ClassID:

242048

Y10S438/959 - CPC Classification

Classification description:

Semiconductor device manufacturing: process Mechanical polishing of wafer

Recent Application in this class:
#1
20150187765
2015-07-02

Semiconductor device having a high-K gate dielectric above an STI region

#2
20130126998
2013-05-23

Radiation detectors and methods of fabricating radiation detectors

#3
20120184108
2012-07-19

METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICONDUCTOR WAFER, METHOD OF PRODUCING NITRIDE SEMICONDUCTOR DEVICE AND NITRIDE SEMICONDUCTOR DEVICE

#4
20120175786
2012-07-12

METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE

#5
20120090536
2012-04-19

Method for producing silicon epitaxial wafer

#6
20120080775
2012-04-05

Method of polishing a silicon wafer

#7
20120070959
2012-03-22

Microelectronic device wafers and methods of manufacturing

#8
20120043645
2012-02-23

Nitride semiconductor wafer having a chamfered edge

#9
20110095393
2011-04-28

Creating extremely thin semiconductor-on-insulator (ETSOI) having substantially uniform thickness

#10
20110049679
2011-03-03

Method of processing of nitride semiconductor wafer, nitride semiconductor wafer, method of producing nitride semiconductor device and nitride semiconductor device

#11
20100279440
2010-11-04

Nitride semiconductor wafer and method of processing nitride semiconductor wafer

#12
20100270649
2010-10-28

Nitride semiconductor wafer

#13
20100252915
2010-10-07

Microelectronic device wafers and methods of manufacturing

#14
20090263959
2009-10-22

Method of manufacturing semiconductor wafer

#15
20090250790
2009-10-08

Nitride semiconductor wafer and method of processing nitride semiconductor wafer

#16
20090230567
2009-09-17

Method of post-mold grinding a semiconductor package

#17
20090186563
2009-07-23

Wafer processing method

#18
20090087953
2009-04-02

Manufacturing process of leadframe-based BGA packages

#19
20090057813
2009-03-05

Method for self-aligned removal of a high-K gate dielectric above an STI region

#20
20080318497
2008-12-25

Method of machining substrate

#21
20080090505
2008-04-17

Wafer grinding method

#22
20070281484
2007-12-06

Surface treatment method for nitride crystal, nitride crystal substrate, nitride crystal substrate with epitaxial layer and semiconductor device, and method of manufacturing nitride crystal substrate with epitaxial layer and semiconductor device

#23
20070228521
2007-10-04

Gallium nitride substrate, and gallium-nitride-substrate testing and manufacturing methods

#24
20070196994
2007-08-23

Method of fabricating semiconductor device including planarizing conductive layer using parameters of pattern density and depth of trenches

#25
20070155284
2007-07-05

Wafer polishing control

#26
20070066082
2007-03-22

Epitaxially coated silicon wafer and method for producing epitaxially coated silicon wafer

#27
20070062819
2007-03-22

Control system for multi-layer chemical mechanical polishing process and control method for the same

#28
20070021042
2007-01-25

Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method

#29
20070004125
2007-01-04

Semiconductor device and manufacturing method thereof

#30
20060292826
2006-12-28

Wafer processing method

#31
20060203419
2006-09-14

Process and apparatus for thinning a semiconductor workpiece

#32
20060203418
2006-09-14

PROCESS AND APPARATUS FOR THINNING A SEMICONDUCTOR WORKPIECE

#33
20060169409
2006-08-03

Electrochemically polishing conductive films on semiconductor wafers

#34
20060128153
2006-06-15

Method for cleaning slurry particles from a surface polished by chemical mechanical polishing

#35
20060076040
2006-04-13

Semiconductive substrate cleaning systems

#36
20060040467
2006-02-23

Process and apparatus for thinning a semiconductor workpiece

#37
20060022337
2006-02-02

Hermetic chip in wafer form

#38
20050266689
2005-12-01

Chemical mechanical polishing composition and process

#39
20050221741
2005-10-06

Polymeric polishing pad having continuously regenerated work surface

#40
20050164435
2005-07-28

Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same

#41
20050153508
2005-07-14

Pocket implant for complementary bit disturb improvement and charging improvement of SONOS memory cell

#42
20050145879
2005-07-07

Nitride semiconductor wafer and method of processing nitride semiconductor wafer

#43
20050118824
2005-06-02

Multi-step chemical mechanical polishing of a gate area in a FinFET

#44
20050116323
2005-06-02

Semiconductor device and method for assembling the same

#45
20050112897
2005-05-26

Electrochemically polishing conductive films on semiconductor wafers

#46
14040741
2014-11-11

Semiconductor structure with means for testing metal-insulator-metal capacitors