Y10S156/941 - CPC Classification Index

#1

20210166959

2021-06-03

Method and apparatus for transferring micro device, and electronic product using the same

#2

20200294839

2020-09-17

Chip ejecting apparatus

#3

20200227468

2020-07-16

Method of manufacturing element array and method of removing specific element

#4

20200215809

2020-07-09

Apparatus for manufacturing element array and apparatus for removing specific element

#5

20200105716

2020-04-02

Substrate separation system and method

#6

20190392736

2019-12-26

Method and apparatus for producing flexible OLED device

#7

20190386255

2019-12-19

Apparatus of separating flexible panel from glass substrate and method thereof

#8

20190311926

2019-10-10

Cover structure for a light source, light illuminating apparatus having the same

#9

20190308405

2019-10-10

Method and device for separating different material layers of a composite component

#10

20190279905

2019-09-12

Laser lift off systems and methods

#11

20190275782

2019-09-12

Methods for processing a substrate

#12

20190232634

2019-08-01

Separation apparatus and separation method for flexible display panel

#13

20190198377

2019-06-27

Temporary carrier debond initiation, and associated systems and methods

#14

20190148187

2019-05-16

Detaping machine and detaping method

#15

20190115243

2019-04-18

Double layer release temporary bond and debond processes and systems

#16

20180350683

2018-12-06

Method for handling a product substrate and a bonded substrate system

#17

20180269077

2018-09-20

Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using high pressure solvent

#18

20180264797

2018-09-20

Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using chemical and mechanical means

#19

20180222176

2018-08-09

Device for delaminating laminate, delamination method, and method for manufacturing electronic device

#20

20180194125

2018-07-12

Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same

#21

20180145255

2018-05-24

Manufacturing apparatus for flexible electronics

#22

20180040489

2018-02-08

Device and method for at least partly dissolving a connecting layer of a temporarily bonded substrate stack

#23

20170348961

2017-12-07

Film peeling apparatus and a method of peeling film

#24

20170348959

2017-12-07

Method for performing delamination of a polymer film

#25

20170136760

2017-05-18

Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same

#26

20170133243

2017-05-11

Sample holder, device and method for detaching of a first substrate

#27

20170125275

2017-05-04

Devices for methodologies related to wafer carriers

#28

20170125268

2017-05-04

Wafer debonding using mid-wavelength infrared radiation ablation

#29

20170117183

2017-04-27

Method and apparatus for separating semiconductor devices from a wafer

#30

20170028702

2017-02-02

Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same

#31

20160329235

2016-11-10

Device and method for loosening a first substrate

#32

20160329233

2016-11-10

Double layer release temporary bond and debond processes and systems

#33

20160218039

2016-07-28

Method for handling a product substrate, a bonded substrate system and a temporary adhesive

#34

20160207732

2016-07-21

Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same

#35

20160118286

2016-04-28

Apparatus of separating flexible substrate from glass substrate and manufacturing equipment thereof

#36

20160095269

2016-03-31

Chip removing device

#37

20160023436

2016-01-28

Polyimides as laser release materials for 3-D IC applications

#38

20150375495

2015-12-31

Clamping apparatus for cleaving a bonded wafer structure and methods for cleaving

#39

20150375494

2015-12-31

Laser stripping apparatus

#40

20150325465

2015-11-12

Supporting member separation method

#41

20150239227

2015-08-27

Delamination method, delamination device, and delamination system

#42

20150179523

2015-06-25

Laser lift off systems and methods

#43

20150162300

2015-06-11

Laser ashing of polyimide for semiconductor manufacturing

#44

20150136331

2015-05-21

Peeling system

#45

20150096690

2015-04-09

Method for stripping a product substrate from a carrier substrate

#46

20150083342

2015-03-26

Method for thermal-slide debonding of temporary bonded semiconductor wafers

#47

20150075725

2015-03-19

Device for stripping a product substrate from a carrier substrate

#48

20140367015

2014-12-18

Method and apparatus for separating semiconductor devices from a wafer

#49

20140360671

2014-12-11

Apparatus for separating wafer from carrier

#50

20140234033

2014-08-21

Substrate conveyance apparatus and substrate peeling system

#51

20140202627

2014-07-24

Chip sorting apparatus

#52

20140069588

2014-03-13

Delamination system

#53

20130340947

2013-12-26

Device and method for stripping a product substrate from a carrier substrate

#54

20130327485

2013-12-12

Device for releasing an interconnect layer that provides connection between a carrier and a wafer

#55

20130319619

2013-12-05

Method and device for peeling off silicon wafers

#56

20130269879

2013-10-17

Peeling device, peeling system and peeling method

#57

20130248119

2013-09-26

Apparatus and method of separating wafer from carrier

#58

20130153619

2013-06-20

Tape feeder and method of mounting tape onto tape feeder

#59

20130118692

2013-05-16

Method of detaching plates

#60

20130105539

2013-05-02

Clamping apparatus for cleaving a bonded wafer structure

#61

20130105538

2013-05-02

Methods for cleaving a bonded wafer structure

#62

20130095613

2013-04-18

Fabrication method of semiconductor devices and fabrication system of semiconductor devices

#63

20130062020

2013-03-14

Systems and methods for cleaving a bonded wafer pair

#64

20120305585

2012-12-06

Tape feeder and method of mounting tape on tape feeder

#65

20120285628

2012-11-15

Electronic-circuit-component supplying device

#66

20120263956

2012-10-18

Display, manufacturing method therefor and transparent resin charging material

#67

20120152465

2012-06-21

Device and method for detaching a semiconductor wafer from a substrate

#68

20120111496

2012-05-10

Laser ashing of polyimide for semiconductor manufacturing

#69

20120080832

2012-04-05

DEVICES FOR METHODOLOGIES RELATED TO WAFER CARRIERS

#70

20120000613

2012-01-05

Device for stripping a wafer from a carrier

#71

20110308739

2011-12-22

Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate

#72

20110192547

2011-08-11

Control and monitoring system for thin die detachment and pick-up

#73

20110162790

2011-07-07

Sheet peeling apparatus and peeling method

#74

20110155328

2011-06-30

Sheet peeling apparatus and peeling method

#75

20110132549

2011-06-09

Laser lift off systems and methods

#76

20110017407

2011-01-27

Chip sorting apparatus

#77

20110014774

2011-01-20

Apparatus for temporary wafer bonding and debonding

#78

20110011527

2011-01-20

Wrapping an object with a film using a tape for cutting the film

#79

20110010908

2011-01-20

Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers

#80

20100314894

2010-12-16

Fixed jig, chip pickup method and chip pickup apparatus

#81

20100266373

2010-10-21

Device for centering wafers

#82

20100263794

2010-10-21

Apparatus for mechanically debonding temporary bonded semiconductor wafers

#83

20100252205

2010-10-07

Device for thin die detachment and pick-up

#84

20090139662

2009-06-04

Separating device

#85

20080230183

2008-09-25

Releasing method and releasing apparatus of work having adhesive tape

#86

20080023149

2008-01-31

Semiconductor wafer mount apparatus

#87

20080023134

2008-01-31

Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods

#88

20070125751

2007-06-07

Stripping device and stripping apparatus

#89

20070034331

2007-02-15

Releasing method and releasing apparatus of work having adhesive tape

#90

20060162868

2006-07-27

Tape feeder and tape feeding and recovering modules therefor

#91

20060084241

2006-04-20

Apparatus for controlled fracture substrate singulation

#92

20060011644

2006-01-19

Part feeding device and part feeding method

#93

20050247407

2005-11-10

Terminal electrode forming apparatus and system for holding electronic components

#94

20050236114

2005-10-27

Sample processing system

#95

20050205204

2005-09-22

Peeling device and peeling method

#96

20050121140

2005-06-09

Component supply system

#97

20050101109

2005-05-12

Controlled fracture substrate singulation

#98

20050098887

2005-05-12

Using backgrind wafer tape to enable wafer mounting of bumped wafers

#99

20050067097

2005-03-31

Releasing method and releasing apparatus of work having adhesive tape

#100

20050019980

2005-01-27

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

#101

20050000650

2005-01-06

System for handling components at a component mounting machine

#102

15867071

2018-08-07

Method for mount tape die release system for thin die ejection