Inventor profile of:

Geng Han

City:

Fishkill, New York

Country:

United States

Published Applications:

21

Last publication date:

2024-12-12

Top Assignees for applications by Geng Han

The entities that hold a legal rights for patent applications filed by inventor Han Geng:

Recent patent applications by Han Geng

Geng Han from Fishkill, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-12-12
US20240413082A1
Electricity

METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS

#2 | 2023-12-07
US20230395502A1
Electricity

Metallization lines on integrated circuit products

#3 | 2022-04-07
US20220108950A1
Electricity

Metallization lines on integrated circuit products

#4 | 2020-05-21
US20200159105A1
Physics

Hybrid optical and EUV lithography

#5 | 2019-05-23
US20190155148A1
Physics

Structure design generation for fixing metal tip-to-tip across cell boundary

#6 | 2019-05-09
US20190137867A1
Physics

Structure design generation for fixing metal tip-to-tip across cell boundary

#7 | 2019-01-03
US20190006232A1
Electricity

Metallization lines on integrated circuit products

#8 | 2018-04-05
US20180096932A1
Electricity

Methods of forming metallization lines on integrated circuit products and the resulting products

#9 | 2018-03-08
US20180067391A1
Physics

Structure design generation for fixing metal tip-to-tip across cell boundary

#10 | 2017-06-15
US20170168386A1
Physics

Structure design generation for fixing metal tip-to-tip across cell boundary

#11 | 2017-01-05
US20170004233A1
Physics

Method of simultaneous lithography and etch correction flow

#12 | 2016-10-06
US20160292342A1
Physics

Predicting process fail limits

#13 | 2016-02-02
US14533629
Electricity

Patterning assist feature to mitigate reactive ion etch microloading effect

#14 | 2015-01-01
US20150007119A1
Physics

Method for adjusting target layout based on intensity of background light in etch mask layer

#15 | 2014-09-18
US20140282297A1
Physics

Method for generating post-OPC layout in consideration of top loss of etch mask layer

#16 | 2013-11-12
US13679115
-

Block mask decomposition for mitigating corner rounding

#17 | 2012-07-26
US20120192137A1
Physics

Placement and optimization of process dummy cells

#18 | 2011-11-03
US20110271238A1
Physics

Decomposition with multiple exposures in a process window based OPC flow using tolerance bands

#19 | 2010-07-08
US20100171031A1
Physics

Calibration of lithographic process models

#20 | 2009-11-26
US20090290401A1
Physics

Placement and optimization of process dummy cells

#21 | 2009-11-05
US20090276736A1
Physics

Test pattern based process model calibration

InventorID:

1025369 ⎘