Andreas Schlögl

City:

Ottobrunn

Country:

Germany

Published Applications:

Last publication date:

2015-02-12

Top Assignees for applications by Andreas Schlögl

The entities that hold a legal rights for patent applications filed by inventor Schlögl Andreas:

Andreas Schlögl from Ottobrunn, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Molded semiconductor package with backside die metallization

Device for cooling surface that rotates about a rotation axis and that faces the rotation axis

Semiconductor component with enhanced avalanche ruggedness

InventorID:

1063448 ⎘