240291 ⎘
Active solid-state devices, e.g. transistors, solid-state diodes with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
Semiconductor device including first inductor of a spiral shape and a second inductor having an opening which is opposite the first inductor
#2Integrated circuit package including embedded thin-film battery
#3Battery pack with integral seal member and electronic device including the same
#4Semiconductor device
#5Semiconductor device including a thin film transistor and a capacitor
#6Nonvolatile memory element having a tantalum oxide variable resistance layer
#7Nonvolatile memory element having a tantalum oxide variable resistance layer
#8Capacitors and methods of manufacture thereof
#9Inductively coupled integrated circuit with magnetic communication path and methods for use therewith
#10Variable resistance nonvolatile memory apparatus
#11Inductively coupled integrated circuit with magnetic communication path and methods for use therewith
#12Semiconductor device having metal cap divided by slit
#13Apparatus for non-conductively interconnecting integrated circuits
#14Capacitive element, method of manufacture of the same, and semiconductor device
#15Thermal paste containment for semiconductor modules
#16Thin Profile Battery Bonding Method, Method Of Conductively Interconnecting Electronic Components, Battery Powerable Apparatus, Radio Frequency Communication Device, And Electric Circuit
#17Package structure of a microphone
#18Semiconductor device with power noise suppression
#19Lead frame with included passive devices
#20Semiconductor device including a thin film transistor and capacitor
#21Semiconductor device including triple-stacked structures having the same structure
#22Thermal paste containment for semiconductor modules
#23Semiconductor device having capacitors for reducing power source noise
#24Method of forming a card with embedded IC and electrochemical cell
#25Package structure of a microphone
#26Array capacitors for broadband decoupling applications
#27Semiconductor device having MIM capacitive elements and manufacturing method for the same
#28Integrated current sensor package
#29Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof
#30Device having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry of an integrated circuit
#31Semiconductor device and manufacturing method of the same
#32Thermal paste containment for semiconductor modules
#33Capacitive element, method of manufacture of the same, and semiconductor device
#34Semiconductor device having capacitors for reducing power source noise
#35Semiconductor device and method of manufacturing the same
#36Semiconductor device and method having capacitor and capacitor insulating film that includes preset metal element
#37Method of making chip type solid electrolytic capacitor having a small size and a simple structure
#38Image sensitive electronic device packages
#39MULTI-CHIP BALL GRID ARRAY PACKAGE
#40Methods for sealing chambers of microelectronic packages
#41Capacitors and methods of manufacture thereof
#42Optical scanner package having heating dam
#43Semiconductor assembly with conductive rim and method of producing the same
#44Method and system for a pad structure for use with a semiconductor package
#45Array capacitor apparatuses to filter input/output signal
#46Microelectronic package having chamber sealed by material including one or more intermetallic compounds
#47Methods for packaging image sensitive electronic devices
#48Methods for packaging image sensitive electronic devices
#49Methods for packaging image sensitive electronic devices
#50System and method for providing a low frequency filter pole
#51Methods for packaging image sensitive electronic devices
#52Integrated circuit package including embedded thin-film battery
#53Apparatus for providing capacitive decoupling between on-die power and ground conductors
#54Package for semiconductor light emitting element and semiconductor light emitting device
#55Silicon barrier capacitor device structure
#56Method of using capacitive bonding in a high frequency integrated circuit
#57Method of fabricating an apparatus including a sealed cavity
#58Exposed pad module integrating a passive device therein
#59Semiconductor device and manufacturing method for the same
#60Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device
#61Semiconductor package structure with reduced parasite capacitance and method of fabricating the same
#62Semiconductor package assembly and method for electrically isolating modules
#63Circuit carrier and package structure thereof
#64Semiconductor device having capacitors for reducing power source noise
#65Semiconductor package assembly and method for electrically isolating modules
#66Semiconductor package assembly and method for electrically isolating modules
#67Semiconductor package assembly and method for electrically isolating modules
#68Semiconductor package assembly and method for electrically isolating modules
#69Semiconductor assembly with conductive rim and method of producing the same
#70Semiconductor device and method for preparing the same
#71Integrated circuit inductors
#72Capacitor and method for manufacturing the same
#73Semiconductor package assembly and method for electrically isolating modules
#74Packages for image sensitive electronic devices
#75Semiconductor chip package having decoupling capacitor and manufacturing method thereof
#76Method of fabricating an array of wafer scale polymeric caps
#77Hermetic sealing cap and method of manufacturing the same
#78Semiconductor device and manufacturing method of the same
#79Method and apparatus for non-conductively interconnecting integrated circuits