ClassID:

249854

Y10T156/1928 - CPC Classification

Classification description:

Adhesive bonding and miscellaneous chemical manufacture; Delaminating means Differential fluid pressure delaminating means

Sub-classes:
Recent Application in this class:
#1
20220028723
2022-01-27

Carrier plate removing method

#2
20210230455
2021-07-29

Method for peeling pressure-sensitive adhesive sheet

#3
20210066110
2021-03-04

Method of removing carrier plate

#4
20210060921
2021-03-04

Removal method of carrier plate

#5
20200254747
2020-08-13

Lining material peeling method

#6
20200230936
2020-07-23

Carrier plate removing method

#7
20190235388
2019-08-01

Separating device for bonded cine film and method therefor

#8
20190160804
2019-05-30

Peeling apparatus

#9
20180257267
2018-09-13

Method and device for dismantling multilayer systems including at least one organic component

#10
20170334187
2017-11-23

Processing apparatus and processing method of stack

#11
20170326866
2017-11-16

De-bonding and cleaning process and system

#12
20170036433
2017-02-09

De-bonding and cleaning process and system

#13
20160361913
2016-12-15

Peeling apparatus and stack manufacturing apparatus

#14
20160207732
2016-07-21

Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same

#15
20160101613
2016-04-14

De-bonding and cleaning process and system

#16
20150318200
2015-11-05

Substrate separation apparatus for stacked body

#17
20150258766
2015-09-17

Handling of epoxy resins

#18
20150251404
2015-09-10

Method for detaching a product substrate off a carrier substrate

#19
20150174782
2015-06-25

Polarizing sheet removing tool and removing method

#20
20150174779
2015-06-25

Polarizing sheet removing tool and removing method

#21
20150151531
2015-06-04

Peeling apparatus and stack manufacturing apparatus

#22
20150059986
2015-03-05

Device for forming separation starting point, stack manufacturing apparatus, and method for forming separation starting point

#23
20140034247
2014-02-06

Thermoplastic coating and removal using bonding interface with catalytic nanoparticles

#24
20130276990
2013-10-24

Device for detaching a product substrate off a carrier substrate

#25
20130207309
2013-08-15

Minute convexo-concave pattern forming method and forming device, and transfer substrate producing method and transfer substrate

#26
20130025796
2013-01-31

Device for detaching a product substrate off a carrier substrate

#27
20120247686
2012-10-04

Systems and Methods For Ultrasonically Cleaving A Bonded Wafer Pair

#28
20110253315
2011-10-20

Debonding equipment and methods for debonding temporary bonded wafers

#29
20110247659
2011-10-13

Film removing device and film removing method

#30
20110210093
2011-09-01

Tape for mass-sealing bottles and similar containers, and apparati for its application and removal

#31
20110146899
2011-06-23

Supporting plate, apparatus and method for stripping supporting plate

#32
20110114260
2011-05-19

Thermoplastic coating and removal using bonding interface with catalytic nanoparticles

#33
20110053466
2011-03-03

GLASS SUBSTRATE SPACER SEPARATING SYSTEM AND GLASS SUBSTRATE FABRICATING METHOD

#34
20100104402
2010-04-29

High temperature sheet handling system and methods

#35
20090184085
2009-07-23

Tape for mass-sealing bottles and similar containers, and apparati for its application and removal

#36
20090114348
2009-05-07

Substrate bonding apparatus

#37
20090072976
2009-03-19

METHOD, SYSTEM, AND APPARATUS FOR DETACHING AND COLLECTING AN IC TAG FROM A PAPER SHEET TO WHICH IT IS ATTACHED

#38
20090066514
2009-03-12

METHOD, SYSTEM, AND APPARATUS FOR DETACHING AND COLLECTING AN IC TAG FROM A PAPER SHEET TO WHICH IT IS ATTACHED

#39
20090038739
2009-02-12

Replacement of a lubricant layer bonded to a part of a gas turbine engine

#40
20090032187
2009-02-05

Stripping liquid for use in separating paper from plaster/paper laminate

#41
20080230183
2008-09-25

Releasing method and releasing apparatus of work having adhesive tape

#42
20080105377
2008-05-08

Thin film removing device and thin film removing method

#43
20080041523
2008-02-21

Film removing device and film removing method

#44
20080023133
2008-01-31

Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods

#45
20070151674
2007-07-05

SUBSTRATE SUPPORTING PLATE

#46
20070148915
2007-06-28

Device and method for cutting an assembly

#47
20070062644
2007-03-22

Supporting plate, apparatus, and method for stripping supporting plate

#48
20070034331
2007-02-15

Releasing method and releasing apparatus of work having adhesive tape

#49
20060144515
2006-07-06

Method for releasing adhered article

#50
20060125636
2006-06-15

Method, system, and apparatus for detaching and collecting an IC tag from a paper sheet to which it is attached

#51
20060102281
2006-05-18

METHOD AND APPARATUS FOR PEELING A THIN FILM FROM A LINER

#52
20060081339
2006-04-20

Method of transferring a substantially disc-shaped workpiece, and device for carrying out this method

#53
20050230044
2005-10-20

Device and method for the detachment of a tube blank from a support core

#54
20050173064
2005-08-11

Substrate supporting plate and stripping method for supporting plate

#55
20050150597
2005-07-14

Apparatus and method for controlled cleaving

#56
20050067097
2005-03-31

Releasing method and releasing apparatus of work having adhesive tape

#57
20050039851
2005-02-24

Method and apparatus for peeling a thin film from a liner

#58
20050009297
2005-01-13

Device and method for cutting an assembly

#59
15867071
2018-08-07

Method for mount tape die release system for thin die ejection