252294 ⎘
Stock material or miscellaneous articles; Web or sheet containing structurally defined element or component; Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity; Fiber embedded in or on the surface of a polymeric matrix; Two or more layers Including a free metal or alloy constituent
Delamination resistant, weldable and formable light weight composites
#2Light weight composite material systems, polymeric materials, and methods
#3Delamination resistant, weldable and formable light weight composites
#4Light weight composite material systems, polymeric materials, and methods
#5Formable light weight composite material systems and methods
#6Delamination resistant, weldable and formable light weight composites
#7Assembly of a metal insert and a sheet of composite material, method for incorporating such an insert into such a sheet and part obtained by molding such a sheet
#8Freight floor, freight container, use of a multilayer panel to produce a freight floor, and method for producing a freight floor
#9Multifunctional composite material including a viscoelastic interlayer
#10Delamination resistant, weldable and formable light weight composites
#11Structural adhesive and bonding application thereof
#12Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition
#13Overmolded composite structure for an electronic device
#14Multilayer protective liner
#15Flexible and Transparent Conductive Film Containing Silver Nanowires and Manufacturing Method Thereof
#16Lightweight armor and methods of making
#17TRANSPARENT CONDUCTIVE FILM COMPRISING CELLULOSE ESTERS
#18Transparent conductive film comprising water soluble binders
#19LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES
#20Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same
#21LAMINATE OF METAL SHEETS AND POLYMER
#22Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board and semiconductor device
#23Formable light weight composite material systems and methods
#24Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device
#25Metal/fiber laminate and fabrication using a porous metal/fiber preform
#26Hard armor composite
#27Lightweight circuit board with conductive constraining cores
#28Powder coating compositions having a substantially non-zinc containing primer
#29Laminate of metal sheets and polymer
#30FIBER-REINFORCED POLYMERIC CASING AND METHOD FOR MANUFACTURING THE SAME
#31Self-healing and adaptive shaped articles
#32Laminated body, method of manufacturing substrate, substrate, and semiconductor device
#33Hard armor composite
#34Adaptive composite materials
#35Metal/fiber laminate and fabrication using a porous metal/fiber preform
#36Prepreg, metal-clad laminate and printed circuit board using same
#37Method and apparatus for EMI shielding
#38Laminate made from epoxy resin, styrene-maleic anhydride copolymer and crosslinkers
#39Polymer composite structure reinforced with shape memory alloy and method of manufacturing same
#40Workpiece boring/cutting operation aiding plate material and molding making use of the same
#41SEATING SYSTEM AND METHOD OF FORMING SAME
#42Hard armor composite
#43Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof
#44Prepreg, metal-clad laminate and printed circuit board using same
#45Epoxy resin, styrene-maleic anhydride copolymer and crosslinking agent
#46Resin molded article and production method thereof
#47Object
#48Metallic layer material, reinforced with basalt fibers, as well as products made thereof
#49Metallic-polymeric composite materials
#50Thermosetting resin composition for high performance laminates
#51Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross linking agent
#52Polymer composite structure reinforced with shape memory alloy and method of manufacturing same
#53Hard armor composite
#54Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof
#55Laminate damping base material, and damping structure with stack of this base material
#56Lightweight circuit board with conductive constraining cores
#57Lightweight circuit board with conductive constraining cores