Dublin, California
United States
10
2023-08-17
The entities that hold a legal rights for patent applications filed by inventor Liu Hui:
Hui Liu from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SUBSTRATE, CHIP, CIRCUIT PACKAGE AND FABRICATION PROCESS
#2 | 2023-07-27EMBEDDED MULTI-DIE INTERCONNECT BRIDGE WITH IMPROVED POWER DELIVERY
#3 | 2022-07-21EMBEDDED MULTI-DIE INTERCONNECT BRIDGE WITH IMPROVED POWER DELIVERY
#4 | 2022-05-12EMBEDDED MULTI-DIE INTERCONNECT BRIDGE WITH IMPROVED POWER DELIVERY
#5 | 2020-03-24Package with thermoelectric power feedback loop
#6 | 2018-08-23EMBEDDED MULTI-DIE INTERCONNECT BRIDGE WITH IMPROVED POWER DELIVERY
#7 | 2018-04-03Power line layout in integrated circuits
#8 | 2017-01-17Methods and apparatus for passive equalization in high-speed and high density integrated circuits
#9 | 2015-11-10Package substrate with current flow shaping features
#10 | 2014-12-25Integrated Circuits With On-Die Decoupling Capacitors
1011922 ⎘