Applied Materials, Inc.

METHOD TO IMPROVE INTERCONNECT COEFFICIENT OF THERMAL EXPANSION

IN SITU NUCLEATION OF DIAMOND FOR THERMAL CONDUCTIVE APPLICATIONS

TITANIUM NITRIDE GAPFILL PROCESSES FOR SEMICONDUCTOR STRUCTURES

CONTACT RESISTANCE REDUCTION FOR DIRECT BACKSIDE CONTACT

PROCESSING SYSTEM FOR GENERATING ION BEAMS HAVING TUNABLE ANGLE

ABATEMENT OF EFFLUENT CONTAINING AMMONIUM CHLORIDE

SILICON-ON-INSULATOR (SOI) REPLACEMENT FOR 4F2 DRAM USING SACRIFICIAL SILICON GERMANIUM AND BOTTOM-UP DIELECTRIC

MULTI-ZONE HEATER WITH MINIMUM RF LOSS

APPARATUS AND METHOD OF FORMING A COLLOID CONTAINING LAYER

SCALABLE AND DYNAMIC MULTI-MODAL CHIP DESIGN HOTSPOT CLASSIFICATION

SYSTEMS AND METHODS FOR RINSING ELECTROPLATING ROTORS

MODULAR COAXIAL BRIDGE

RUTHENIUM SEEDING FOR CORROSION FREE MOLYBDENUM GROWTH

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

EPITAXIAL LAYER DEPOSITION FOR SEMICONDUCTOR DEVICES

METHOD OF REDUCING METAL GATE RESISTANCE FOR NEXT GENERATION NMOS DEVICE APPLICATION

ROTATED 3D DRAM CELL

IN-TRENCH QUALITY IMPROVEMENT OF SILICON-AND-OXYGEN-CONTAINING MATERIALS

Methods for Reshaping Masking Layer Openings

SELECTIVE TANTALUM NITRIDE DEPOSITION FOR BARRIER APPLICATIONS

ATOMIC LAYER DEPOSITION WITH CARBON INHIBITION PROFILE TUNING

RESONATOR COIL PITCH ADJUSTMENT SYSTEMS AND METHODS

SYSTEM AND METHOD FOR ADJUSTING AN ION BEAM

SEAM FREE MOLYBDENUM GAP FILL

WAFER PLACEMENT SENSORS FOR SUBSTRATE RINSE SYSTEM

METHOD AND APPARATUS FOR GENERATING PLASMA WITH ION BLOCKER PLATE

METHODS FOR ATOMIC LAYER DEPOSITION OF SiCO(N) USING HALOGENATED SILYLAMIDES

METHODS OF DEPOSITING SiCON WITH C, O AND N COMPOSITIONAL CONTROL

VERTICAL DEVICE FORMED BY SELF-ALIGNED SEQUENTIAL PATTERNING OF TOP TRANSISTOR AND BOTTOM TRANSISTOR

MULTI-THRESHOLD VOLTAGE INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES

LOW TEMPERATURE N-TYPE CONTACT EPI FORMATION

LINER TO FORM COMPOSITE HIGH-K DIELECTRIC

SUPPORT LAYER FOR SMALL PITCH FILL

TUNABLE IMPEDANCE MATCHING METHODS AND CIRCUITS FOR PROTECTION AGAINST SIDE-CHANNEL ATTACKS

GAS DISTRIBUTION ASSEMBLIES FOR SEMICONDUCTOR DEVICES

SYSTEM TO COLLECT, RECOVER AND RECYCLE CHEMICAL EXHAUST FROM SEMICONDUCTOR PROCESSING CHAMBERS

THIN FILM-BASED SENSOR ARRAY

LOCALIZED FILM STRESS MODULATION BY IMPLANT

RECONFIGURABLE SYSTEMS BY SHIFTING MATERIALS INSIDE A CAVITY

METHODS AND SYSTEMS FOR ARC SUPPRESSION DURING SEMICONDUCTOR FABRICATION PROCESSES

MULTI-ZONE RF FOR WAFER EDGE PLASMA PROFILE TUNING

METAL DEPOSITION FOR VOIDLESS GAP FILL

Trench Tip Squaring in Self-Aligned Multi-Patterning Process

DIE STRESS MODULATION FOR IMPROVED DEVICE LAYER STACKING

ETCH STOP LAYER FOR 3D MEMORY

APPARATUS AND TECHNIQUES FOR SUBSTRATE PROCESSING USING INDEPENDENT ION SOURCE AND RADICAL SOURCE

METHOD FOR DETERMINING WAFER UNIFORMITY

IN SITU CLEANING OF DEPOSITION CHAMBER WITH MICROWAVE PLASMA

Surface Treatment For Selective Deposition

COMPLIANT END-EFFECTOR FOR LOW-PARTICLE ATMOSPHERIC HANDLING OF WARPED WAFERS

POWER DELIVERY FOR AI COMPUTING WITH ORTHOGONAL EMBEDDING AND EDGE ACCESS

PROTECTION TREATMENTS FOR SURFACES OF SEMICONDUCTOR FABRICATION EQUIPMENT

MAGNETIC THIN FILM PROCESS CHAMBER DESIGN FOR HIGH-DENSITY POWER CONVERTERS

HALIDE-FREE CO-REACTANTS FOR RUTHENIUM FILM DEPOSITION

BOTTOM PURGE FOR SEMICONDUCTOR PROCESSING SYSTEM

FLEXIBLE HEATSINK INTERFACE

WAFER BACKSIDE DEPOSITION CLEANING

CAVITY CONTACT FORMATION USING PLASMA DOPING PROCESS

SUBSTRATE STRESS MANAGEMENT USING HIGH TEMPERATURE IMPLANTATION

RESISTIVITY-CONTROLLED DIELECTRIC MATERIALS FOR SUBSTRATE SUPPORTS WITH IMPROVED HIGH TEMPERATURE CHUCKING

HIGH HEAT LOSS HEATER AND ELECTROSTATIC CHUCK FOR SEMICONDUCTOR PROCESSING

ION IMPLANTER AND METHOD OF ION BEAM CONTROL USING ION BEAM IMAGING SYSTEM

SEMICONDUCTOR PROCESSING CHAMBER ADAPTER

SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION

MULTI-PORT CROSS FLOW SYSTEM

BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS

AMPOULE FOR A SEMICONDUCTOR MANUFACTURING PRECURSOR

LASER ABLATION OF ELECTROSTATIC CHUCKS

Cassette for Vapor Processing Chamber

INTEGRATED WET CLEAN FOR GATE STACK DEVELOPMENT

GRAIN GROWTH OF SILICON BY METAL INDUCED CRYSTALLIZATION

PHASE MEASUREMENT AND CONTROL IN LINEAR ACCLERATOR

DEPOSITION OF HALIDE-FREE METAL FILMS USING NOBLE METAL CATALYSTS

ION IMPLANTATION AND VACUUM BAKE OF EXTREME ULTRAVIOLET PHOTORESIST TO IMPROVE FINE PATTERNING PERFORMANCE

CONTROLLING TEMPERATURE UNIFORMITY OF A WAFER USING A WAFER PEDESTAL SHIELDING ELEMENT

WAFER FIXED CHARGE CONTROL IN PHYSICAL VAPOR DEPOSITION

ANGLED IMPLANT FOR PATTERNING FEATURE SURFACE ROUGHNESS IMPROVEMENT

TWO-PIECE RF SHIELD DESIGN

MULTI-STAGE MACHINE VISION TECHNIQUE FOR ANALYZING IMAGES OF OBJECTS

HYDROGEN ADDITION TO LOW-K DIELECTRIC BARRIER FILMS

METHOD OF FORMING INTERCONNECT STRUCTURE

HIGHLY-EFFECTIVE ULTRATHIN SPUTTER ABLE AND TAMPER-RESISTANT SHIELDS WITH METAL-REFRACTORY ALLOY STACKS

PLASMA TREATMENT PROCESSES FOR MICROELECTRONIC DEVICE MANUFACTURE

PLASMA TREATMENT PROCESSES FOR SELECTIVE DEPOSITION

SELECTIVE DEPOSITION OF SILICON NITRIDE

METHOD OF FORMING IMAGE SENSOR INCLUDING AIR GRID

NOTCHED SUSCEPTOR DESIGN FOR STABLE SHADOW FRAME

SELECTIVE DEPOSITION OF SILICON NITRIDE

GATE ALL AROUND BACKSIDE POWER RAIL FORMATION WITH MULTI-COLOR BACKSIDE DIELECTRIC ISOLATION SCHEME

SURFACE CONDITIONING PROCESSES FOR SEMICONDUCTOR PROCESSING CHAMBER PARTS

Modifying Openings of an Extreme Ultraviolet Masking Layer

SYSTEM AND METHOD FOR RESONATOR TUNING USING VARIABLE CAPACITOR

SUBSTRATE PROPERTY CONTROL USING DOSE-DEPENDENT RESPONSE

SCANNED BEAM DOSE RATE MEASUREMENT FOR ION BEAM OPTIMIZATION

LINE CD MODULATION AND END-TO-END CD MANIPULATION WITH ANGLED ETCH & DEPOSITION

INTEGRATED WET CLEAN FOR BEVEL TREATMENTS

SUBSTRATE POLISHING HEAD FOR OPTICAL ENHANCEMENT ANALYSIS

MASK WRITING SYSTEM, BEAM SHAPING MODULE AND METHOD OF LASER BEAM PROCESSING

SELECTIVE ETCHING OF SILICON-CONTAINING MATERIAL RELATIVE TO METAL-DOPED BORON FILMS

ANGLED ION IMPLANT TO ENABLE VOID-FREE FILLING OF HIGH ASPECT RATIO TRENCH