Y10S438/976 - CPC Classification Index

#1

20210090881

2021-03-25

Surface treatment agent and surface-treated body manufacturing method

#2

20180047933

2018-02-15

Light emitting device and method of manufacturing the same

#3

20170069866

2017-03-09

Light emitting device and method of manufacturing the same

#4

20150118807

2015-04-30

Method of fabricating an integrated circuit device

#5

20150021588

2015-01-22

Light emitting device and method of manufacturing the same

#6

20130320521

2013-12-05

Releasable buried layer for 3-D fabrication and methods of manufacturing

#7

20130237059

2013-09-12

Formation of SiOCl-containing layer on spacer sidewalls to prevent CD loss during spacer etch

#8

20130023094

2013-01-24

Method of fabricating an integrated circuit device

#9

20110298055

2011-12-08

Semiconductor device and manufacturing method for the same

#10

20110263103

2011-10-27

Method and apparatus for cleaning a substrate surface

#11

20110229824

2011-09-22

METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

#12

20110027970

2011-02-03

METHOD FOR DICING WAFER AND PROCESS FOR MANUFACTURING LIQUID-DISCHARGING HEAD USING THE DICING METHOD

#13

20110024787

2011-02-03

Light emitting device and method of manufacturing the same

#14

20100273312

2010-10-28

Method of manufacturing semiconductor device

#15

20100226745

2010-09-09

Die pickup apparatus for picking up semiconductor dies and methods for picking up semiconductor dies

#16

20100099262

2010-04-22

Method of manufacturing non-volatile memory cell using self-aligned metal silicide

#17

20100062596

2010-03-11

Semiconductor device and manufacturing method for the same

#18

20100035407

2010-02-11

Method for manufacturing semiconductor device

#19

20090314414

2009-12-24

Method and system for contacting of a flexible sheet and a substrate

#20

20090279995

2009-11-12

Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method

#21

20090242111

2009-10-01

Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method

#22

20090128026

2009-05-21

Light emitting device and method of manufacturing the same

#23

20090084499

2009-04-02

Methods to prevent ECC (edge chipping and cracking) damage during die picking process

#24

20090032186

2009-02-05

Vibration-induced die detachment system

#25

20090029528

2009-01-29

Method and apparatus for cleaning a substrate surface

#26

20080271313

2008-11-06

METHOD, SYSTEM, AND APPARATUS FOR TRANSFER OF DIES USING A DIE PLATE

#27

20080078077

2008-04-03

Method for bonding slider row bars for photolithography process

#28

20080062568

2008-03-13

Process for fabricating a slider or head for a data storage device

#29

20080036018

2008-02-14

METHOD OF FABRICATING SPACERS AND CLEANING METHOD OF POST-ETCHING AND SEMICONDUCTOR DEVICE

#30

20080009106

2008-01-10

Method for manufacturing semiconductor device

#31

20070290219

2007-12-20

Light emitting device and method of manufacturing the same

#32

20070277934

2007-12-06

Workpiece processing device

#33

20070277929

2007-12-06

Method and device for detaching a component which is attached to a flexible film

#34

20070261783

2007-11-15

Methods and systems for removing protective films from microfeature workpieces

#35

20070228569

2007-10-04

Interconnects forming method and interconnects forming apparatus

#36

20070215672

2007-09-20

System for removal of an integrated circuit from a mount material

#37

20070117409

2007-05-24

Semiconductor integrated circuit device fabrication method

#38

20070109686

2007-05-17

Method for controlling overcoat recession in a magnetic thin film head

#39

20070087475

2007-04-19

Method and apparatus for peeling surface protective film

#40

20070054458

2007-03-08

Method of fabricating spacers and cleaning method of post-etching and semiconductor device

#41

20070008651

2007-01-11

Method of manufacturing a magnetic slider head

#42

20060237816

2006-10-26

Semiconductor device and manufacturing method for the same

#43

20060237142

2006-10-26

System for peeling semiconductor chips from tape

#44

20060174257

2006-08-03

Antenna designs for radio frequency identification tags

#45

20060172510

2006-08-03

Fabrication of stacked microelectronic devices

#46

20060159947

2006-07-20

Fabrication of stacked microelectronic devices

#47

20060138475

2006-06-29

Method of manufacturing a semiconductor device and semiconductor device obtained by means of such a method

#48

20060134896

2006-06-22

Process for manufacturing liquid ejection head

#49

20060124241

2006-06-15

Method of thermal adherend release and apparatus for thermal adherend release

#50

20060121257

2006-06-08

Method for producing a rewiring printed circuit board

#51

20060113595

2006-06-01

Rectangular substrate dividing apparatus

#52

20060090846

2006-05-04

Driving mechanism for chip detachment apparatus

#53

20060089004

2006-04-27

Protective tape applying and separating method

#54

20060054273

2006-03-16

Method of manufacturing semiconductor device

#55

20060051573

2006-03-09

Adhesive sheet for affixation of a wafer and method for processing using the same

#56

20050241754

2005-11-03

Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method

#57

20050235485

2005-10-27

Planarization method for a structure having a first surface for etching and a second surface

#58

20050205204

2005-09-22

Peeling device and peeling method

#59

20050148205

2005-07-07

Method for producing a protective cover for a device

#60

20050112805

2005-05-26

Method for manufacturing semiconductor device

#61

20050101103

2005-05-12

Method and apparatus for joining adhesive tape to back face of semiconductor wafer

#62

20050064702

2005-03-24

Interconnects forming method and interconnects forming apparatus

#63

20050054194

2005-03-10

Method for forming dual damascenes

#64

20050026415

2005-02-03

Fabrication of stacked microelectronic devices

#65

20050026395

2005-02-03

Fabrication of stacked microelectronic devices

#66

20050019980

2005-01-27

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

#67

20050015970

2005-01-27

Method, system, and apparatus for transfer of dies using a pin plate

#68

20050009232

2005-01-13

Method, system, and apparatus for transfer of dies using a die plate having die cavities

#69

20050008833

2005-01-13

Method and structure for small pitch z-axis electrical interconnections

#70

20050007252

2005-01-13

Method, system, and apparatus for authenticating devices during assembly

#71

20050006029

2005-01-13

Method and apparatus for picking up work piece and mounting machine

#72

20050005434

2005-01-13

Method, system, and apparatus for high volume transfer of dies

#73

20050000648

2005-01-06

Separation method for object and glue membrane