder
#102Electronic device
#103Semiconductor package, electronic device, and solder mounting method
#104Partially depopulated interconnection arrays for packaged semiconductor devices and printed circuit boards
#105Suspension board with circuit
#106Spoked solder pad to improve solderability and self-alignment of integrated circuit packages
#107Fault detection optimized electronic circuit and method
#108Multilayer ceramic component and board having the same
#109Method of attaching an electronic part to a copper plate having a surface roughness
#110Multi layer ceramic capacitor, embedded board using multi layer ceramic capacitor and manufacturing method thereof
#111Electronic device
#112Electronic component
#113Light emitting device and method of manufacturing the same
#114Electrical devices and methods for manufacturing same
#115Large scale gas electron multiplier and detection method
#116Method and apparatus for high atomic number substance detection
#117Modular printed circuit board electrical integrity and uses
#118Device including a printed circuit board and a metal workpiece
#119Semiconductor die and package jigsaw submount
#120Stand-off block
#121Method of determining curing conditions, method of producing circuit device, and circuit device
#122Lens for illuminating device and illuminating device having said lens
#123Substrate for mounting electronic component and method for manufacturing the same
#124Composite electronic component and board having the same
#125Optical printed circuit board and a method of mounting a component onto an optical printed circuit board
#126Method for orienting solder balls on a BGA device
#127Multilayer ceramic component and board having the same
#128Method of manufacturing printed-circuit board assembly
#129Multilayer ceramic electronic component and board having the same
#130Power module
#131Method for recycling of obsolete printed circuit boards
#132Electronic package design that facilitates shipping the electronic package
#133Electronic device
#134Composite electronic component and board having the same
#135Techniques and configurations to control movement and position of surface mounted electrical devices
#136Multilayer ceramic capacitor having terminal electrodes and board having the same
#137Multilayer ceramic electronic component and board having the same
#138Pressure application apparatus and pressure application method
#139Electronic control device
#140Electronic device for vehicle
#141Systems for packaging electronic devices
#142Motion-based reconfigurable microelectronics system
#143Mounting jig for semiconductor device
#144Biodegradable materials for multilayer transient printed circuit boards
#145Method for producing a module
#146Multilayer ceramic capacitor having terminal electrodes and board having the same
#147Semiconductor component, semiconductor-mounted product including the component, and method of producing the product
#148Optoelectronic component and electronic device having an optoelectronic component
#149Composite electronic component and board having the same
#150Ball grid array formed on printed circuit board
#151Composite electronic component and board having the same
#152Composite electronic component and board having the same
#153Method for soldering a connecting element
#154Modular printed circuit board
#155Wiring board, and electronic device
#156Impermeable protective coatings through which electrical connections may be established and electronic devices including the impermeable protective coatings
#157Placement method for circuit carrier and circuit carrier
#158Laminated capacitor mounted structure
#159Low noise capacitors
#160Three-dimensional stack of leaded package and electronic member
#161Contact component and semiconductor module
#162Thermally decomposable polymer compositions incorporating thermally activated base generators
#163Method of forming solder bump, and solder bump
#164Method for orienting discrete parts
#165Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
#166Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
#167Adhesive agent having a polyimide and acid modified rosin
#168Method of manufacturing surface mount device
#169Method to align surface mount packages for thermal enhancement
#170Printed circuit board
#171Electrical devices with solder dam
#172Connector structure, female connector, and male connector
#173Chip-component structure
#174Electronic component
#175Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices
#176Electronic component
#177Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#178Lens device attachment to printed circuit board
#179Flexible printed circuit board, planar light source apparatus, display apparatus, and electronic device
#180Electrical connector
#181Thermally conductive flexible adhesive for aerospace applications
#182Interdigitated chip capacitor assembly
#183Light-emitting module, light-emitting device and method of making light-emitting module
#184Structure mounted with electronic component
#185Relay module device
#186Electronic component, arrangement and method
#187Ball grid array system
#188Area array device connection structures with complimentary warp characteristics
#189Solid electrolytic capacitor, electronic component module, method for producing solid electrolytic capacitor and method for producing electronic component module
#190Conducting package structure and manufacturing method thereof
#191Photoelectric converting module
#192Method for connecting a component to a support via soldering and component connectable with a support
#193Electronic component mounting device and semiconductor device including the same
#194Over-current protection device and protective circuit board containing the same
#195Electronic device
#196Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method
#197Substrate for semiconductor package and semiconductor package having the same
#198Solder void reduction for component attachment to printed circuit boards
#199LED lead frame for laminated LED circuits
#200Electric component mounting method
#201Mounting structure and method for manufacturing same
#202Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method
#203Method and apparatus for electrical keying of an integrated circuit package having rotationally symmetric footprint
#204Printed circuit board and probe therewith
#205Bump electrode, board which has bump electrodes, and method for manufacturing the board
#206Electronic device and method of manufacturing electronic device
#207Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device
#208Apparatus for manufacturing electronic devices
#209Bonding structure of electronic equipment
#210Multilayer ceramic capacitor and board having the same mounted thereon
#211Chip component
#212Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method
#213Composite electronic component and board having the same
#214Dam structure for enhancing joint yield in bonding processes
#215Electronic component and method for manufacturing the same
#216Printed circuit board, semiconductor device connection structure, and method of manufacturing a printed circuit board
#217Circuit board for mounting electronic components
#218Vehicle vision system camera assembly with coaxial connector
#219Control unit for a motor vehicle
#220Joining method, joint structure and method for producing the same
#221Chip resistor
#222Method of assembling a transducer assembly
#223Plug connection having a guide element optimized for preventing shavings
#224Component-embedded substrate manufacturing method
#225Systems and methods for passive alignment of opto-electronic components
#226Electronic textile with means for facilitating waste sorting
#227Method of mounting electronic part, circuit substrate, and image forming apparatus
#228Printed circuit board and method of mounting components on the printed circuit board
#229Process for attaching devices to a circuit board
#230Device for assembling a chip on a substrate by providing a solder-forming mass
#231Electronic component and electronic component package
#232Transferable film including readable conductive image, and methods for providing transferable film
#233Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure
#234Electronic device, bonding material, and method for producing electronic device
#235Mounting method of electronic component and electronic component mount body
#236Multi-layered capacitor and circuit board mounted with multi-layered capacitor
#237Wiring substrate, electronic device, and electronic module
#238Display device and method of manufacturing the same
#239Symmetrical hexagonal-based ball grid array pattern
#240Electronic components on trenched substrates and method of forming same
#241Ball grid array and land grid array having modified footprint
#242Method and system for depositing an object onto a wiring board
#243Multilayered chip electronic component and board for mounting the same
#244Semiconductor device and method of confining conductive bump material with solder mask patch
#245Method of manufacturing mounting substrate on which monolithic ceramic capacitors are mounted and mounting structure
#246Electronic component mounting method
#247Acoustically quiet capacitors
#248Electronic component mounting line and electronic component mounting method
#249Mounted structure and manufacturing method of mounted structure
#250Solder on trace technology for interconnect attachment
#251Capacitor component and capacitor component mounting structure
#252Electronic circuit module component
#253Housing and method to control solder creep on housing
#254Vacuum thermal bonding apparatus
#255Method of mounting electronic component to circuit board
#256Circuit board, electronic device, and method of manufacturing circuit board
#257Mounting structure and mounting method
#258Electronic module produced by sequential fixation of the components
#259Ceramic electronic component and electronic device
#260Circuit device and method for manufacturing same
#261Solder-mounted board, production method therefor, and semiconductor device
#262Underfill device and method
#263Recyclable circuit assembly
#264Multilayered film element
#265Method for manufacturing PCB
#266Electronic device
#267Selective application by electroless plating of a tin-whisker impenetrable metal cap to metals on electronic assemblies
#268Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad
#269Semiconductor device
#270Damage index predicting system and method for predicting damage-related index
#271Method and device for contacting, positioning and impinging a solder ball formation with laser energy
#272Electronic component assembly
#273PCB mounting method
#274Materials for use with interconnects of electrical devices and related methods
#275Computer systems having an interposer including a flexible material
#276Forming a stress compensation layer and structures formed thereby