249854 ⎘
Adhesive bonding and miscellaneous chemical manufacture; Delaminating means Differential fluid pressure delaminating means
Sub-classes:Carrier plate removing method
#2Method for peeling pressure-sensitive adhesive sheet
#3Method of removing carrier plate
#4Removal method of carrier plate
#5Lining material peeling method
#6Carrier plate removing method
#7Separating device for bonded cine film and method therefor
#8Peeling apparatus
#9Method and device for dismantling multilayer systems including at least one organic component
#10Processing apparatus and processing method of stack
#11De-bonding and cleaning process and system
#12De-bonding and cleaning process and system
#13Peeling apparatus and stack manufacturing apparatus
#14Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
#15De-bonding and cleaning process and system
#16Substrate separation apparatus for stacked body
#17Handling of epoxy resins
#18Method for detaching a product substrate off a carrier substrate
#19Polarizing sheet removing tool and removing method
#20Polarizing sheet removing tool and removing method
#21Peeling apparatus and stack manufacturing apparatus
#22Device for forming separation starting point, stack manufacturing apparatus, and method for forming separation starting point
#23Thermoplastic coating and removal using bonding interface with catalytic nanoparticles
#24Device for detaching a product substrate off a carrier substrate
#25Minute convexo-concave pattern forming method and forming device, and transfer substrate producing method and transfer substrate
#26Device for detaching a product substrate off a carrier substrate
#27Systems and Methods For Ultrasonically Cleaving A Bonded Wafer Pair
#28Debonding equipment and methods for debonding temporary bonded wafers
#29Film removing device and film removing method
#30Tape for mass-sealing bottles and similar containers, and apparati for its application and removal
#31Supporting plate, apparatus and method for stripping supporting plate
#32Thermoplastic coating and removal using bonding interface with catalytic nanoparticles
#33GLASS SUBSTRATE SPACER SEPARATING SYSTEM AND GLASS SUBSTRATE FABRICATING METHOD
#34High temperature sheet handling system and methods
#35Tape for mass-sealing bottles and similar containers, and apparati for its application and removal
#36Substrate bonding apparatus
#37METHOD, SYSTEM, AND APPARATUS FOR DETACHING AND COLLECTING AN IC TAG FROM A PAPER SHEET TO WHICH IT IS ATTACHED
#38METHOD, SYSTEM, AND APPARATUS FOR DETACHING AND COLLECTING AN IC TAG FROM A PAPER SHEET TO WHICH IT IS ATTACHED
#39Replacement of a lubricant layer bonded to a part of a gas turbine engine
#40Stripping liquid for use in separating paper from plaster/paper laminate
#41Releasing method and releasing apparatus of work having adhesive tape
#42Thin film removing device and thin film removing method
#43Film removing device and film removing method
#44Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods
#45SUBSTRATE SUPPORTING PLATE
#46Device and method for cutting an assembly
#47Supporting plate, apparatus, and method for stripping supporting plate
#48Releasing method and releasing apparatus of work having adhesive tape
#49Method for releasing adhered article
#50Method, system, and apparatus for detaching and collecting an IC tag from a paper sheet to which it is attached
#51METHOD AND APPARATUS FOR PEELING A THIN FILM FROM A LINER
#52Method of transferring a substantially disc-shaped workpiece, and device for carrying out this method
#53Device and method for the detachment of a tube blank from a support core
#54Substrate supporting plate and stripping method for supporting plate
#55Apparatus and method for controlled cleaving
#56Releasing method and releasing apparatus of work having adhesive tape
#57Method and apparatus for peeling a thin film from a liner
#58Device and method for cutting an assembly
#59Method for mount tape die release system for thin die ejection