ClassID:

251997

Y10T428/12694 - CPC Classification

Classification description:

Stock material or miscellaneous articles; All metal or with adjacent metals; Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]; Pb- and Sn-base components: alternative to or next to each other and next to Cu- or Fe-base component

Recent Application in this class:
#1
20230072996
2023-03-09

STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER

#2
20220308705
2022-09-29

Copper-alloy capping layers for metallization in touch-panel displays

#3
20210208738
2021-07-08

Copper-alloy capping layers for metallization in touch-panel displays

#4
20180175075
2018-06-21

Thin-film transistor and method of forming an electrode of a thin-film transistor

#5
20180080135
2018-03-22

Tin-plated product and method for producing same

#6
20160374238
2016-12-22

Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable

#7
20140362307
2014-12-11

Copper-alloy capping layers for metallization in touch-panel displays

#8
20130212866
2013-08-22

Method for forming an electrode

#9
20110196075
2011-08-11

Authenticatable articles and methods therefor

#10
20100323218
2010-12-23

Plain bearing composite material, use thereof and production methods therefor

#11
20100040901
2010-02-18

Electrode

#12
20090081471
2009-03-26

Slide bearing composite material

#13
20080145689
2008-06-19

Adhesion assisting agent fitted metal foil, and printed wiring board using thereof

#14
20080081210
2008-04-03

AUTHENTICATABLE ARTICLES AND METHODS THEREFOR

#15
20070253051
2007-11-01

Optical Device

#16
20070228333
2007-10-04

Adhesion promotion in printed circuit boards

#17
20070227625
2007-10-04

Adhesion promotion in printed circuit boards

#18
20070126096
2007-06-07

Leadframe comprising tin plating or an intermetallic layer formed therefrom

#19
20070025192
2007-02-01

Optical recording medium

#20
20070015001
2007-01-18

Copper alloy for electronic machinery and tools and method of producing the same

#21
20070009757
2007-01-11

Sintered sliding material, sliding member, connection device and device provided with sliding member

#22
20060252176
2006-11-09

Resistance variable memory element and its method of formation

#23
20050148150
2005-07-07

Memory element and its method of formation

#24
20050068617
2005-03-31

Display front plane, display lenticular lens, and display fresnel lens

#25
20050025990
2005-02-03

Tarnish deterring tin coating

#26
20050011400
2005-01-20

Adhesion promotion in printed circuit boards