Electromagnetic-wave shielding and light transmitting plate, manufacturing method thereof, and display panel

Hue variable retroreflective sheet

Liquid-crystalline polyester and solution composition comprising the same

Method for manufacturing multilayer wiring board incorporating carbon fibers and glass fibers

High-speed routing composite material

Hybrid multilayer substrate and method for manufacturing the same

Mask for exposure

Method of manufacturing a circuit board

Glass material for radio-frequency applications

Closing mechanism comprising a heating means, and method for producing one such closing mechanism

Method for manufacturing a multilayer flexible wiring board

Printed circuit board and method of manufacturing semiconductor package using the same

Non-metallic article and a method for making the same

Ultrathin copper foil with carrier and printed circuit board using same

ORGANIC TRI-STABLE DEVICE AND METHOD FOR MANUFACTURING THE SAME

Labeling with thermally conductive pads

Wiring substrate

Semi-suspended coplanar waveguide on a printed circuit board

Zinc oxide nanotip and fabricating method thereof

Tin-silver coatings

Semiconductor wafer substrate for power semiconductor components and method for producing the same

PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PREPARING METHOD THEREOF

Method of making a substrate using laser assisted metallization and patterning with electroless plating without electrolytic plating

Decorative molded body, key top for a pushbutton switch, and key sheet for the pushbutton switch

Low temperature bumping process

Printed circuit board and method of manufacturing the same

JET PRINTING OF PATTERNED METAL

Electromagnetic wave shielding material, method of manufacturing the same and electromagnetic wave shielding material for plasma display panel

Noncontract IC tag with non-conductive metal film

Flexible circuit film and display panel assembly having the same

Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures

Surface processing agent for tin or tin alloy material

Wired circuit board

Angular encapsulation of tandem stacked printed circuit boards

Aromatic liquid-crystalline polyester film and metal laminated article

Bonding structure with buffer layer and method of forming the same

Bond pad for low K dielectric materials and method for manufacture for semiconductor devices

Method of manufacturing a touch screen

Circuit substrate and manufacturing method thereof

Multilayer circuit board and method for manufacturing the same

Optical article having anti-theft feature and a system and method for inhibiting theft of same

Adhesive compositions for flexible circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof

Security element for documents in general and particularly for banknotes, security cards and the like

Laminated circuit board

Silver alloy, sputtering target material thereof, and thin film thereof

Layer forming method, layer forming apparatus, workpiece processing apparatus, interconnect forming method, and substrate interconnect structure

Perovskite ceramic powder and electronic component using same and manufacturing methods thereof

Method for plating printed circuit board and printed circuit board manufactured therefrom

Perovskite ceramic powder and electronic component using same and manufacturing methods thereof

Multilayered printed wiring board and manufacturing method thereof

Resin product, production method for the same, and deposition method for a metallic coating

Patterned transfer of metallic elements using photo-degradable polymer templates

Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape

Method of patterning molecules on a substrate using a micro-contact printing process

Low κ dielectric inorganic/organic hybrid films and method of making

Two-layer flexible printed wiring board and method for manufacturing the two-layer flexible printed wiring board

Wired circuit board

Reducing thermal expansion effects in semiconductor packages

Data carrier having identifiers

Circuit board

PROCESS FOR PRODUCING A STRUCTURED METAL LAYER ON A SUBSTRATE BODY

Electrically conductive paste and multilayer ceramic substrate

Circuit board and method of manufacturing circuit board

Substrate for flexible printed wiring board and method for manufacturing the same

Nanocrystal structures

Printed wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing the same

Porous insulating film and its laminates

Insulated conductive particles and anisotropic conductive adhesive film containing the particles

Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer

Tantalum carbide, method for producing tantalum carbide, tantalum carbide wiring and tantalum carbide electrode

Printed wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing the same

Metal duplex method

Multi-layer ceramic substrate and manufacturing method thereof

Metal duplex method

Method for manufacturing printed wiring board

Printed wiring board and method for manufacturing the same

LAMINATED CIRCUIT BOARD

Polyimide film and use thereof

Tape substrate having reinforcement layer for tape packages

Interior lining or covering element for motor vehicles

Laminate, a substrate with wiring, an organic EL display element, a connection terminal for an organic EL display element and a method for producing each

Wiring circuit board

Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board

Method And Device For Enhancing Solderability

Microfabrication using replicated patterned topography and self-assembled monolayers

Transparent conductive layer forming method, transparent conductive layer formed by the method, and material comprising the layer

Coating composition for adhering metallized layers to polymeric films

Method of producing a wiring board

Low temperature fired, lead-free thick film heating element

Soldering work piece, soldering method and heat exchanger

Photomask blank, photomask and fabrication method thereof

Apparatus, mold, and method for manufacturing metal-ceramic composite member

Method of manufacturing wiring substrate, and wiring substrate

Method and system for creating fine lines using ink jet technology

Method of manufacturing a semiconductor wafer device having separated conductive patterns in peripheral area

Layered board and electronic apparatus having the layered board

Electron-beam treated CDO films

Image transfer sheet

Electron-beam treated CDO films

Selective activation of aluminum, copper, and tungsten structures

Porous ceramic heating element and method of manufacturing thereof

Wiring board

Panel arrangement for an interior lining of a passenger cabin in an aircraft

Wiring substrate

Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto

Heat spreader for use with light emitting diode

APPLYING A DISCONTINUOUS THIN LAYER ON A SUBSTRATE

Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board

Wiring board and method for manufacturing the same

Laminated structure, donor substrate, and method for fabricating laminated structure

Wiring substrate and bonding pad composition

Wiring substrate

Method for manufacturing a midplane

Forming a conductive pattern on a substrate

Wired circuit board and production method thereof

Copper conducting wire structure and fabricating method thereof

Peelable circuit board foil

Solder joints for copper metallization having reduced interfacial voids

Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization

Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same

Printed circuit board structure and manufacturing method thereof

Probe pad structure in a ceramic space transformer

Security element, such as a thread, strip and the like, for security documents

Conductive sheet having conductive layer with improved adhesion and product including the same

Method of manufacturing a film printed circuit board

Conductive barrier layer, especially an alloy of ruthenium and tantalum and sputter deposition thereof

Anisotropic electrically conductive film and method of producing the same

Oxide porcelain composition, ceramic multilayer substrate, and ceramic electronic component

Optical recording medium

Memory device that utilizes organic layer with a compound that can photoisomerize between conductive layers; at least one of which is light transmitting

Printed circuit board

Bow control in an electronic package

Method for producing circuit-forming board and material for producing circuit-forming board

Dielectric films and materials therefor

Method for improving the thermal cycled adhesion of thick-film conductors on dielectric

Methods for making laminated member for circuit board, making circuit board and laminating flexible film

Integrated electronic component

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Etched dielectric film in microfluidic devices

Ceramic multilayer component, method for the production thereof and retaining device

Tape-cast sensors and method of making

Method for reduction of islanding in metal layers formed on dielectric materials

Discharging solution, method for producing patterns and method for producing for producing an electronic device using the discharging solution, and electronic device

Layered structure with printed elements

Semiconductor chip capable of implementing wire bonding over active circuits

Imprinting mold for printed circuit board having excellent durability and method of manufacturing printed circuit board using the same

Multilayer wiring board and its manufacturing method

Wiring board and circuit apparatus

Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof

Circuit board and production method therefor

Electrical-energy-storage unit (EESU) utilizing ceramic and integrated-circuit technologies for replacement of electrochemical batteries

Laminate

Circuit device

Electrical connector structure of circuit board and method for fabricating the same

Shielding base member manufacturing method

Method of manufacture of ceramic composite wiring structures for semiconductor devices

Ceramic circuit substrate and manufacturing method thereof

Electrically stable copper filled electrically conductive adhesive

Optoelectronic component

Method of manufacturing a wiring substrate

Metallized cutlery and tableware and method therefor

Fabrication of parascan tunable dielectric chips

Thermally conductive resin sheet and power module using the same

Electronic apparatus including printed circuit board

Multilayered construction for resistor and capacitor formation

Antimicrobial fluoropolymer film, laminates and articles and process for making thereof

Solid electrolytic capacitor and method for producing the same

Laminate for forming a substrate with wires, substrate with wires and methods for producing them

Magnetically directed self-assembly of molecular electronic junctions comprising conductively coated ferromagnetic microparticles

Layered board and manufacturing method of the same, electronic apparatus having the layered board

Optimized multi-layer printing of electronics and displays

Semi-conducting resin composition, and wired circuit board

Data carrier with a module with a reinforcement strip

Multilayer printed wiring board with filled viahole structure

Material with pattern surface for use as template and process for producing the same

Aluminum nitride conjugate body and method of producing the same

Identification code drawing method, substrate, display module, and electronic apparatus

Functional layer having wiring connected to electrode and barrier metal between electrode and wiring

Process and ink for making electronic devices

Composite copper foil, method of production thereof and high frequency transmission circuit using said composite copper foil

Layered board and manufacturing method of the same, electronic apparatus having the layered board

Flux for soldering and circuit board

Interlaminar structure for security element

Printed circuits on shrink film

Printed circuit board and camera module

Oxygen doped firing of barium titanate on copper foil

Circuit substrate material, circuits comprising the same, and method of manufacture thereof

Chemical etching of polycarbonate films and related applications

Manufacturing method of a multi-layered circuit board

Laminated decorative strip and method for producing a laminated decorative strip

Method for producing a rewiring printed circuit board

Method of fabricating printed circuit board having thin core layer

Parallel multilayer printed circuit board having interlayer conductivity due to via ports and method of fabricating same

Selectively growing a polymeric material on a semiconductor substrate

Electronic part and manufacturing method thereof

Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same

Electromagnetic wave shield material and process for producing the same

Method for fabricating a laminated fiber metal composite

Printed circuit board and method of manufacturing the same

Flexible sheet for resistive touch screen

Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same

Electronic component module having electronic component with piezoelectric device

Wired circuit board

Wiring board and method for producing same

Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity

Optical element with an opaque chrome coating having an aperture and method of making same

Surface treated copper foil and circuit board

Plating substrate, electroless plating method, and circuit forming method using the same

Opaque chrome coating having increased resistance to pinhole formation

Opaque chrome coating suitable for etching

Solvent-free polyimide silicone resin composition and a resin film composed of the same

Thick film dielectric compositions for use on aluminum nitride substrates

Counterfeit-proof metallic foil

Wiring apparatus, protecting cap for device package using the same, and a method for manufacturing them

Printed circuit board and method of manufacturing the same

Bonding structure of device packaging

Transfer sheet and wiring board using the same, and method of manufacturing the same

Wireless information recording medium

HDD suspension and its manufacture

Metallized polyamideimide film for substrate and production method thereof

Metallized polyimide film for substrate and production method thereof

Low temperature polyimide adhesive compositions and methods relating thereto

Low temperature polyimide adhesive compositions and methods relating thereto

Polyimide film and polyimide composite sheet

Deep via seed repair using electroless plating chemistry

Printed circuit board having colored outer layer

Fuse applications of reactive composite structures

Film carrier tape for mounting electronic devices thereon and flexible substrate

Plating apparatus, plating method and multilayer printed circuit board

Circuit board and a power module employing the same

Film forming method, electronic device and electronic apparatus

Bonded lightweight structural sheet

Printed circuit board material for embedded passive devices

Transparent polymeric coated conductor

Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer

Use of thin SOI to inhibit relaxation of SiGe layers

Electronic and opto-electronic devices fabricated from nanostructured high surface to volume ratio thin films

Multilayer substrate and manufacturing method thereof

Conductive paste multilayered board including the conductive paste and process for producing the same

Selective nickel plating of aluminum, copper, and tungsten structures

Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate

Coil part and method of producing the same

Method of manufacturing printed wiring board

Identifiable flexible printed circuit board and method of fabricating the same

Electronic parts board and method of producing the same

Method of suppressing the oxidation characteristics of nickel

EMI shielding film improving color gamut and plasma display device using the same

Film multilayer body and flexible circuity board

Anisotropic conductive adhesive for fine pitch and COG packaged LCD module

Moisture detection label, moisture detection device, moisture detection method, power shutoff method, and electronics device

Printed circuit boards and method of producing the same

Low friction and low wear polymer/polymer composites

Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein

Circuitized substrate with conductive polymer and seed material adhesion layer

Method of producing an electronic unit having a polydimethylsiloxane substrate and circuit lines

Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein

Methods for forming wiring and electrode

Microdevices having a preferential axis of magnetization and uses thereof

Jet printing of patterned metal

Films

Process

Method for forming highly conductive metal pattern on flexible substrate and EMI filter using metal pattern formed by the method

Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof

Patch antenna utilizing a polymer dielectric layer

Stacked via-stud with improved reliability in copper metallurgy

Method for realizing a sensor device able to detect chemical substances and sensor device so obtained

Fabrication of sub-50 nm solid-state nanostructures based on nanolithography

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

Process for manufacturing a ceramic element for a watch case and element obtained by this process

Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin

Multilayer circuit board and method for manufacturing the same

Laser enhanced plating for forming wiring patterns

Adhesive film exhibiting anisotropic electrical conductivity

Multilayer ceramic device, method for manufacturing the same, and ceramic device

Semiconductor wafer device having separated conductive patterns in peripheral area and its manufacture method

Catalysts

Sheet material and wiring board

Metallic material for electric or electronic parts

Method for producing Z-axis interconnection assembly of printed wiring board elements

Magnetoresistive element and magnetic memory

Electrical insulating resin composition, and laminate for circuit board

Adhesive film exhibiting anisotropic electrical conductivity

Manufacturing method of wiring substrate and semiconductor device

Printing of organometallic compounds to form conductive traces

Methods and apparatus for fabricating gas turbine engines

Electrochemical-mechanical polishing system

Stress relief for electroplated films

Layered composite materials

Wiring substrate and method of fabricating the same

Layered board and manufacturing method of the same, electronic apparatus having the layered board

Layered board and manufacturing method of the same, electronic apparatus having the layered board

Laminated radiation member, power semiconductor apparatus, and method for producing the same

Method for synthesizing nanoscale structures in defined locations

Wired circuit board

Mixed absorber layer for displays