252000 ⎘
Stock material or miscellaneous articles; All metal or with adjacent metals; Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]; Sn-base component Next to Group IB metal-base component
METHOD OF MANUFACTURING COMPOSITE METAL FOIL
#2Composite metal foil
#3Copper-phosphorus-tin brazing wire and preparation method thereof
#4Electrical connector
#5Metal-coated liquid-crystal polymer film
#6STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER
#7Lead-free solder composition
#8Copper-alloy capping layers for metallization in touch-panel displays
#9Sliding member
#10Copper-alloy capping layers for metallization in touch-panel displays
#11Hot-dip Sn—Zn-based alloy-plated steel sheet
#12Roll-bonded laminate and method for producing the same
#13Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium
#14Tin-plated copper terminal material, terminal, and electric-wire terminal structure
#15Tin-plated product and method for producing same
#16Wire material for canted coil spring and canted coil spring
#17Cu core ball, solder joint, solder paste and formed solder
#18Terminal material for connectors and method for producing same
#19Wiring board and method for manufacturing same
#20COPPER ALLOY SHEET WITH SN COATING LAYER FOR A FITTING TYPE CONNECTION TERMINAL AND A FITTING TYPE CONNECTION TERMINAL
#21Steel sheet for container and method for producing steel sheet for container
#22Soldering material
#23Thin-film transistor and method of forming an electrode of a thin-film transistor
#24Steel sheet for container and method for producing steel sheet for container
#25Multi-layer preform sheet
#26Tin-plated copper-alloy terminal material
#27Copper-titanium alloy foil having plated layer
#28Electrical contact material, method of producing an electrical contact material, and terminal
#29Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable
#30Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, and conductive component for electronic and electrical equipment, terminal
#31Gold plate coated material
#32Board terminal and board connector
#33Soldering structure and process of making the same
#34Copper alloy for electric and electronic device, copper alloy sheet for electric and electronic device, conductive component for electric and electronic device, and terminal
#35Copper alloy for electric and electronic device, copper alloy sheet for electric and electronic device, conductive component for electric and electronic device, and terminal
#36Enhanced techniques for production of golden bronze by inter-diffusion of tin and copper under controlled conditions
#37Electronic component metal material and method for manufacturing the same
#38Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
#39Oxidation-resistant elongate electrically conductive element
#40Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
#41Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
#42Electric contact and socket for electric parts
#43Slide member, bicycle component using slide member, and fishing tackle component using slide member
#44Plated member and plated terminal for connector
#45Metallic material for electronic components, and connector terminals, connectors and electronic components using same
#46Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium
#47Tin whisker mitigation material using thin film metallic glass underlayer
#48Copper-alloy capping layers for metallization in touch-panel displays
#49Composite wire and contact element
#50Metal material for electronic component and method for manufacturing the same
#51Electroconductive material superior in resistance to fretting corrosion for connection component
#52Corrosion resistant barrier formed by vapor phase tin reflow
#53Tin-plated copper-alloy material for terminal having excellent insertion/extraction performance
#54Sn-coated copper alloy strip having excellent heat resistance
#55Method for producing a mating-type connecting part
#56Corrosion resistant electrical conductor
#57Bearing part and thermal spray method
#58Zinc-free spray powder, copper-containing thermal spray layer, as well as method of manufacturing a copper-containing thermal spray layer
#59Electroconductive material for connection component
#60Use of Sn and pore size control to improve biocompatibility in polycrystalline diamond compacts
#61High temperature resistant silver coated substrates
#62Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device
#63Electronic component
#64Corrosion resistant electrical conductor
#65Reflow Sn plated material
#66Alloy nanoparticles of SN-CU-AG, preparation method thereof and ink or paste using the alloy nanoparticles
#67Tin-containing alloy plating bath, electroplating method using same, and substrate with the electroplating deposited thereon
#68Tin-silver bonding and method thereof
#69Layer System with Improved Corrosion Resistance
#70Connector terminal
#71WEAR RESISTANT LEAD FREE ALLOY SLIDING ELEMENT METHOD OF MAKING
#72Precursor for Nb3Sn superconductor wire, superconductor wire using the same and method for manufacturing Nb3Sn superconductor wire
#73Coated article and method of making the same
#74SLIDE MEMBER
#75MEMBER FORMED WITH COATING FILM HAVING TIN AS ITS MAIN COMPONENT, COATING FILM FORMING METHOD AND SOLDERING METHOD
#76MEMBER FORMED WITH COATING FILM HAVING TIN AS ITS MAIN COMPONENT, COATING FILM FORMING METHOD AND SOLDERING METHOD
#77Copper alloy and electrically conductive material for connecting parts, and mating-type connecting part and method for producing the same
#78Composite solder alloy preform
#79COPPER-TIN ALLOY, COMPOSITE MATERIAL AND USE THEREOF
#80LAMINATE FOR PRINTED CIRCUIT BOARD
#81LEAD-FREE TIN PLATED MEMBER AND METHOD OF FORMING PLATING LAYER
#82Immersion tin silver plating in electronics manufacture
#83Metallic material for a connecting part and a method of producing the same
#84PLATING STRUCTURE AND METHOD FOR MANUFACTURING ELECTRIC MATERIAL
#85Terminal for connector and method of producing the same
#86METALLIC MATERIAL FOR A CONNECTOR AND METHOD OF PRODUCING THE SAME
#87INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING
#88Conductive material for connecting part and method for manufacturing the conductive material
#89Surface-treated steel sheet and resin-coated steel sheet
#90Sn-plated copper or Sn-plated copper alloy having excellent heat resistance and manufacturing method thereof
#91JOINT WITH FIRST AND SECOND MEMBERS WITH A JOINING LAYER LOCATED THEREBETWEEN CONTAINING SN METAL AND ANOTHER METALLIC MATERIAL; METHODS FOR FORMING THE SAME
#92Pb-free solder-connected structure and electronic device
#93FLATTED MATERIAL
#94Connector and metallic material for connector
#95TIN-SILVER BONDING AND METHOD THEREOF
#96Plain bearing
#97Airtightly sealing cap, electronic component storing package and method for manufacturing electronic component storing package
#98Member formed with coating film having tin as its main component, coating film forming method and soldering method
#99Barrier film for flexible copper substrate and sputtering target for forming barrier film
#100ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES
#101Methods for inhibiting tin whisker growth using abrasive powder coatings
#102SLIDING BEARING
#103Structure and Method for Reliable Solder Joints
#104Whisker-free lead frames
#105Joint structure, joining method, wiring board and method for producing the same
#106Use of SN and pore size control to improve biocompatibility in polycrystalline diamond compacts
#107Cu-Zn alloy strip superior in thermal peel resistance of Sn plating and Sn plating strip thereof
#108Plated flat conductor and flexible flat cable therewith
#109TIN-SILVER COATINGS
#110MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS
#111Sn-Plated Cu-Ni-Si Alloy Strip
#112Lead-free solder alloy and electoronic component using this lead-free solder alloy
#113Sn-plated copper alloy strip having improved fatigue characteristics
#114Heat-resistant Sn-plated Cu-Zn alloy strip with suppressed whiskering
#115Plated material and electric and electronic parts using the plated material
#116Conductive material for a connecting part
#117Surface-treated copper foil, manufacturing method of the surface-treated copper foil, and surface-treated copper foil coated with very thin primer resin layer
#118CORROSION-RESISTANT COATED COPPER AND METHOD FOR MAKING THE SAME
#119Fretting and whisker resistant coating system and method
#120Bearing for motorized fuel pump
#121Conductive material for connecting part and method for manufacturing the conductive material
#122Lead-free solder and soldered article
#123Clad aluminum connector
#124Electronic component having tin rich deposit layer and the process for depositing the same
#125Corrosion-resistant coated copper and method for making the same
#126Electrical components including abrasive powder coatings for inhibiting tin whisker growth
#127Electronic device with lead-free metal thin film formed on the surface thereof
#128Whiskerless plated structure and plating method
#129Barrier Film For Flexible Copper Substrate And Sputtering Target For Forming Barrier Film
#130Tin-silver coatings
#131Sliding bearing element and method of producing
#132Corrosion-resistant coated copper and method for making the same
#133Metallic pattern for manufacturing prism sheet and method of manufacturing the same
#134Multilayer solder article
#135Corrosion-resistant fuel tank
#136Lead-free solder and soldered article
#137Solder joints for copper metallization having reduced interfacial voids
#138Low friction electrical contacts
#139Pb-free solder-connected structure and electronic device
#140Whisker free tin plated layer
#141Electroplated metals with silvery-white appearance and method of making
#142Tin-plated product
#143Electroplated metals with silvery-white appearance and method of making
#144Whisker-free lead frames
#145Tin plating
#146Tin-coated printed circuit boards with low tendency to whisker formation
#147Lead-free solder alloy and electronic component using this lead-free solder alloy
#148Tin-plated film and method for producing the same
#149Reduction of surface oxidation during electroplating
#150Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
#151Whisker inhibition in tin surfaces of electronic components
#152Tin plating method
#153Wired circuit board and production method thereof
#154Copper alloy material for parts of electronic and electric machinery and tools
#155Pyrophosphoric acid bath for use in copper-tin alloy plating
#156Tin-silver coatings
#157Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the same
#158Fretting and whisker resistant coating system and method
#159Electronic component and method of manufacturing the same
#160Metallic surface of a body, method for producing a structured metallic surface of a body and the use thereof
#161Method for forming plating film
#162Plated material, method of producing same, and electrical / electronic part using same
#163Tarnish deterring tin coating
#164Ceramic electronic component