John Hautala

ION IMPLANTATION AND VACUUM BAKE OF EXTREME ULTRAVIOLET PHOTORESIST TO IMPROVE FINE PATTERNING PERFORMANCE

ANGLED IMPLANT FOR PATTERNING FEATURE SURFACE ROUGHNESS IMPROVEMENT

METHODS OF IMPROVING EUV PATTERNING OF CONTACT HOLES AND VIAS BY ION IMPLANT AND DIRECTIONAL DEPOSITION

LINE EDGE ROUGHNESS REDUCTION THROUGH APPLICATION OF TENSILE STRESS

ETCH BACK FOR ENHANCED DIRECTIONAL DEPOSITION

COMBINATORIAL TREATMENTS FOR EUV PATTERNED LAYERS

METHODS OF MODIFYING OPENINGS IN HARDMASKS AND PHOTORESISTS TO ACHIEVE DESIRED CRITICAL DIMENSIONS

CONCURRENT OR CYCLICAL ETCH AND DIRECTIONAL DEPOSITION

TWO STEP IMPLANT TO CONTROL TIP-TO-TIP DISTANCE BETWEEN TRENCHES

TWO STEP IMPLANT TO IMPROVE LINE EDGE ROUGHNESS AND LINE WIDTH ROUGHNESS

DEVICES AND METHODS FOR DRAM LEAKAGE REDUCTION

PATTERNING LAYER MODIFICATION USING DIRECTIONAL RADICAL RIBBON BEAM

Method for depositing layers directly adjacent uncovered vias or contact holes

Techniques for void-free material depositions

High aspect ratio taper improvement using directional deposition

TECHNIQUES AND APPARATUS FOR SELECTIVE SHAPING OF MASK FEATURES USING ANGLED BEAMS

Directional etch for improved dual deck three-dimensional NAND architecture margin

Multi process air gap formation

Techniques to engineer nanoscale patterned features using ions

Semiconductor device cavity formation using directional deposition

Wordline contact formation in NAND devices

Ion implantation to form step-oxide trench MOSFET

Techniques for void-free material depositions

Techniques and apparatus for selective shaping of mask features using angled beams

Techniques and apparatus for selective shaping of mask features using angled beams

Ribbon beam plasma enhanced chemical vapor deposition system for anisotropic deposition of thin films

Techniques to engineer nanoscale patterned features using ions

Optical component having variable depth gratings and method of formation

Device structure for forming semiconductor device having angled contacts

Extreme edge uniformity control

Performance improvement of EUV photoresist by ion implantation

FILLING A CAVITY IN A SUBSTRATE USING SPUTTERING AND DEPOSITION

DEVICE STRUCTURE AND TECHNIQUES FOR FORMING SEMICONDUCTOR DEVICE HAVING ANGLED CONDUCTORS

Method and device for power rail in a fin type field effect transistor

DIRECTIONAL DEPOSITION FOR PATTERNING THREE-DIMENSIONAL STRUCTURES

Techniques and structure for forming dynamic random-access device using angled ions

Techniques for improved spacer in nanosheet device

Optical component having variable depth gratings and method of formation

Device structure for forming semiconductor device having angled contacts

Performance improvement of EUV photoresist by ion implantation

Techniques and structure for forming thin silicon-on-insulator materials

Techniques to engineer nanoscale patterned features using ions

Techniques for manipulating patterned features using ions

Multiple patterning approach using ion implantation

Techniques for processing substrates using directional reactive ion etching

Sputter etch material selectivity

Techniques for processing a polycrystalline layer using an angled ion beam

Techniques for forming patterned features using directional ions

Extreme edge uniformity control

Composite patterning mask using angled ion beam deposition

Filling a cavity in a substrate using sputtering and deposition

Techniques for manipulating patterned features using ions

Ion-assisted deposition and implantation of photoresist to improve line edge roughness

Non-uniform gate oxide thickness for DRAM device

Ion implantation for improved contact hole critical dimension uniformity

Techniques for controlling ion/neutral ratio of a plasma source

Apparatus and techniques for filling a cavity using angled ion beam

Ion-assisted deposition and implantation of photoresist to improve line edge roughness

Techniques to engineer nanoscale patterned features using ions

Multiple exposure treatment for processing a patterning feature

Workpiece Processing Method And Apparatus

High efficiency apparatus and method for depositing a layer on a three dimensional structure

Techniques for forming angled structures for reduced defects in heteroepitaxy of semiconductor films

Techniques for processing substrates using directional reactive ion etching

Deposition of porous films for thermoelectric applications

ION IMPLANT MODIFICATION OF RESISTIVE RANDOM ACCESS MEMORY DEVICES

Method to improve a copper/dielectric interface in semiconductor devices