Munchen
Germany
8
2017-06-15
The entities that hold a legal rights for patent applications filed by inventor Meyer-Berg Georg:
Georg Meyer-Berg from Munchen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor package with interlocked connection
#2 | 2016-06-23Method of manufacturing a semiconductor component and semiconductor component
#3 | 2015-01-15Semiconductor module with interlocked connection
#4 | 2007-10-04Ball grid array housing having a cooling foil
#5 | 2006-10-31Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same
#6 | 2006-01-19Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts
#7 | 2005-12-08Ball grid array housing having a cooling foil
#8 | 2005-05-26Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same
1033727 ⎘