Y10T156/1972 - CPC Classification Index

#1

20250001752

2025-01-02

METHOD AND APPARATUS FOR SUBSTRATE AND SPACER SEPARATION

#2

20180254364

2018-09-06

Method of recycling solar cell module

#3

20180126719

2018-05-10

Carpet Divider System

#4

20180065356

2018-03-08

Carpet divider system

#5

20170348961

2017-12-07

Film peeling apparatus and a method of peeling film

#6

20170133243

2017-05-11

Sample holder, device and method for detaching of a first substrate

#7

20160368258

2016-12-22

Methods to dismantle hermetically sealed chambers

#8

20160354778

2016-12-08

Chips with hermetically sealed but openable chambers

#9

20150314585

2015-11-05

Methods to form and to dismantle hermetically sealed chambers

#10

20150202857

2015-07-23

Separation apparatus

#11

20150174782

2015-06-25

Polarizing sheet removing tool and removing method

#12

20150174779

2015-06-25

Polarizing sheet removing tool and removing method

#13

20150083342

2015-03-26

Method for thermal-slide debonding of temporary bonded semiconductor wafers

#14

20140154166

2014-06-05

Exfoliation of graphene by multilayer coextrusion

#15

20140076498

2014-03-20

Film peeling method and film peeling device for film-coated flat wire

#16

20140020846

2014-01-23

Separation apparatus, separation system, and separation method

#17

20140020818

2014-01-23

Systems and methods of separating bonded wafers

#18

20130327484

2013-12-12

Separation method, separation apparatus, and separation system

#19

20130269879

2013-10-17

Peeling device, peeling system and peeling method

#20

20130168027

2013-07-04

Device for separating a substrate from a carrier substrate

#21

20130146228

2013-06-13

Separation apparatus, separation system, and separation method

#22

20130048222

2013-02-28

Substrate separating apparatus, load lock apparatus, substrate bonding apparatus, substrate separating method, and manufacturing method of a semiconductor apparatus

#23

20120261076

2012-10-18

DEVICE FOR SEPARATION OF A STACKED STRUCTURE AND ASSOCIATED METHOD

#24

20120241098

2012-09-27

Device and method for separating a substrate from a carrier substrate

#25

20120103535

2012-05-03

Exfoliation of graphene by multilayer coextrusion

#26

20120080150

2012-04-05

Fixtures and methods for unbonding wafers by shear force

#27

20120048906

2012-03-01

Substrate cutting device and method

#28

20110014774

2011-01-20

Apparatus for temporary wafer bonding and debonding

#29

20110010908

2011-01-20

Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers

#30

20100266373

2010-10-21

Device for centering wafers

#31

20100263794

2010-10-21

Apparatus for mechanically debonding temporary bonded semiconductor wafers

#32

20100206479

2010-08-19

High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach

#33

20100200173

2010-08-12

Coating film peeling apparatus for resin material

#34

20100175828

2010-07-15

Flanged collet for die pick-up tool

#35

20100129658

2010-05-27

Method of detaching attached boards from each other

#36

20100084093

2010-04-08

Separating device and method thereof

#37

20090229765

2009-09-17

Automatic mask peeling apparatus

#38

20090083916

2009-04-02

Eraser assembly for a rotary tool

#39

20090065144

2009-03-12

Protective tape separation method and protective tape separation apparatus

#40

20090038758

2009-02-12

Method and installation for fracturing a composite substrate along an embrittlement plane

#41

20090000727

2009-01-01

HARDCOAT LAYERS ON RELEASE LINERS

#42

20080245483

2008-10-09

Adhesive-film exfoliating device and manufacturing method of liquid crystal display panel using the device

#43

20080225224

2008-09-18

ADHESIVE-FILM EXFOLIATING DEVICE AND MANUFACTURING METHOD OF LIQUID CRYSTAL DISPLAY PANEL USING THE DEVICE

#44

20080200011

2008-08-21

HIGH-TEMPERATURE, SPIN-ON, BONDING COMPOSITIONS FOR TEMPORARY WAFER BONDING USING SLIDING APPROACH

#45

20080156439

2008-07-03

Apparatus and method for removing a temporary substrate from an optical disk

#46

20080135175

2008-06-12

Thin plate glass laminate and process for producing display device using thin plate glass laminate

#47

20080128084

2008-06-05

Method and apparatus for optical fiber coating removal

#48

20080128076

2008-06-05

Polymer recovery method from polarizing plates and methods of producing recycled polymer films and polarizing plates

#49

20070281080

2007-12-06

Method of manufacturing disk substrate, and method and device for manufacturing optical disk

#50

20070246167

2007-10-25

Apparatus for removing a flexible floor covering from a floor

#51

20070221328

2007-09-27

Fixture and method of holding and debonding a workpiece with the fixture

#52

20070204955

2007-09-06

Floor covering lifting and removal hand tool

#53

20070148915

2007-06-28

Device and method for cutting an assembly

#54

20070119893

2007-05-31

Substrate cutting device and method

#55

20060180799

2006-08-17

Carpet removal system and method

#56

20060000556

2006-01-05

Device for removing recording material from recording medium

#57

20050224177

2005-10-13

Adhesive removal compositions and methods of using same

#58

20050224176

2005-10-13

Apparatus and method for preparing shims to be applied to brake pads

#59

20050126359

2005-06-16

Cutting assembly for removing a windshield and method relating to same

#60

20050072523

2005-04-07

Device and method for using a heating layer to replace a touch screen

#61

20050031777

2005-02-10

Method of manufacturing disk substrate, and method and device for manufacturing optical disk

#62

20050009297

2005-01-13

Device and method for cutting an assembly

#63

20050000649

2005-01-06

Substrate cutting device and method

#64

20050000647

2005-01-06

Method and facility for separating and recovering steel pipe and covering resin in resin-covered steel pipe