ClassID:

242052

Y10S438/963 - CPC Classification

Classification description:

Semiconductor device manufacturing: process Removing process residues from vertical substrate surfaces

Recent Application in this class:
#1
20120322226
2012-12-20

Method of producing a semiconductor device including treatment with dilute hydrofluoric acid

#2
20120142171
2012-06-07

Method of forming a high capacitance diode

#3
20100221916
2010-09-02

Methods of etching oxide, reducing roughness, and forming capacitor constructions

#4
20100072573
2010-03-25

Method of forming a high capacitance diode and structure therefor

#5
20090169767
2009-07-02

Method for increasing the removal rate of photoresist layer

#6
20090079032
2009-03-26

Method of forming a high capacitance diode and structure therefor

#7
20080280803
2008-11-13

Composition for the removal of sidewall residues

#8
20080146036
2008-06-19

Semiconductor manufacturing process

#9
20080099040
2008-05-01

Integrated method for removal of halogen residues from etched substrates in a processing system

#10
20080087896
2008-04-17

Trench schottky barrier diode with differential oxide thickness

#11
20070241455
2007-10-18

Method for forming dual damascenes with supercritical fluid treatments

#12
20070190803
2007-08-16

Device and method to eliminate shorting induced by via to metal misalignment

#13
20070178702
2007-08-02

Semiconductor manufacturing method for removing residue generated by dry etching

#14
20070125750
2007-06-07

METHOD FOR REMOVING POST-ETCH RESIDUE FROM WAFER SURFACE

#15
20070093031
2007-04-26

Method of fabricating semiconductor devices

#16
20060258169
2006-11-16

Methods of etching oxide, reducing roughness, and forming capacitor constructions

#17
20060252256
2006-11-09

Method for removing post-etch residue from wafer surface

#18
20060086372
2006-04-27

Composition for the removing of sidewall residues

#19
20060076040
2006-04-13

Semiconductive substrate cleaning systems

#20
20060063364
2006-03-23

Method of forming a semiconductor device having a metal layer

#21
20060063292
2006-03-23

Method for producing a packaged integrated circuit

#22
20060006545
2006-01-12

Semiconductor structure and fabrication therefor

#23
20050277291
2005-12-15

Method of manufacturing electronic device

#24
20050260843
2005-11-24

Device and method to eliminate shorting induced by via to metal misalignment

#25
20050221541
2005-10-06

Ultra thin back-illuminated photodiode array fabrication methods

#26
20050153568
2005-07-14

Method for removing mottled etch in semiconductor fabricating process

#27
20050127465
2005-06-16

Trench Schottky barrier diode with differential oxide thickness

#28
20050026430
2005-02-03

Selective etching of carbon-doped low-k dielectrics