242047 ⎘
Semiconductor device manufacturing: process Passivation layer
Vertical structure LEDs
#2Vertical structure LEDs
#3Vertical structure LEDs
#4Vertical structure LEDs
#5Insulated gate field effect transistor having passivated schottky barriers to the channel
#6Vertical structure LEDs
#7Vertical structure LEDs
#8Vertical structure LEDs
#9Method of manufacturing organic light-emitting display apparatus
#10Insulated gate field effect transistor having passivated schottky barriers to the channel
#11Method of fabricating vertical structure LEDs
#12Semiconductor device and method of manufacturing the same
#13Insulated gate field effect transistor having passivated schottky barriers to the channel
#14Self-leveling planarization materials for microelectronic topography
#15Ionizing radiation blocking in IC chip to reduce soft errors
#16Insulated gate field effect transistor having passivated schottky barriers to the channel
#17Method of fabricating vertical structure LEDs
#18Methods of fabricating non-volatile memory devices having carbon nanotube layer and passivation layer
#19Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element
#20Method of fabricating vertical structure LEDs
#21Surface treatment and passivation of AlGaN/GaN HEMT
#22Process for precision placement of integrated circuit overcoat material
#23Method of passivating and encapsulating CdTe and CZT segmented detectors
#24Method of fabricating vertical structure LEDs
#25Method for manufacturing thin film transistor having hydrogen feeding layer formed between a metal gate and a gate insulating film
#26Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element
#27Ionizing radiation blocking in IC chip to reduce soft errors
#28Nonvolatile memory devices and methods of fabricating the same
#29Method for fabricating a pixel structure of a liquid crystal display
#30Method for patterning contact etch stop layers by using a planarization process
#31Process for precision placement of integrated circuit overcoat material
#32Method of fabricating vertical structure LEDs
#33Method of fabricating vertical structure LEDs
#34Porous silicon dielectric
#35Insulated gate field effect transistor having passivated schottky barriers to the channel
#36Manufacturing method for packaged semiconductor device
#37Method using TEOS ramp-up during TEOS/ozone CVD for improved gap-fill
#38Method of fabricating vertical structure LEDs
#39Method of passivating semiconductor device
#40Semiconductor component with passivation layer
#41Semiconductor device and fabrication process thereof
#42Method using TEOS ramp-up during TEOS/ozone CVD for improved gap-fill
#43Semiconductor processing methods
#44Layer system comprising a silicon layer and a passivation layer, method for production a passivation layer on a silicon layer and the use of said system and method
#45Method of fabricating vertical structure LEDs
#46Multi-layer film stack for extinction of substrate reflections during patterning
#47Multi-layer film stack for extinction of substrate reflections during patterning
#48Dielectric barrier layer films
#49Method of fabricating vertical structure LEDs
#50Method for photoresist stripping and treatment of low-k dielectric material
#51Hermetic chip in wafer form
#52Multi-layer dielectric and method of forming same
#53Packaged semiconductor device
#54Method of using a setter having a recess in manufacturing a net-shape semiconductor wafer
#55Hermetic passivation structure with low capacitance
#56Method of fabricating vertical structure LEDs
#57Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates
#58Method of passivating semiconductor device
#59Method using TEOS ramp-up during TEOS/ozone CVD for improved gap-fill
#60Dielectric barrier layer films
#61Biosensor and system and process for forming