Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same

Aligned nanostructure thermal interface material

Multilayer substrate including components therein

Printed circuit board

Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same

Integral wiring harness

High pressure lamination of electronic cards

Copper interconnection and the method for fabricating the same

Method of manufacturing clad board for forming circuitry, clad board and core board for clad board

Copper foil for high-density ultra-fine printed wiring board

Method for processing by laser, apparatus for processing by laser, and three-dimensional structure

Printed circuit board and method for processing printed circuit board

Wired circuit board and production method thereof

Heating elements deposited on a substrate and related method

Method for producing pattern-forming body

Metal member-buried ceramics article and method of producing the same

Printed circuit board

Laminated glazing panel

Alumina insulation for coating implantable components and other microminiature devices

Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein

Conductive member and process of producing the same

Semi-suspended coplanar waveguide on a printed circuit board

Dielectric composition for forming dielectric layer for use in circuitized substrates

Wiring board and production method of wiring board

Electrodepositing a metal in integrated circuit applications

Plastic packaging with high heat dissipation and method for the same

Method of manufacturing laminated material for security tag

Laminate

Multilayer ceramic substrate and method for manufacture thereof

High-efficiency thermal conductive base board

Carrier substrate with a thermochromatic coating

Decorative sheet, molded article, and motor vehicle provided with the same

Methods for producing waveguides

Multi-substrate circuit assembly

Multilayer wiring board incorporating carbon fibers and glass fibers

Machine direction only oriented films

Process for producing noble-metal type fine-particle dispersion, coating liquid for forming transparent conductive layer, transparent conductive layered structure and display device

Multilayer electronic component and manufacturing method thereof

Multi-layer ceramic substrate and manufacturing method thereof

Method for manufacturing a packaging material in the form of a laminate with an electrically conductive layer formed as an antenna structure

Microelectronic device interconnects

Items made of wear resistant materials

Method for improving bonding of circuit substrates to metal and articles formed thereby

Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board

Thermoplastic resin-laminated structure, method for preparation and use thereof

Dual composition ceramic substrate for microelectronic applications

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

High dielectric constant composition and method of making same

Semiconductor chip capable of implementing wire bonding over active circuits

Metal thin-film resistance element on an insulation film

Process for producing noble-metal type fine-particle dispersion, coating liquid for forming transparent conductive layer, transparent conductive layered structure and display device

Metallization process and product produced thereby

Solid-state electric device

Methods for coating surfaces with metal and products made thereby

Wired circuit board

Method for manufacturing multi-layer printed circuit board

Microcontact printing method using imprinted nanostructure and nanostructure thereof

Etched polycarbonate films

Durable printed composite materials and associated methods

Method for producing sintered magnet and alloy for sintered magnet

Semiconductor copper bond pad surface protection

Sheet made of high molecular material and method for making same

Foil laminate credit card and method of producing foil laminate credit card with double-sided printing

Security element and method for production thereof

Process for producing a multi-layer printer wiring board

Curable polyvinyl benzyl compound and process for producing the same

Treated copper foil and circuit board

Fibre reinforced heat element

Method for forming multilayer circuit structure and base having multilayer circuit structure

Flexible printed circuit board and process for producing the same

Interlayer dielectric film, and method for forming the same and interconnection

Method of cleaning reaction chamber using substrate having catalyst layer thereon

Plate

Mold release layer transferring film and laminate film

Method for producing an integral ceramic circuit board

Nanosubstrate with conductive zone and method for its selective preparation

Optoelectronic component

High-pressure sensor element with an anti-rotation protection

Metallic coatings on silicon substrates, and methods of forming metallic coatings on silicon substrates

Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same

Method for bonding ceramic to copper, without creating a bow in the copper

Circuit substrate, electro-optic device and electronic equipment

Manufacture and method for obtaining accurately dimensioned features from a metal-containing web processed with a continuous etch process

Varnish, shaped item, electrical insulating film, laminate, flame retardant slurry and process for producing flame retardant particles and varnish

Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier

Tin-silver coatings

Wiring substrate

Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit

Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method

Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel

Carbon-containing aluminum nitride sintered body, and ceramic substrate for a semiconductor producing/examining device

Cover to a portable electronic apparatus composed of leather and/or textile

Method for fabricating semiconductor device

Organic electroluminescent device having a transparent layer

Adhesive film for circuit connection, and circuit connection structure

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

Process for manufacturing a circuit board

Plastic lead frames utilizing reel-to-reel processing

Ceramic element for a watch case and process for manufacturing this element

Printed circuits on shrink film

Apparatus and method for manufacture of multilayer metal products

Adhesive film and prepreg

Manufacture having double sided features in a metal-containing web and manufacture and method for forming same in a liquid-based etch process

Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof

Electromagnetic wave shielding sheet

Laser ablation resistant copper foil

Electrical member, electrical device, and method of manufacturing the electrical member and electrical device

Camouflage covering

Printed circuit board manufacture

Electro-optical device and electronic apparatus

Bonding structure with buffer layer and method of forming the same

Decorative sheet, molded article, motor vehicle, and production method of molded article

Tape substrate and method for fabricating the same

Method for manufacturing a sequential backplane

Formation method of metal layer on resin layer, printed wiring board, and production method thereof

Thick film conductor case compositions for LTCC tape

Printed circuit board and manufacturing method thereof

Alumina insulation for coating implantable components and other microminiature devices

Thick film conductor case compositions for LTCC tape

Multilayer printed wiring board with filled viahole structure

Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto

Decorated injection moulded product, and a method for producing the same

Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating

Method for manufacturing substrate conjugate, substrate conjugate, method for manufacturing electro-optical apparatus, and electro optical apparatus

Method of manufacturing multiple levels of automobile trim

Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate

Method for producing wiring substrate

Information recording medium and information recording method

Vehicle windshield head-up display

Electro-active device having metal-containing layer

Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using same

Peelable circuit board foil

Manufacturing method of optical device provided with resin thin film having micro-asperity pattern

Metal/ceramic bonding substrate and method for producing same

Formation of multisegmented plated through holes

Chip package with degassing holes

Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same

Dielectric ceramic composition and laminated ceramic device using the same

Plastic packaging with high heat dissipation and method for the same

Low signal loss bonding ply for multilayer circuit boards

Multilayer, oriented film capable of structuring by means of electromagnetic radiation and composed of thermoplastic polyester, for the production of selectively metallized films

Deep via seed repair using electroless plating chemistry

Method for fabricating anisotropic conductive substrate

Composite refractory metal carbide coating on a substrate and method for making thereof

Organic EL device and preparation method

Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof

Nanostructures including a metal

Base film for membrane switch and membrane switch

X-ray device component with emissive inorganic coating

Decorative article and methods of making the same

Circuit board, liquid discharge apparatus, and method of manufacturing the circuit board

Structure, method of manufacturing the same, and device using the same

Wiring board and multilayer wiring board

Method of fabricating identifiable flexible printed circuit board

Process for producing a metal layer on a substrate body, and substrate body having a metal layer

Copper paste and wiring board using the same

Use of thin SOI to inhibit relaxation of SiGe layers

Method and apparatus for fabricating a laminated fiber metal composite

Electronic devices with small functional elements supported on a carrier

Vacuum roll coated security thin film interference products with overt and/or covert patterned layers

Pattern forming method, wiring pattern forming method, electro-optical device, and electronic apparatus

Extreme ultraviolet pellicle using a thin film and supportive mesh

Ferroelectric thin film element and its manufacturing method, thin film capacitor and piezoelectric actuator using same

Circuitized substrate and method of making same

Method for making conductive circuits using powdered metals

Method of manufacturing a touch screen

Multilayer ceramic coil and motor using the same

Separating plate-composite component for producing printed circuit board components and method for producing a composite component of this type

Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layer

Circuit board design

Heat-curable resin composition

Composite dielectric, composite dielectric sheet, composite dielectric paste, metal-layered composite dielectric, wiring board and multilayer wiring board

Thick film dielectric compositions for use on aluminum nitride substrates

Pattern forming method, pattern forming apparatus, device manufacturing method, conductive film wiring, electro-optical device, and electronic apparatus

Conformable holographic labels

Dielectric ceramic composition and ceramic electronic component employing the same

Bow control in an electronic package

Microstructure array and a microlens array

Conductive sheet having conductive layer with improved adhesion and product including the same

Multi-element connector

Dual composition ceramic substrate for microelectronic applications

Method of manufacturing multilayer wiring board

Injection moulded product and a method for its manufacture

Method of bonding semiconductor devices

Method of forming a decorative motif on a component of lighting or indicating apparatus for a motor vehicle

Manufacture and assembly of structures

Lightweight circuit board with conductive constraining cores

Lightweight circuit board with conductive constraining cores

Method for producing a hybrid product composed of several wiring planes, as well as a sensor or evaluation circuit and a control device with hybrid product produced by the inventive method

Ceramic substrate

Printed wiring board and electronic apparatus

Methods for producing waveguides

Display comprising a cholesteric liquid-crystal in hardened gelatin and method for making the same

Thin film solar cell electrical contacts

Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs

Laminate, a substrate with wires, an organic EL display element, a connection terminal for the organic EL display element and a method for producing each

Ceramic substrate

Hillock-free aluminum layer and method of forming the same

Method and structure for small pitch z-axis electrical interconnections

Interlayer dielectric and pre-applied die attach adhesive materials

Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof

Plated via interposer

Lubricant sheet for drilling and method of drilling