Patents-Review.com
ClassID:

249855 ⎘

Y10T156/1933 - CPC Classification

Classification description:

Adhesive bonding and miscellaneous chemical manufacture; Delaminating means; Differential fluid pressure delaminating means Spraying delaminating means [e.g., atomizer, etc.

Sub-classes:
Recent Application in this class:
#1
20230055853
2023-02-23

Separating method, separating apparatus, and separating system

 #2
20220028723
2022-01-27

Carrier plate removing method

 #3
20210066110
2021-03-04

Method of removing carrier plate

 #4
20210060921
2021-03-04

Removal method of carrier plate

 #5
20200391399
2020-12-17

Method and apparatus for display screen shield replacement

 #6
20200230936
2020-07-23

Carrier plate removing method

 #7
20190270212
2019-09-05

Method and Apparatus for Display Screen Shield Replacement

 #8
20190198377
2019-06-27

Temporary carrier debond initiation, and associated systems and methods

 #9
20180269077
2018-09-20

Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using high pressure solvent

 #10
20180040489
2018-02-08

Device and method for at least partly dissolving a connecting layer of a temporarily bonded substrate stack

 #11
20170334187
2017-11-23

Processing apparatus and processing method of stack

 #12
20170210115
2017-07-27

Method for forming separation starting point and separation method

 #13
20160361912
2016-12-15

Masking removal system and method

 #14
20160257108
2016-09-08

Method and apparatus for processing display laminate

 #15
20160250819
2016-09-01

Display laminate formed as a continuous web

 #16
20160243812
2016-08-25

Processing apparatus and processing method of stack

 #17
20160207732
2016-07-21

Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same

 #18
20160167360
2016-06-16

Debonders with a recess and a side wall opening for semiconductor fabrication

 #19
20160167359
2016-06-16

Debonders with a recess and a heater for semiconductor fabrication

 #20
20160005637
2016-01-07

Devices for methodologies related to wafer carriers

 #21
20150258766
2015-09-17

Handling of epoxy resins

 #22
20150174782
2015-06-25

Polarizing sheet removing tool and removing method

 #23
20150174779
2015-06-25

Polarizing sheet removing tool and removing method

 #24
20150059987
2015-03-05

Processing apparatus and processing method of stack

 #25
20150059986
2015-03-05

Device for forming separation starting point, stack manufacturing apparatus, and method for forming separation starting point

 #26
20140262053
2014-09-18

Debonders and related devices and methods for semiconductor fabrication

 #27
20140130986
2014-05-15

Wafer separating apparatus and wafer separating method

 #28
20140102145
2014-04-17

Method and apparatus for display screen shield replacement

 #29
20130327484
2013-12-12

Separation method, separation apparatus, and separation system

 #30
20130011628
2013-01-10

Method and apparatus for processing display laminate

 #31
20120080832
2012-04-05

DEVICES FOR METHODOLOGIES RELATED TO WAFER CARRIERS

 #32
20110308738
2011-12-22

Die bonder, pickup method, and pickup device

 #33
20110297329
2011-12-08

Debonders and related devices and methods for semiconductor fabrication

 #34
20110132532
2011-06-09

Method and apparatus for producing combined optical film, combined optical film, image display, and methods for producing liquid crystal panel and laminated optical film

 #35
20110017407
2011-01-27

Chip sorting apparatus

 #36
20100084093
2010-04-08

Separating device and method thereof

 #37
20080173405
2008-07-24

RFID systems and graphic image fusion

 #38
20080099128
2008-05-01

Method and apparatus for producing combined optical film, combined optical film, image display, and methods for producing liquid crystal panel and laminated optical film

 #39
20060176180
2006-08-10

RFID systems and graphic image fusion