238911 ⎘
Adhesive bonding and miscellaneous chemical manufacture; Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide; Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer Peeling away backing
Sub-classes:Method of manufacturing element array and method of removing specific element
#2Apparatus for manufacturing element array and apparatus for removing specific element
#3Device for releasing an interconnect layer that provides connection between a carrier and a wafer
#4Method for detaching a semiconductor chip from a foil
#5Device for stripping a wafer from a carrier
#6Control and monitoring system for thin die detachment and pick-up
#7Device for thin die detachment and pick-up
#8Tape application method and tape application device
#9Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods
#10Method for mount tape die release system for thin die ejection