Patents-Review.com
ClassID:

238922 ⎘

Y10S156/943 - CPC Classification

Classification description:

Adhesive bonding and miscellaneous chemical manufacture; Apparatus having delaminating means adapted for delaminating a specified article; Means for delaminating semiconductive product with poking delaminating means, e.g. jabbing means

Recent Application in this class:
#1
20250158000
2025-05-15

Method For Manufacturing Display Device and Display Device Manufacturing Apparatus

 #2
20220336254
2022-10-20

Detaching a die from an adhesive tape by air ejection

 #3
20220045039
2022-02-10

Method for manufacturing display device and display device manufacturing apparatus

 #4
20210070030
2021-03-11

Apparatus for separating a window and method for separating a window using the same

 #5
20200365430
2020-11-19

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

 #6
20200294839
2020-09-17

Chip ejecting apparatus

 #7
20190299586
2019-10-03

Film separation apparatus and film separation method

 #8
20190210351
2019-07-11

Apparatus for separating a window and method for separating a window using the same

 #9
20170133259
2017-05-11

System and method for peeling a semiconductor chip from a tape using a multistage ejector

 #10
20150083344
2015-03-26

Separation device and pickup system

 #11
20150083342
2015-03-26

Method for thermal-slide debonding of temporary bonded semiconductor wafers

 #12
20140299277
2014-10-09

Wafer-related data management method and wafer-related data creation device

 #13
20140251760
2014-09-11

Die eject assembly for die bonder

 #14
20140196853
2014-07-17

Method for detaching a semiconductor chip from a foil

 #15
20140060751
2014-03-06

Die bonding apparatus, die picking up apparatus and die picking up method

 #16
20130327485
2013-12-12

Device for releasing an interconnect layer that provides connection between a carrier and a wafer

 #17
20130272837
2013-10-17

Semiconductor die pick-up apparatus and method of picking up semiconductor die using the same

 #18
20130255889
2013-10-03

Method for detaching a semiconductor chip from a foil

 #19
20130118692
2013-05-16

Method of detaching plates

 #20
20130098542
2013-04-25

Method and apparatus for peeling protective tape

 #21
20130048222
2013-02-28

Substrate separating apparatus, load lock apparatus, substrate bonding apparatus, substrate separating method, and manufacturing method of a semiconductor apparatus

 #22
20120244647
2012-09-27

Pick-up method of die bonder and die bonder

 #23
20120000613
2012-01-05

Device for stripping a wafer from a carrier

 #24
20110220296
2011-09-15

METHOD AND APPARATUS FOR PEELING PROTECTIVE TAPE

 #25
20110192547
2011-08-11

Control and monitoring system for thin die detachment and pick-up

 #26
20110014774
2011-01-20

Apparatus for temporary wafer bonding and debonding

 #27
20110010908
2011-01-20

Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers

 #28
20100266373
2010-10-21

Device for centering wafers

 #29
20100263794
2010-10-21

Apparatus for mechanically debonding temporary bonded semiconductor wafers

 #30
20100252205
2010-10-07

Device for thin die detachment and pick-up

 #31
20090279995
2009-11-12

Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method

 #32
20080173407
2008-07-24

System for peeling semiconductor chips from tape

 #33
20070093039
2007-04-26

Tools and methods for disuniting semiconductor wafers

 #34
20050255673
2005-11-17

Apparatus for semiconductor chip detachment

 #35
20050000648
2005-01-06

Separation method for object and glue membrane