238910 ⎘
Adhesive bonding and miscellaneous chemical manufacture; Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
Sub-classes:Method and apparatus for transferring micro device, and electronic product using the same
#2Chip ejecting apparatus
#3Apparatus for manufacturing element array and apparatus for removing specific element
#4Composition for forming a coating film for removing foreign matters
#5Substrate separation system and method
#6Method and apparatus for producing flexible OLED device
#7Apparatus of separating flexible panel from glass substrate and method thereof
#8Cover structure for a light source, light illuminating apparatus having the same
#9Method and device for separating different material layers of a composite component
#10Film separation apparatus and film separation method
#11Laser lift off systems and methods
#12Methods for processing a substrate
#13Separation apparatus and separation method for flexible display panel
#14Temporary carrier debond initiation, and associated systems and methods
#15Detaping machine and detaping method
#16Method for manufacturing circuit board
#17Double layer release temporary bond and debond processes and systems
#18Methods and systems for separating a plurality of directed self-assembled diamagnetic components
#19Method for handling a product substrate and a bonded substrate system
#20Laminate, and element comprising substrate manufactured using same
#21Apparatus and method for reclaiming curved and bendable display screens
#22Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using high pressure solvent
#23Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using chemical and mechanical means
#24Device for delaminating laminate, delamination method, and method for manufacturing electronic device
#25Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
#26Manufacturing apparatus for flexible electronics
#27Device and method for at least partly dissolving a connecting layer of a temporarily bonded substrate stack
#28Film peeling apparatus and a method of peeling film
#29Method for performing delamination of a polymer film
#30Layered body of temporary adhesive
#31Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
#32Sample holder, device and method for detaching of a first substrate
#33Devices for methodologies related to wafer carriers
#34Wafer debonding using mid-wavelength infrared radiation ablation
#35Method and apparatus for separating semiconductor devices from a wafer
#36Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
#37Device and method for loosening a first substrate
#38Double layer release temporary bond and debond processes and systems
#39Method for handling a product substrate, a bonded substrate system and a temporary adhesive
#40Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
#41Apparatus of separating flexible substrate from glass substrate and manufacturing equipment thereof
#42Chip removing device
#43Polyimides as laser release materials for 3-D IC applications
#44Clamping apparatus for cleaving a bonded wafer structure and methods for cleaving
#45Laser stripping apparatus
#46Supporting member separation method
#47Delamination method, delamination device, and delamination system
#48Laminite, and element comprising substrate manufactured using same
#49Laser lift off systems and methods
#50Laser ashing of polyimide for semiconductor manufacturing
#51Peeling system
#52Method for stripping a product substrate from a carrier substrate
#53Method for thermal-slide debonding of temporary bonded semiconductor wafers
#54Device for stripping a product substrate from a carrier substrate
#55Controlled process and resulting device
#56Method and apparatus for separating semiconductor devices from a wafer
#57Apparatus for separating wafer from carrier
#58Substrate conveyance apparatus and substrate peeling system
#59Chip sorting apparatus
#60Delamination system
#61Device and method for stripping a product substrate from a carrier substrate
#62Device for releasing an interconnect layer that provides connection between a carrier and a wafer
#63Method and device for peeling off silicon wafers
#64Peeling device, peeling system and peeling method
#65Apparatus and method of separating wafer from carrier
#66Tape feeder and method of mounting tape onto tape feeder
#67Controlled process and resulting device
#68Clamping apparatus for cleaving a bonded wafer structure
#69Methods for cleaving a bonded wafer structure
#70Fabrication method of semiconductor devices and fabrication system of semiconductor devices
#71Systems and methods for cleaving a bonded wafer pair
#72Tape feeder and method of mounting tape on tape feeder
#73Electronic-circuit-component supplying device
#74Device and method for detaching a semiconductor wafer from a substrate
#75Laser ashing of polyimide for semiconductor manufacturing
#76DEVICES FOR METHODOLOGIES RELATED TO WAFER CARRIERS
#77Device for stripping a wafer from a carrier
#78Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
#79Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
#80CONTROLLED PROCESS AND RESULTING DEVICE
#81Sheet peeling apparatus and peeling method
#82Sheet peeling apparatus and peeling method
#83Laser lift off systems and methods
#84Chip sorting apparatus
#85Apparatus for temporary wafer bonding and debonding
#86Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers
#87Controlled process and resulting device
#88Device for centering wafers
#89Apparatus for mechanically debonding temporary bonded semiconductor wafers
#90Flanged collet for die pick-up tool
#91Separating device and method thereof
#92Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
#93Apparatus for manufacturing ultrathin substrate using a laminate body
#94Microchip manufacturing method
#95Separating device
#96Controlled process and resulting device
#97Controlled cleaving process
#98SUBSTRATE SUPPORTING PLATE
#99Stripping device and stripping apparatus
#100Controlled process and resulting device
#101Controlled process and resulting device
#102Controlled cleaving process
#103Method of manufacturing semiconductor device
#104Adhesive sheet for affixation of a wafer and method for processing using the same
#105Film peeling method and film peeling device
#106Sample processing system
#107Controlled cleaving process
#108Substrate supporting plate and stripping method for supporting plate
#109Mold release layer transferring film and laminate film
#110Method for producing a protective cover for a device