251999 ⎘
Stock material or miscellaneous articles; All metal or with adjacent metals; Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] Sn-base component
Sub-classes:METHOD OF MANUFACTURING COMPOSITE METAL FOIL
#2Composite metal foil
#3Copper-phosphorus-tin brazing wire and preparation method thereof
#4Metal-coated liquid-crystal polymer film
#5STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER
#6Temperable coatings comprising diamond-like carbon
#7Copper-alloy capping layers for metallization in touch-panel displays
#8MULTI-COATED METALLIC PRODUCTS AND METHODS OF MAKING THE SAME
#9Copper-alloy capping layers for metallization in touch-panel displays
#10Hot-dip Sn—Zn-based alloy-plated steel sheet
#11Sn-plated steel sheet and method for manufacturing Sn-plated steel sheet
#12Roll-bonded laminate and method for producing the same
#13Solder material, solder paste, and solder joint
#14Tin-plated copper terminal material, terminal, and electric-wire terminal structure
#15Temperable coatings comprising diamond-like carbon
#16Steel sheet and method of manufacturing same
#17Method for producing Nb3Sn superconducting wire, precursor for Nb3Sn superconducting wire, and Nb3Sn superconducting wire using same
#18Cu core ball, solder joint, solder paste and formed solder
#19CHEMICAL TREATMENT STEEL SHEET, AND METHOD FOR PRODUCING CHEMICAL TREATMENT STEEL SHEET
#20Wiring board and method for manufacturing same
#21Steel sheet for container and method for producing steel sheet for container
#22Soldering material
#23Multi-coated metallic products and methods of making the same
#24Steel sheet for containers, and method for producing steel sheet for containers
#25Thin-film transistor and method of forming an electrode of a thin-film transistor
#26Steel sheet for container and method for producing steel sheet for container
#27Microfeature workpieces having alloyed conductive structures, and associated methods
#28Tin-plated copper-alloy terminal material
#29Chemical treatment steel sheet, and method for producing chemical treatment steel sheet
#30Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable
#31Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, and conductive component for electronic and electrical equipment, terminal
#32Gold plate coated material
#33Electric contact material for connector and method for producing same
#34Board terminal and board connector
#35Self-removal anti-stiction coating for bonding process
#36Soldering structure and process of making the same
#37Coated metallic products and methods for making the same
#38Degradable metal composites, methods of manufacture, and uses thereof
#39Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
#40Multi-coated metallic products and methods of making the same
#41Electric contact and socket for electric parts
#42Slide member, bicycle component using slide member, and fishing tackle component using slide member
#43Slide member, bicycle component using slide member, and fishing tackle component using slide member
#44Plated member and plated terminal for connector
#45Metallic material for electronic components, and connector terminals, connectors and electronic components using same
#46Tin whisker mitigation material using thin film metallic glass underlayer
#47Copper-alloy capping layers for metallization in touch-panel displays
#48Metal material for electronic component and method for manufacturing the same
#49Microfeature workpieces having alloyed conductive structures, and associated methods
#50Process for tin coating a metallic substrate, process for hardening a tin layer and wire having a tin coating
#51Method for producing a mating-type connecting part
#52Method for bonding aluminum-based metals
#53Electroconductive material for connection component
#54Use of Sn and pore size control to improve biocompatibility in polycrystalline diamond compacts
#55Junction material, manufacturing method thereof, and manufacturing method of junction structure
#56Metal-coated steel sheet
#57Steel sheet for containers
#58Steel sheet for containers and manufacturing method for same
#59ACTIVE SOLDER
#60Cold sprayed and heat treated coating for magnesium
#61Microfeature workpieces having alloyed conductive structures, and associated methods
#62Multilayered bearing shell
#63Multi-coated metallic products and methods of making the same
#64Coated metallic products and methods for making the same
#65Alloy nanoparticles of SN-CU-AG, preparation method thereof and ink or paste using the alloy nanoparticles
#66MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL VOID FORMATION IN SOLDER JOINTS
#67MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL VOID FORMATION IN SOLDER JOINTS
#68Solder, soldering method, and semiconductor device
#69Whisker-Free Coating Structure and Method for Fabricating the Same
#70Self-removal anti-stiction coating for bonding process
#71Layer System with Improved Corrosion Resistance
#72Coated article and method for manufacturing
#73FINE-GRAINED METALLIC COATINGS HAVING THE COEFFICIENT OF THERMAL EXPANSION MATCHED TO ONE OF THE SUBSTRATE
#74WEAR RESISTANT LEAD FREE ALLOY SLIDING ELEMENT METHOD OF MAKING
#75Stacked semiconductor devices and fabrication methods thereof
#76High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device
#77Coated article and method of making the same
#78Refrigeration Circuit-Forming Member
#79CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME
#80Steel sheet for container use
#81STRONG, LIGHTWEIGHT ARTICLE CONTAINING A FINE-GRAINED METALLIC LAYER
#82Solder joints with enhanced electromigration resistance
#83ELECTRIC CONTACT AND SOCKET FOR ELECTRICAL PART
#84SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE
#85TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
#86Conductive member and method for producing the same
#87MEMBER FORMED WITH COATING FILM HAVING TIN AS ITS MAIN COMPONENT, COATING FILM FORMING METHOD AND SOLDERING METHOD
#88MEMBER FORMED WITH COATING FILM HAVING TIN AS ITS MAIN COMPONENT, COATING FILM FORMING METHOD AND SOLDERING METHOD
#89HYBRID LIQUID METAL-SOLDER THERMAL INTERFACE
#90Copper alloy and electrically conductive material for connecting parts, and mating-type connecting part and method for producing the same
#91Composite solder alloy preform
#92METHOD FOR PRODUCING A CARBON NANOTUBE-, FULLERENE- AND/OR GRAPHENE-CONTAINING COATING
#93Aluminum alloy clad member adopted to heat exchanger, and core material for the same
#94CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME
#95Fine-grained metallic coatings having the coeficient of thermal expansion matched to one of the substrate
#96CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME
#97Carrier for manufacturing a printed circuit board
#98METHOD OF REDUCING THE QUANTITY OF LEAD RELEASED BY BRONZE AND/OR BRASS WATER-SYSTEM COMPONENTS INTO LIQUIDS THAT ARE INTENDED FOR HUMAN CONSUMPTION
#99Alloy, in particular for a bearing coating
#100Method for repairing cracks in structures
#101Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
#102Strong, lightweight article containing a fine-grained metallic layer
#103Plated steel sheet for cans
#104CARRIER MATERIAL FOR PRODUCING WORKPIECES
#105Lead-free solder alloy
#106Solder joint
#107JOINT WITH FIRST AND SECOND MEMBERS WITH A JOINING LAYER LOCATED THEREBETWEEN CONTAINING SN METAL AND ANOTHER METALLIC MATERIAL; METHODS FOR FORMING THE SAME
#108Pb-free solder-connected structure and electronic device
#109Pb-Free Sn-Ag-Cu-Mn Solder
#110Connector and metallic material for connector
#111Plating film and forming method thereof
#112Solder joints with enhanced electromigration resistance
#113Tin-coated aluminum material
#114PLATED MEMBER AND METHOD FOR MANUFACTURING THE SAME
#115Plated steel sheet for cans and production method thereof
#116Member formed with coating film having tin as its main component, coating film forming method and soldering method
#117Smooth surface morphology chlorate anode coating
#118Plating member
#119ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES
#120Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
#121Method of producing a material composite
#122Electrodeposited film having sliding function and coated article therewith
#123Strong, lightweight article, containing a fine-grained metallic layer
#124Whisker-free lead frames
#125Joint structure, joining method, wiring board and method for producing the same
#126Use of SN and pore size control to improve biocompatibility in polycrystalline diamond compacts
#127Composite superconductive wire-material, manufacturing method of composite superconductive wire-material, and superconductive cable
#128TIN-SILVER COATINGS
#129MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS
#130Electroconductive layer, laminate using the same, and producing processes thereof
#131Chlorine, fluorine and lithium co-doped transparent conductive films and methods for fabricating the same
#132Systems and Methods for Forming Conductive Traces on Plastic Substrates
#133Bearing for motorized fuel pump
#134Semiconductor component and method for producing a metal-semiconductor contact
#135Copper-tin-oxygen alloy plating
#136Threaded joint for steel pipes
#137Modification of solder alloy compositions to suppress interfacial void formation in solder joints
#138Crack-resistant solder joint, electronic component such as circuit substrate having the solder joint, semiconductor device, and manufacturing method of electronic component
#139Electric contact and socket for electrical part
#140Strong, lightweight article containing a fine-grained metallic layer
#141Nanoprinted device comprising metallic patterns and method of nanoprinting metallic patterns
#142Fine-Grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
#143Lead-free solder and soldered article
#144Tin-Based Plating Film and Method for Forming the Same
#145FRICTION MATERIALS CONTAINING TIN OXIDES
#146Electronic component having tin rich deposit layer and the process for depositing the same
#147Solder, and mounted components using the same
#148Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
#149Reducing formation of tin whiskers on a tin plating layer
#150Electronic device with lead-free metal thin film formed on the surface thereof
#151Plating film and forming method thereof
#152Joining method, method of mounting semiconductor package using the same, and substrate-joining structure prepared by the joining method
#153Tin-silver coatings
#154Smooth surface morphology chlorate anode coating
#155Leadframe comprising tin plating or an intermetallic layer formed therefrom
#156High-temperature solder, high-temperature solder paste and power semiconductor using same
#157SOLDER COMPOSITION AND SOLDERING STRUCTURE
#158Multilayered printed wiring board and manufacturing method thereof
#159Copper-tin-oxygen alloy plating
#160Grid array package using tin/silver columns
#161Microfeature workpieces having alloyed conductive structures, and associated methods
#162Alloy, in particular for a bearing coating
#163Ternary alloy column grid array
#164Plain bearing composite material comprising a sputtered bearing coating
#165Corrosion-resistant fuel tank
#166Lead-free solder and soldered article
#167Tin-plated product and method for producing same
#168Low friction electrical contacts
#169Precursor for fabricating Nb3Sn superconducting wire, and Nb3Sn superconducting wire and method for fabricating same
#170Sports articles formed using nanostructured materials
#171Strong, lightweight article containing a fine-grained metallic layer
#172Brazing product and method of its manufacture
#173Pb-free solder-connected structure and electronic device
#174Electrical contact
#175Lead-free solder, and a lead-free joint
#176Metal plating coating film having sliding function and article coated therewith
#177Whisker free tin plated layer
#178Electroplated metals with silvery-white appearance and method of making
#179Tin-plated product
#180Electroplated metals with silvery-white appearance and method of making
#181Whisker-free lead frames
#182Solder foil, semiconductor device and electronic device
#183Material composite and method of producing the composite
#184Tin plating
#185Tin-coated printed circuit boards with low tendency to whisker formation
#186Reduction of surface oxidation during electroplating
#187Tin plating method
#188Immersion plating and plated structures
#189Plated automotive part and method
#190Copper-tin-oxygen alloy plating
#191Pyrophosphoric acid bath for use in copper-tin alloy plating
#192Tin-silver coatings
#193Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the same
#194Metallic separator for fuel cell and manufacturing method therefor
#195Lead-free solder composition for substrates
#196Electronic component and method of manufacturing the same
#197Method for forming plating film
#198Tarnish deterring tin coating
#199Anode and battery using it