242066 ⎘
Semiconductor device manufacturing: process Thinning or removal of substrate
Peeling method and method of manufacturing semiconductor device
#2Vertical structure LEDs
#3Vertical structure LEDs
#4Vertical structure LEDs
#5Semiconductor device fabrication method and semiconductor device
#6Vertical structure LEDs
#7Peeling method and method of manufacturing semiconductor device
#8Semiconductor device fabrication method and semiconductor device
#9Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
#10Three dimensional device integration method and integrated device
#11Vertical structure LEDs
#12Peeling method and method of manufacturing semiconductor device
#13Semiconductor device fabrication method and semiconductor device
#14Peeling method and method of manufacturing semiconductor device
#15Three dimensional device integration method and integrated device
#16Light emitting device having light extraction structure and method for manufacturing the same
#17Vertical structure LEDs
#18Three dimensional device integration method and integrated device
#19Semiconductor device fabrication method and semiconductor device
#20Methods for processing substrates
#21Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
#22Vertical structure LEDs
#23Controlled process and resulting device
#24Three dimension structure memory
#25Peeling method and method of manufacturing semiconductor device
#26Methods for processing substrates
#27Semiconductor device fabrication method and semiconductor device
#28Light emitting device having light extraction structure and method for manufacturing the same
#29Method for manufacturing bonded wafer and bonded SOI wafer
#30Adhesive and protective member used in a wafer processing method
#31Method of fabricating vertical structure LEDs
#32Manufacturing method of solid-state image sensor
#33Electronic device manufacturing method and chip assembly
#34Three dimensional memory structure
#35Etching method using an at least semi-solid media
#36Fabrication method of light-emitting device
#37Wafer backside defectivity clean-up utilizing selective removal of substrate material
#38Three dimensional structure memory
#39Controlled process and resulting device
#40Wafer backside defectivity clean-up utilizing selective removal of substrate material
#41Light emitting device having light extraction structure and method for manufacturing the same
#42Method for manufacturing SOI substrate
#43Peeling method and method of manufacturing semiconductor device
#44METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICONDUCTOR WAFER, METHOD OF PRODUCING NITRIDE SEMICONDUCTOR DEVICE AND NITRIDE SEMICONDUCTOR DEVICE
#45Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound
#46Light-emitting device and method for producing light emitting device
#47Pressurized treatment of substrates to enhance cleaving process
#48METHOD OF PRODUCING A THIN LAYER OF SEMICONDUCTOR MATERIAL
#49Nitride semiconductor wafer having a chamfered edge
#50Light-emitting device and method for producing light emitting device
#51SOLID-STATE IMAGE SENSOR AND MANUFACTURING METHOD OF THE SENSOR
#52Light emitting device having light extraction structure and method for manufacturing the same
#53CONTROLLED PROCESS AND RESULTING DEVICE
#54Etching method using an at least semi-solid media
#55Semiconductor device manufacturing method
#56Chipstack package and manufacturing method thereof
#57Method for machining a workpiece on a workpiece support
#58Process of forming ultra thin wafers having an edge support ring
#59Pressurized treatment of substrates to enhance cleaving process
#60Three dimensional structure memory
#61Chip-stacked semiconductor device and manufacturing method thereof
#62Chip-stacked semiconductor and manufacturing method thereof
#63Method of fabricating vertical structure LEDs
#64Laser diode array, method of manufacturing same, printer, and optical communication device
#65Method of fabricating backside illuminated image sensor
#66Process for the transfer of a thin film comprising an inclusion creation step
#67Metal-oxide-semiconductor chip and fabrication method thereof
#68Method of processing of nitride semiconductor wafer, nitride semiconductor wafer, method of producing nitride semiconductor device and nitride semiconductor device
#69Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
#70Method of fabricating vertical structure LEDs
#71Method for fabricating a semiconductor on insulator type substrate
#72Controlled process and resulting device
#73Nitride semiconductor wafer
#74Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same
#75Three dimensional structure memory
#76Three dimensional structure memory
#77Three dimensional structure memory
#78Three dimensional structure memory
#79Growth substrates for inverted metamorphic multijunction solar cells
#80Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound
#81Semiconductor manufacturing method
#82Method for manufacturing SOI substrate
#83Method for reducing the thickness of substrates
#84Method for manufacturing a vertical transistor that includes a super junction structure
#85Light emitting device having light extraction structure and method for manufacturing the same
#86Light emitting device having light extraction structure and method for manufacturing the same
#87Light emitting device having light extraction structure
#88Light emitting device having light extraction structure and method for manufacturing the same
#89LITHOGRAPHIC CONTACT ELEMENTS
#90Method of fabricating backside illuminated image sensor
#91Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
#92Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
#93Method for manufacturing semiconductor device
#94Method for improving semiconductor surfaces
#95Method of fabricating an epitaxially grown layer
#96Method for manufacturing a multi-wavelength integrated semiconductor laser
#97Chip stacked structure and the forming method
#98Method of peeling thin film device and method of manufacturing semiconductor device using peeled thin film device
#99Method of fabricating vertical structure LEDs
#100METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
#101Three dimensional structure memory
#102Method of fabricating an epitaxially grown layer
#103Three dimensional structure memory
#104Three dimensional structure memory
#105Three dimensional structure memory
#106Three dimensional structure memory
#107Three dimensional structure memory
#108Chipstack package and manufacturing method thereof
#109Stacked integrated memory device
#110Three dimensional structure memory
#111Light-emitting device and method for producing light emitting device
#112Method for manufacturing SOI substrate
#113Method of producing a thin layer of semiconductor material
#114Method for manufacturing SOI substrate
#115INTEGRATED CIRCUIT CHIP MANUFATURING METHOD AND SEMICONDUCTOR DEVICE
#116Three dimensional structure memory
#117Laser diode array, method of manufacturing same, printer, and optical communication device
#118Method of peeling thin film device and method of manufacturing semiconductor device using peeled thin film device
#119Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same
#120Process of forming ultra thin wafers having an edge support ring
#121Ultra-thin die and method of fabricating same
#122Method of manufacturing a semiconductor device
#123Semiconductor device and method for manufacturing same
#124Flexible and elastic dielectric integrated circuit
#125Controlled process and resulting device
#126Method for relaxing a stressed thin film
#127BUILDING FULLY-DEPLETED AND BULK TRANSISTORS ON SAME CHIP
#128BUILDING FULLY-DEPLETED AND PARTIALLY-DEPLETED TRANSISTORS ON SAME CHIP
#129Microfabricated miniature grids
#130Methods for forming an assembly for transfer of a useful layer using a peripheral recess area to facilitate transfer
#131Flip FERAM cell and method to form same
#132Device grinding method
#133Chip-stacked semiconductor device and manufacturing method thereof
#134Method for manufacturing bonded wafer
#135Controlled cleaving process
#136Electronic components produced by a method of separating two layers of material from one another
#137Light generating semiconductor device and method of making the same
#138WAFER SCALE THIN FILM PACKAGE
#139Method of making lithographic contact elements
#140Method of fabricating a semiconductor device
#141Method of fabricating a semiconductor device
#142Semiconductor constructions and semiconductor device fabrication methods
#143Three dimensional device integration method and integrated device
#144Method of fabricating a semiconductor device
#145Method of fabricating a semiconductor device
#146Three dimensional device integration method and integrated device
#147Three dimensional device integration method and integrated device
#148Method of fabricating a semiconductor device
#149Method for producing semiconductor device
#150Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods
#151Element formation substrate, method of manufacturing the same, and semiconductor device
#152Method for manufacturing a vertical transistor that includes a super junction structure
#153Apparatus for housing a micromechanical structure
#154Method for manufacturing semiconductor device
#155Semiconductor laser device including transparent electrode
#156Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
#157III-V group nitride system semiconductor substrate
#158Method of fabricating vertical structure LEDs
#159Transfer method for forming a silicon-on-plastic wafer
#160Method of fabricating vertical structure LEDs
#161Chip stack package and manufacturing method thereof
#162Gating grid and method of manufacture
#163Light emitting device having light extraction structure and method for manufacturing the same
#164Process for the transfer of a thin film
#165Laser ablation to selectively thin wafers/die to lower device R
#166Method of fabricating backside illuminated image sensor
#167Light emitting device and method of fabricating the same
#168Method of fabricating a semiconductor device
#169Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board
#170Semiconductor constructions and semiconductor device fabrication methods
#171Flip FERAM cell and method to form same
#172Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby
#173Method for fabricating thin layer device
#174Controlled process and resulting device
#175Controlled process and resulting device
#176Method for machining a workpiece on a workpiece support
#177Device having inductors and capacitors
#178Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus
#179Method for fabricating a high performance PIN focal plane structure using three handle wafers
#180Methods for fabricating polysilicon film and thin film transistors
#181Method and apparatus for peeling surface protective film
#182Ultra thin FET
#183Packaging of electronic chips with air-bridge structures
#184III-V group nitride system semiconductor self-standing substrate, method of making the same and III-V group nitride system semiconductor wafer
#185Semiconductor wafer with a wiring structure, a semiconductor component, and methods for their production
#186Semiconductor wafers including one or more reinforcement structures and methods of forming the same
#187Semiconductor device and manufacturing method thereof
#188Wafer processing method
#189Three dimensional device integration method and integrated device
#190Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate
#191Method of thinning a semiconductor structure
#192Method of manufacturing light emitting diodes
#193Method for local wafer thinning and reinforcement
#194Etching method using an at least semi-solid media
#195PACKAGING OF ELECTRONIC CHIPS WITH AIR-BRIDGE STRUCTURES
#196Method of fabricating vertical structure LEDs
#197PACKAGING OF ELECTRONIC CHIPS WITH AIR-BRIDGE STRUCTURES
#198Methods for forming an assembly for transfer of a useful layer
#199Building fully-depleted and bulk transistors on same chip
#200Building fully-depleted and partially-depleted transistors on same chip
#201Display device and method of manufacturing the same
#202Method of manufacturing substrate, method of manufacturing organic electroluminescent display device using the method, and organic electroluminescent display device
#203Method for fabricating semiconductor component with thinned substrate having pin contacts
#204Methods for manufacturing porous dielectric substrates including patterned electrodes
#205Controlled cleaving process
#206Three-dimensional device fabrication method
#207Method of fabricating an epitaxially grown layer
#208Method of producing a thin layer of semiconductor material
#209Method of fabricating vertical structure LEDs
#210Polishing method
#211Methods for marking a bare semiconductor die including applying a tape having energy-markable properties
#212Method of fabricating an epitaxially grown layer
#213Method of fabricating vertical structure LEDs
#214Method of forming a semiconductor device having a dielectric layer with high dielectric constant
#215Method for producing a packaged integrated circuit
#216Method of separating MEMS devices from a composite structure
#217Flip FERAM cell and method to form same
#218Wafer reinforcement structure and methods of fabrication
#219Method for transferring a semiconductor body from a growth substrate to a support material
#220Semiconductor wafer having a separation portion on a peripheral area
#221Partial wafer bonding and dicing
#222Method and resulting structure for manufacturing semiconductor substrates
#223Method for fabricating a semiconductor device
#224Method of fabricating single-layer and multi-layer single crystalline silicon and silicon devices on plastic using sacrificial glass
#225Method of fabricating silicon on glass via layer transfer
#226Semiconductor component and assembly having female conductive members
#227Ultra-thin die and method of fabricating same
#228Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same
#229Packaging of electronic chips with air-bridge structures
#230Integrated circuit chip manufacturing method and semiconductor device
#231Semiconductor laser device and manufacturing method thereof
#232III-V group nitride system semiconductor self-standing substrate, method of making the same and III-V group nitride system semiconductor wafer
#233Microfabricated miniature grids
#234Image sensor with deep well region and method of fabricating the image sensor
#235Component built-in module and method for producing the same
#236Semiconductor device and method of manufacturing same
#237Bonded wafer processing method
#238Methods for producing a semiconductor entity
#239Controlled cleaving process
#240Method of making an integrated circuit
#241Method of manufacturing semiconductor device, plasma processing apparatus and plasma processing method
#242Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby
#243Method of manufacturing a semiconductor device
#244Method of manufacturing a semiconductor device
#245Lithography device for semiconductor circuit pattern generation
#246Bumping electronic components using transfer substrates
#247Lithographic contact elements
#248Apparatus for housing a micromechanical structure and method for producing the same
#249Image sensor with deep well region and method of fabricating the image sensor
#250Method for handling semiconductor layers in such a way as to thin same
#251Method of making multichip wafer level packages and computing systems incorporating same
#252Vertical integrated circuits
#253Method for manufacturing semiconductor device
#254Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same
#255Method of fabricating vertical structure LEDs
#256Ultrathin form factor MEMS microphones and microspeakers
#257Method of fabricating MEMS devices on a silicon wafer
#258Method for generating chip stacks
#259Flexible and elastic dielectric integrated circuit
#260Membrane 3D IC fabrication
#261Multichip wafer level packages and computing systems incorporating same
#262Stress-controlled dielectric integrated circuit
#263Chip stack package and manufacturing method thereof
#264Method for producing SOI wafer and SOI wafer
#265Light generating semiconductor device and method of making the same
#266Semiconductor device with multi-staged cut side surfaces
#267Wafer thinning using magnetic mirror plasma
#268Lead frame, semiconductor device using the same and method of producing the semiconductor device
#269Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts
#270Packaging of electronic chips with air-bridge structures
#271Semiconductor wafer and method of manufacturing a semiconductor device using a separation portion on a peripheral area of the semiconductor wafer
#272III-V group nitride system semiconductor substrate
#273Method of maintaining photolithographic precision alignment after wafer bonding process
#274Chuck for supporting wafers with a fluid
#275Method of fabricating a semiconductor device
#276Packaging method of molded wafer level chip scale package (WLCSP)