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Inventor profile of:

Ho Sung CHOO

City:

Suwon

Country:

Korea (South)

Published Applications:

Last publication date:

2015-01-29

Top Assignees for applications by Ho Sung CHOO

The entities that hold a legal rights for patent applications filed by inventor CHOO Ho Sung:

SAMSUNG ELECTRO-MECHANICS CO., LTD. 2 Gyunggi-do, Korea (South)
Samsung LED Co., Ltd. 2 Gyunggi-do, Korea (South)
SAMSUNG ELECTRONICS CO., LTD. 1 Suwon-si, Korea (South)
SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Suwon, Korea (South)
SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Kyungki-do, Korea (South)
Samsung Electro-Mechanics Co., Ltd 1 , Korea (South)

Recent patent applications by CHOO Ho Sung

Ho Sung CHOO from Suwon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-01-29

US20150028912A1

Physics

BOARD FOR PROBE CARD, METHOD OF MANUFACTURING THE SAME, AND PROBE CARD

#2 | 2011-02-24

US20110043100A1

Chemistry; metallurgy

Method of forming phosphor film and method of manufacturing light emitting diode package incorporating the same

#3 | 2009-08-27

US20090214881A1

Chemistry; metallurgy

LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE HAVING DIFFUSION BARRIER LAYER AND METHOD OF MANUFACTURING THE SAME

#4 | 2009-05-28

US20090135542A1

Electricity

Glass composition, dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same

#5 | 2009-05-28

US20090133806A1

Electricity

METHOD OF MANUFACTURING DIELECTRIC SHEET AND MULTILAYER CERAMIC SUBSTRATE

#6 | 2009-05-21

US20090130473A1

Performing operations; transporting

CARRIER FILM FOR FORMING CERAMIC GREEN SHEET AND METHOD OF FABRICATING CERAMIC GREEN SHEET

#7 | 2007-11-01

US20070251066A1

Electricity

Method for manufacturing multilayer chip capacitor

#8 | 2007-09-13

US20070212802A1

Electricity

Method for manufacturing light emitting diode package

#9 | 2007-08-23

US20070196939A1

Electricity

Method of manufacturing light emitting diode package

#10 | 2007-08-23

US20070194691A1

Chemistry; metallurgy

Light emitting diode package structure having high light extraction efficiency and method of manufacturing the same

#11 | 2007-08-23

US20070194341A1

Electricity

Light emitting diode package

#12 | 2007-08-23

US20070194338A1

Electricity

Light emitting diode package

#13 | 2007-06-28

US20070148332A1

Chemistry; metallurgy

Method of forming phosphor film and method of manufacturing light emitting diode package incorporating the same

#14 | 2006-06-29

US20060139848A1

Electricity

Multilayer chip capacitor and method for manufacturing the same

InventorID:

1049166 ⎘