ClassID:

252294

Y10T428/249951 - CPC Classification

Classification description:

Stock material or miscellaneous articles; Web or sheet containing structurally defined element or component; Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity; Fiber embedded in or on the surface of a polymeric matrix; Two or more layers Including a free metal or alloy constituent

Recent Application in this class:
#1
20200269545
2020-08-27

Delamination resistant, weldable and formable light weight composites

#2
20200001574
2020-01-02

Light weight composite material systems, polymeric materials, and methods

#3
20180250914
2018-09-06

Delamination resistant, weldable and formable light weight composites

#4
20180029332
2018-02-01

Light weight composite material systems, polymeric materials, and methods

#5
20160339674
2016-11-24

Formable light weight composite material systems and methods

#6
20150328864
2015-11-19

Delamination resistant, weldable and formable light weight composites

#7
20150290903
2015-10-15

Assembly of a metal insert and a sheet of composite material, method for incorporating such an insert into such a sheet and part obtained by molding such a sheet

#8
20140097181
2014-04-10

Freight floor, freight container, use of a multilayer panel to produce a freight floor, and method for producing a freight floor

#9
20140011006
2014-01-09

Multifunctional composite material including a viscoelastic interlayer

#10
20130136944
2013-05-30

Delamination resistant, weldable and formable light weight composites

#11
20130115442
2013-05-09

Structural adhesive and bonding application thereof

#12
20130108843
2013-05-02

Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition

#13
20130071638
2013-03-21

Overmolded composite structure for an electronic device

#14
20130065000
2013-03-14

Multilayer protective liner

#15
20120196114
2012-08-02

Flexible and Transparent Conductive Film Containing Silver Nanowires and Manufacturing Method Thereof

#16
20120174747
2012-07-12

Lightweight armor and methods of making

#17
20120107600
2012-05-03

TRANSPARENT CONDUCTIVE FILM COMPRISING CELLULOSE ESTERS

#18
20120107598
2012-05-03

Transparent conductive film comprising water soluble binders

#19
20120097431
2012-04-26

LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES

#20
20110259628
2011-10-27

Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same

#21
20110256370
2011-10-20

LAMINATE OF METAL SHEETS AND POLYMER

#22
20110255258
2011-10-20

Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board and semiconductor device

#23
20110200816
2011-08-18

Formable light weight composite material systems and methods

#24
20110083890
2011-04-14

Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device

#25
20110070793
2011-03-24

Metal/fiber laminate and fabrication using a porous metal/fiber preform

#26
20110041676
2011-02-24

Hard armor composite

#27
20100319969
2010-12-23

Lightweight circuit board with conductive constraining cores

#28
20100297422
2010-11-25

Powder coating compositions having a substantially non-zinc containing primer

#29
20100266867
2010-10-21

Laminate of metal sheets and polymer

#30
20100143648
2010-06-10

FIBER-REINFORCED POLYMERIC CASING AND METHOD FOR MANUFACTURING THE SAME

#31
20100096257
2010-04-22

Self-healing and adaptive shaped articles

#32
20100044081
2010-02-25

Laminated body, method of manufacturing substrate, substrate, and semiconductor device

#33
20090260512
2009-10-22

Hard armor composite

#34
20090218537
2009-09-03

Adaptive composite materials

#35
20090022975
2009-01-22

Metal/fiber laminate and fabrication using a porous metal/fiber preform

#36
20080302558
2008-12-11

Prepreg, metal-clad laminate and printed circuit board using same

#37
20080283186
2008-11-20

Method and apparatus for EMI shielding

#38
20080255306
2008-10-16

Laminate made from epoxy resin, styrene-maleic anhydride copolymer and crosslinkers

#39
20080254274
2008-10-16

Polymer composite structure reinforced with shape memory alloy and method of manufacturing same

#40
20080124564
2008-05-29

Workpiece boring/cutting operation aiding plate material and molding making use of the same

#41
20080011429
2008-01-17

SEATING SYSTEM AND METHOD OF FORMING SAME

#42
20080006145
2008-01-10

Hard armor composite

#43
20070292668
2007-12-20

Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof

#44
20070287021
2007-12-13

Prepreg, metal-clad laminate and printed circuit board using same

#45
20070275250
2007-11-29

Epoxy resin, styrene-maleic anhydride copolymer and crosslinking agent

#46
20070224408
2007-09-27

Resin molded article and production method thereof

#47
20060286348
2006-12-21

Object

#48
20060147690
2006-07-06

Metallic layer material, reinforced with basalt fibers, as well as products made thereof

#49
20060110588
2006-05-25

Metallic-polymeric composite materials

#50
20050215707
2005-09-29

Thermosetting resin composition for high performance laminates

#51
20050095435
2005-05-05

Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross linking agent

#52
20050070185
2005-03-31

Polymer composite structure reinforced with shape memory alloy and method of manufacturing same

#53
20050066805
2005-03-31

Hard armor composite

#54
20050064159
2005-03-24

Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof

#55
20050062365
2005-03-24

Laminate damping base material, and damping structure with stack of this base material

#56
20050019541
2005-01-27

Lightweight circuit board with conductive constraining cores

#57
20050019535
2005-01-27

Lightweight circuit board with conductive constraining cores