ClassID:

242002

Y10S438/913 - CPC Classification

Classification description:

Semiconductor device manufacturing: process Diverse treatments performed in unitary chamber

Recent Application in this class:
#1
20140070213
2014-03-13

Methods for discretized processing and process sequence integration of regions of a substrate

#2
20130065796
2013-03-14

Advanced Mixing System for Integrated Tool Having Site-Isolated Reactors

#3
20130056101
2013-03-07

Methods for discretized processing and process sequence integration of regions of a substrate

#4
20120231975
2012-09-13

Advanced mixing system for integrated tool having site-isolated reactors

#5
20120074096
2012-03-29

Methods for discretized processing and process sequence integration of regions of a substrate

#6
20120048829
2012-03-01

Methods for discretized processing and process sequence integration of regions of a substrate

#7
20120043298
2012-02-23

Methods for discretized processing and process sequence integration of regions of a substrate

#8
20120021553
2012-01-26

Methods for discretized processing and process sequence integration of regions of a substrate

#9
20110281773
2011-11-17

Advanced mixing method for integrated tool having site-isolated reactors

#10
20110271907
2011-11-10

Device for processing a substrate, method of processing a substrate and method of manufacturing semiconductor device

#11
20110229989
2011-09-22

Large scale method and furnace system for selenization of thin film photovoltaic materials

#12
20100167542
2010-07-01

Methods of titanium deposition

#13
20100136714
2010-06-03

Device for processing a substrate, method of processing a substrate and method of manufacturing semiconductor device

#14
20090170337
2009-07-02

Device for processing substrate and method of manufacturing semiconductor device

#15
20080268633
2008-10-30

Methods of titanium deposition

#16
20080156769
2008-07-03

Advanced mixing system for integrated tool having site-isolated reactors

#17
20080133161
2008-06-05

Methods for discretized processing and process sequence integration of regions of a substrate

#18
20080132089
2008-06-05

Methods for discretized processing and process sequence integration of regions of a substrate

#19
20080012013
2008-01-17

Pattern manufacturing equipments, organic thin-film transistors and manufacturing methods for organic thin-film transistor

#20
20070093072
2007-04-26

Epitaxial wafer and method for producing same

#21
20070082508
2007-04-12

Methods for discretized processing and process sequence integration of regions of a substrate

#22
20060219175
2006-10-05

Oxide-like seasoning for dielectric low k films

#23
20060185596
2006-08-24

Vapor phase growth method by controlling the heat output in the gas introduction region

#24
20060177579
2006-08-10

Method for manufacturing semiconductor device

#25
20050227499
2005-10-13

Oxide-like seasoning for dielectric low k films

#26
20050150460
2005-07-14

Insitu post atomic layer deposition destruction of active species

#27
20050103261
2005-05-19

Epitaxially coated semiconductor wafer

#28
20050032391
2005-02-10

Method for processing a semiconductor wafer

#29
20050025691
2005-02-03

Method for heat treatment of silicon wafers and silicon wafer