Y10S156/942 - CPC Classification Index

ClassID:

238921 ⎘

Y10S156/942 - CPC Classification

Classification description:

Adhesive bonding and miscellaneous chemical manufacture; Apparatus having delaminating means adapted for delaminating a specified article; Means for delaminating semiconductive product with reorientation means

Recent Application in this class:

20200227468

2020-07-16

Method of manufacturing element array and method of removing specific element

20200215809

2020-07-09

Apparatus for manufacturing element array and apparatus for removing specific element

20150096690

2015-04-09

Method for stripping a product substrate from a carrier substrate

20150083342

2015-03-26

Method for thermal-slide debonding of temporary bonded semiconductor wafers

20150075725

2015-03-19

Device for stripping a product substrate from a carrier substrate

20140069588

2014-03-13

Delamination system

20130340947

2013-12-26

Device and method for stripping a product substrate from a carrier substrate

20120152465

2012-06-21

Device and method for detaching a semiconductor wafer from a substrate

20110014774

2011-01-20

Apparatus for temporary wafer bonding and debonding

#10

20110010908

2011-01-20

Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers

#11

20100266373

2010-10-21

Device for centering wafers

#12

20100263794

2010-10-21

Apparatus for mechanically debonding temporary bonded semiconductor wafers