ClassID:

242033

Y10S438/944 - CPC Classification

Classification description:

Semiconductor device manufacturing: process; Masking Shadow

Recent Application in this class:
#1
20150116610
2015-04-30

Touch panel

#2
20140116756
2014-05-01

Touch panel

#3
20110024041
2011-02-03

Method of manufacturing semiconductor device, and etching apparatus

#4
20100144154
2010-06-10

Method of manufacturing semiconductor device, and etching apparatus

#5
20100095885
2010-04-22

Shadow mask deposition of materials using reconfigurable shadow masks

#6
20100072466
2010-03-25

Electronic circuit with repetitive patterns formed by shadow mask vapor deposition and a method of manufacturing an electronic circuit element

#7
20090325355
2009-12-31

Reducing implant degradation in tilted implantations by shifting implantation masks

#8
20090298241
2009-12-03

Method of fabricating vertical thin film transistor

#9
20090004605
2009-01-01

Semiconductor processing methods of transferring patterns from patterned photoresists to materials

#10
20080014686
2008-01-17

Method of fabricating vertical thin film transistor

#11
20070246706
2007-10-25

Electronic circuit with repetitive patterns formed by shadow mask vapor deposition and a method of manufacturing an electronic circuit element

#12
20070243719
2007-10-18

Shadow mask deposition of materials using reconfigurable shadow masks

#13
20070176301
2007-08-02

Structure and method for bond pads of copper-metallized integrated circuits

#14
20070155052
2007-07-05

Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking light

#15
20070111526
2007-05-17

Semiconductor processing methods of patterning materials

#16
20070051311
2007-03-08

System for and method of forming via holes by multiple deposition events in a continuous inline shadow mask deposition process

#17
20070032085
2007-02-08

Method for forming recesses

#18
20070032038
2007-02-08

Method for forming recesses

#19
20060281206
2006-12-14

Shadow mask deposition of materials using reconfigurable shadow masks

#20
20060267203
2006-11-30

Structure and method for bond pads of copper-metallized integrated circuits

#21
20060141761
2006-06-29

System for and method of forming via holes by multiple deposition events in a continuous inline shadow mask deposition process

#22
20060110860
2006-05-25

Self-adjusting serial circuit of thin layers and method for production thereof

#23
20060003560
2006-01-05

Method for fabricating a shadow mask in a trench of a microelectronic or micromechanical structure

#24
20050245056
2005-11-03

Ion implantation with multiple concentration levels

#25
20050173238
2005-08-11

Automatically adjusting serial connections of thick and thin layers and method for the production thereof

#26
20050112504
2005-05-26

Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking light